Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow.pdf - 第24页
R esults TO - 2 52 Package with no vacuum (lef t) and 5 t orr f or 60 seconds vacuum (right)

Reflow Profile 2
60 Second Dwell Under Vacuum

Results
TO-252 Package with no vacuum (left) and 5 torr for
60 seconds vacuum (right)

Results
MLF 100 Package with no vacuum (center) and 5 torr for 60
seconds vacuum (right). Note channel pattern used (left).