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early stages is also generally easier. For example, nding void defects in wafer bumps (g. 4)

before any other layers have been added, compared to a fully formed chiplet consisng of

mulple devices, substrates and interconnecon layers (g. 5). This works out well, simple

inspecon can be done with faster, more cost eecve 2D imaging and then each of these

elements are combined when proven good. At the same me, the quality of how these have

been put together can then be inspected with the faster 3D techniques. When any of these

devices are then found to have failed, more me can be jused to gain more detail and this

insight can be fed back to improve process or design.

Fig 3. Inspecon Stages

Fig 4. 100µm bump inspecon

Fig 5. 3D Integrated Die Stack

QUADRA 7 PRO – Brand new, but proven technology

During years of success with the main manual X-ray

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new core technologies with the Dual Mode X-ray tube and

the Onyx X-ray at panel detector, creang higher image

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Mode Quadra NT4® tube provides users with maximum

exibility. This innovave feature oers brightness and

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between them based on specic applicaon requirements.

The newly developed Revalution software is designed specifically for high-end semiconductor

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QUADRA PRO is taking the technology from the QUADRA SERIES, and advancing it to an even

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Nordson TEST & INSPECTION