2026 Ersa-Selective-Soldering-Product-Overview-en.pdf - 第18页
SOLDER JOI N T DETECT IO N VERS A ® EYE PC B i nspection s yst em Er sa V ER SA E Y E V ER SA E YE is a n automat ic opt ica l insp ect ion mo dule for q uality a ssu ran ce contr ol af ter se lec tiv e sol der - ing . T…

Matrix heating
The VERSAFLOW FIVE‘s matrix heating is an innovative heating system that allows the heating area
to be adjusted to the PCB size in order to increase energy efficiency.
Segmented heating surfaces:
The matrix heater consists of several segments
that can be controlled individually. This enables
targeted and homogeneous heating of assem-
blies, even on complex boards.
Flexibility in heating:
The segmented structure allows up to six differ-
ent heating areas to be mapped, enabling precise
adaptation to the specific requirements of the
printed circuit boards.
The next step toward autonomous manufacturing: VERSAFLOW FIVE for ultimate selective soldering. Highest throughput with maximum flexibility.
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SOLDER JOINT DETECTION
VERSA
®
EYE
PCB inspection
system
Ersa VERSAEYE
VERSAEYE is an automatic optical inspection module
for quality assurance control after selective solder-
ing. The evaluation is performed in ERSASOFT 5. Test
results, images, and parameters are logged for each
printed circuit board and can be transferred via
Hermes/IPC CFX.
Advantages:
Early, process-oriented detection of typical soldering
defects reduces scrap
Uniform documentation through image/data logging
supports audits and root cause analysis
Reproducible results thanks to defined lighting, precise
recording, and recipe-based evaluation
Standardized interfaces allow for seamless integration,
making quality assurance scalable and reliable
Accurate error analysis is possible with the help of the lateral cameras.
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SELECTIVE BRUSH
VERSA
®
BRUSH
Selective brush module
Ersa VERSABRUSH
VERSABRUSH is an automated brush module that
efficiently and safely removes solder balls and flux
residues from printed circuit boards. The system uses
the same axis system as the soldering modules and
can be used as an addition to VERSAFLOW soldering
systems or as a stand-alone system.
PCB before and after brushing: Flux residues and solder balls have been removed.
Advantages:
Automated cleaning: fully automatic removal of solder
balls and flux residues
Precise control: 3D movement (X-Y-Z) of the brush unit
without axial restrictions
Integrated extraction: reliable removal of dissolved
contaminants
Flexible configuration: various brush configurations for
different applications
Easy programming: intuitive program creation through
graphical programming using CAD Assistant 4
Adjustable brush pressure: adaptation to different com-
ponent contours
Proven technology: based on the axis system of the
VERSAFLOW selective soldering systems
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