2026 Ersa-Electronics-Production-Overview.pdf - 第15页
REWORK Rew or k S ystem s Au t omat ed r ewo r k pr ec is ion f or be s t r es ul ts High-precision axis system and high-resolution cameras Automated component placement, soldering and desoldering processes High-pe…
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REWORK
Rework Systems
Automated rework precision for best results
High-precision axis system and
high-resolution cameras
Automated component placement,
soldering and desoldering processes
High-performance hybrid heating
head with two heating zones
Process monitoring with Reflow
Process Camera
Powerful large-area IR bottom
heating in six zones
Three K-type thermocouple inputs
for AccuTC sensor
Effective assembly cooling
with compressed air
Optional residual solder removal
with Auto Scavenger
(also retrofittable)
Optional Dip & Print Station
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SURFACE-MOUNT TECHNOLOGY
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REWORK
residual solder removal and non-contact
temperature monitoring.
The HR 600 P is available in different
versions, e.g. with a large PCB holder
for larger assemblies or with a lowered
heating cassette for additional space for
tall structures.
HR 600 P – automated
rework precision
The HR 600 P hybrid rework system focuses
on precision and automation, as it is
particularly suitable for SMD components
with very fine grids and reliably process
-
es small SMT components and BGAs up
to a size of 60 x 60 mm. The automatic
soldering and placement processes are
supplemented by automatic, non-contact
HR 600/2
HR 600P
HR 600/2 – universal & automated
rework
With the HR 600/2 hybrid rework system,
almost all high-pin-count component
types on modern assemblies can be pro
-
cessed reliably and automatically. Lifting,
placing, and defined setting down of com
-
ponents, as well as the soldering process,
are core competencies of this universal
rework system.
HR 500
Further members of the
Rework family
Further Kurtz Ersa rework systems impress
with technologically interesting solutions
in heating and placement technology and
expand the range of options for users. The
HR 500 offers full Kurtz Ersa hybrid rework
technology for budget-oriented users. The
little brother of the HR 550 allows flexible
HR 550 XLHR 550
Further information:
repairs of standard assemblies of up to
380 x 300 mm and 50 x 50 mm component
size. For a very wide range of applications
and sufficient performance reserves, there
is the best-selling HR 550: semi-automat
-
ic rework processes in no time at all for
assemblies sizing up to 520 x 360 mm and
components of 70 x 70 mm in! The portfolio
of semi-automatic devices is rounded off
with the HR 550 XL – a real powerhouse for
large assemblies measuring up to approx.
530 x 610 mm with IR bottom heating in
eight zones, motorized x/y fine adjustment,
and component rotation. It is suitable for
industrial and power electronics as well as
large-format circuit boards
and is particularly attractive
for service providers.
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