2026 Ersa-Electronics-Production-Overview.pdf - 第36页
V acuum Soldering Sy stem f or R&D // Pilotline SRO- 700 Formic acid enriched atmosphere Direct IR h eating Multiple TC monitoring Pr oce ss t emp er atur e up t o 45 0 °C Ox y gen < 3.0 pp m wi th p ur …
Since September 1, 2025, ATV Technologie GmbH is
part of the Kurtz Ersa Group and has since been op-
erating under the name Kurtz Ersa Semicon GmbH.
They are specialized in the development and distri-
bution of high-quality vacuum soldering systems
that stand out with their precise temperature
control and excellent homogeneity—crucial for the
requirements of semiconductor and microelectronics
manufacturing. The portfolio includes customized
solutions for universities, research institutes,
laboratories, and manufacturing companies.
The SRO-i-Line is also a series-production system
that offers significant advantages for applications
in electromobility, renewable energies, and defense
thanks to its innovative infrared heating technology.
Expertise in Microelectronics
& Semiconductor Technology
Master Vacuum. Be Semicon.
Perfection in Temperature. Precision in Process.
Solutions Built Together.
SEMICONDUCTOR PROCESSING
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Vacuum Soldering System for R&D // Pilotline
SRO-700
Formic acid enriched atmosphere
Direct IR heating
Multiple TC monitoring
Process temperature up to 450 °C
Oxygen <3.0 ppm with purified N
2
BACKEND SEMICONDUCTOR PRODUCTION
SRO-716
Direct IR heating
Multiple TC monitoring
Solder paste or preform,
flux-less or flux
Exchangeable heater plate
Process temperature up to
450 °C, optional up to 750 °C
Oxygen <3.0 ppm with
purified N
2
Vacuum Soldering System for
Massproduction
SRO i-line
High capacity: up to 3 process chambers
Short cycle times
Advanced IR technology
Excellent temperature uniformity
Process temperature up to 450 °C
Oxygen <3.0 ppm with purified N
2
Small footprint: no change in footprint
for up to 3 process chambers
Low maintenance downtime: two process chambers
can operate while one is being serviced, minimizing
downtime and ensuring continuous production
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SEMICONDUCTOR
High Vacuum Packaging
with Getter Activation
SRO-Getter
High vacuum capability
Independent temperature control of lid
and package
Process temperature up to 450 °C
Package and lid separated during high
vacuum getter activation
Multiple TC monitoring
Quartz Tube Furnace
PEO-604
Max. 50 wafers per run
Up to Ø 200 mm wafers
No cross-contamination between different processes
with easily exchangeable liners
20 °C to 1,000 °C within 25 minutes (empty chamber)
Cooling from 1.000 °C to < 100 °C within 60 minutes
(empty chamber)
High vacuum down to 5 x 10-6 mbar
Oxygen <3.0 ppm with purified N
2
FRONTEND SEMICONDUCTOR PRODUCTION
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SEMICONDUCTOR PROCESSING
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