XM8000 Series Brochure EN.pdf

Me asuring the Invisible ™ www .nordson.c om/T estInspect Aut omat ed X -r ay Me trology Nor dson XM8000 TM Series

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Measuring the Invisible
™
www.nordson.com/TestInspect
Automated X-ray Metrology
Nordson XM8000
TM
Series
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Nordson TEST & INSPECTION
Making the
Invisible, Visible
Manual
X-ray Inspection
High Speed
High Resolution
X-ray
Technologies
Count On Us
TM
X-ray Component
Counting
SQ3000+
Measuring the
Invisible
Automated
X-ray Metrology
SQ3000+
High Speed
High Flexibility
Automated
X-ray Inspection
SQ3000+
Test Your
Design
Bondtesters
SQ3000+
Qualify Your
Design
Acoustic
Inspection
SQ3000+
Improve Your
Yields
Semiconductor
Metrology Sensors
Proprietary
Advanced
Technology
Optical Inspection
& Metrology
SQ3000+
SQ3000+
Exceptional support
from Nordson’s worldwide network
Founded in 1954, Nordson Corporation is a market leading
industrial technology company with annual revenues of over
$2.1 billion and more than 7,500 employees worldwide.
Nordson TEST & INSPECTION oers its SMT & Semiconductor customers a
robust product portfolio, including Acoustic, Optical and both Manual
and Automated X-ray Inspection systems, X-ray Component
Counting systems and Semiconductor measurement sensors.
Nordson TEST & INSPECTION is uniquely positioned
to serve its customers with best-in-class precision
technologies, passionate sales and support
teams, global reach, and unmatched
consultative applications expertise.
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TSV Metrology
Wafer Level Packaging
Nordson XM8000-5 measures wafer bump characterization
including voiding, presence, position, shape, size and
bridging. Unlike optical tools, XM8000-5 can measure voids
within the wafer bump.
Nordson XM8000 enables in depth analysis of all forms
of wafer level packaging. This analysis is customized for
such defects such as Cold Joints, Head in Pillow (HiP),
misalignment and missing features.
The intelligent, self learning capability of XM8000 allows
unrivaled detection of micro defects in
complex packages.
Nordson XM8000-7 delivers high throughput metrology of
TSVs. Advanced 3D techniques are used to analyze shape,
fill and voiding at sub-micron levels.
Wafer Bump Metrology
Misaligned
Cold Joint
MEMS
CIS
FPGA
Memory
RF
Photonic
Head in Pillow
Void Count
Silicon substrate
Position
Position
Presence
Profile
Position
Percentage Voiding
Layer Alignment
Fill
Size
Count, Volume
Silicon substrate
Silicon substrate
TSV
Measured Solutions