IPC7527-2012RequirementsforSolderPastePrinting.pdf - 第5页

Acknowledgment Any document involving a complex technology draws material from a vast number of sources across many continents. Shown below are the principal members of the IPC-7527 development team including the Solder …

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Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Acknowledgment
Any document involving a complex technology draws material from a vast number of sources across many continents.
Shown below are the principal members of the IPC-7527 development team including the Solder Paste Printing Task Group
Nordic (5-21JND) of the Component Mounting Subcommittee (5-21) of the Assembly and Joining Committee (5-20). It is
not possible to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC
extend their gratitude.
Assembly and Joining
Committee
Component Mounting
Subcommittee
Solder Paste Printing
Task Group Nordic
Chair
Leo P. Lambert
Chair
Peggi J. Blakley
NSWC Crane
Co-Chairs
Scott Pinney
Grundfos Management A/S
Steven Hansen
Vestas Control Systems
Technical Liaisons of the
IPC Board of Directors
Peter Bigelow
IMI Inc.
Sammy Yi
Flextronics International
Component Mounting Subcommittee
Sonic Lu, Autoliv (China) Electronics
Co., Ltd.
Claus Nielsen, BB Electronics A/S
Jens Chr. Jensen, Bent Hede
Elektronik A/S
Steven Perng, Cisco Systems Inc.
Jørgen Stenstrup, Danfoss Drives A/S
Torgrim Nordhus, EMG Norautron
AS
David Qi, Flextronics Mfg. (Zhuhai)
Co. Ltd.
Jiyang Zhang, Flextronics Mfg.
(Zhuhai) Co. Ltd.
Renie Zhao, Flextronics Mfg.
(Zhuhai) Co. Ltd.
Henning Haubo, Flextronics Special
Business Solutions
Jesper Konge, Gaasdal
Bygningsindustri A/S
Scott Pinney, Grundfos Management
A/S
Svein Olav Kolbu, Hapro AS
Jens Andersen, Hytek
Alex Christensen, Hytek
Poul Juul, Hytek
Søren Træholt, Kai Toft Elektronik
ApS
Kim Poulsen, Kamstrup A/S
Erik Andresen, Linak A/S
Allan Sigfredsen, Necas A/S
Gregers Dybdal, Linak A/S
Kathrin Morgener Jensen, Protec
Electronics ApS
Steven Hansen, Vestas Control
Systems
May 2012 IPC-7525A
iii
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Table of Contents
1 GENERAL ................................................................... 1
1.1 Scope .................................................................... 1
1.2 Purpose ................................................................. 1
1.3 Background .......................................................... 1
1.4 Terms and Definitions ......................................... 1
1.4.1 Classification ........................................................ 1
1.4.2 Disposition* ......................................................... 1
1.4.3 Slumping .............................................................. 1
1.4.4 Combined Conditions .......................................... 1
1.4.5 Designed Volume ................................................. 1
1.5 Specialized Designs ............................................. 1
1.6 Verification of Dimensions .................................. 2
1.7 Magnification Aids ............................................... 2
1.8 Lighting ................................................................ 2
2 APPLICABLE DOCUMENTS .................................... 2
2.1 IPC ....................................................................... 2
2.2 ASTM ................................................................... 2
3 CHOICE OF TECHNOLOGY .................................... 2
4 MEASUREMENT OF SOLDER PASTE
DEPOSITS
................................................................. 3
5 SHAPE OF SOLDER PASTE DEPOSIT .................. 4
5.1 Solder Paste Deposit – Misalignment ................. 4
5.1.1 Slump ................................................................... 4
5.1.2 Misregistration of Solder Paste Deposits ............ 5
5.1.3 Solder Paste Deposit – Area ............................... 7
5.1.4 Solder Paste Deposit – Height ............................ 8
Appendix A Guideline for Operator Trouble-
shooting in the Solder Paste
Screen Printing Process
....................... 9
Figures
Figure 3-1 Squeegee Blade ............................................... 2
Figure 3-2 Enclosed Paste Print Head .............................. 3
Figure 3-3 Needle Dispense .............................................. 3
Figure 3-4 Paste Jet Dispense .......................................... 3
Figure 4-1 Sample of an Automated Machine Readout .... 3
Figure 4-2 Sample of an Automated Inspection Result ..... 3
Figure 4-3 Weighing Solder Paste ..................................... 3
Figure 5-1
Full Shape ........................................................ 4
Figure 5-2
Saddle Shape ................................................... 4
Figure 5-3
Roof Top Shape ................................................ 4
Figure 5-4
Pyramid Shape ................................................. 4
Figure 5-5
Full Shape ........................................................ 4
Figure 5-6 Centered Deposit .............................................. 5
Figure 5-7 Centered Deposit .............................................. 5
Figure 5-8 Offset – Acceptable .......................................... 5
Figure 5-9 Offset – Acceptable .......................................... 5
Figure 5-10 Offset – Acceptable .......................................... 5
Figure 5-11 Offset – Acceptable .......................................... 5
Figure 5-12 Offset – Acceptable .......................................... 6
Figure 5-13 Offset – Acceptable .......................................... 6
Figure 5-14 Offset – Defect .................................................. 6
Figure 5-15 Shorting – Defect .............................................. 6
Figure 5-16 Offset – Defect .................................................. 6
Figure 5-17 Area – Target .................................................... 7
Figure 5-18 Area – Target .................................................... 7
Figure 5-19 Area – Acceptable ............................................ 7
Figure 5-20 Area – Acceptable ............................................ 7
Figure 5-21 Area – Defect ................................................... 7
Figure 5-22 Height – Target ................................................. 8
Figure 5-23 Height – Target ................................................. 8
Figure 5-24 Height – Process Indicator ............................... 8
Figure 5-25 Height – Defect ................................................. 8
Figure A-1 Solder Paste Printing with Squeegee
Blades ............................................................... 9
Figure A-2 Solder Paste Printing with Enclosed Head
System .............................................................. 9
Figure A-3 Plastic from Packaging ..................................... 9
Figure A-4 Glass Fiber from PCB .................................... 10
Figure A-5 Effect of Solder Mask ..................................... 10
Figure A-6 Effect of Silk Screen ....................................... 10
Figure A-7 Effect of Solder Paste ..................................... 10
Figure A-8 Result of Silk Screen Interference ................. 10
Figure A-9 Saddle Shape Deposit .................................... 10
Figure A-10 Roof Top Shape Paste Deposit ...................... 10
Figure A-11 Spikes on Paste Deposit ................................ 11
Figure A-12 Increased Deposit Quantity ............................ 11
Figure A-13 Decreased Quantity ........................................ 11
Figure A-14 Slumping/Smearing ......................................... 11
Figure A-15 Paste Residues .............................................. 12
Figure A-16 Long Smear .................................................... 12
Figure A-17 Offset .............................................................. 12
Figure A-18 Excess Residue Along Direction of Travel ..... 12
Figure A-19 Residue Across Direction of Travel ................ 13
Figure A-20 Solder Balls .................................................... 13
Figure A-21 Close Up of Solder Balls ................................ 13
Tables
Table 1-1 Inspection Magnification (Land Width) ................ 2
IPC-7527 May 2012
iv
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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