(TI)对半导体器件的长期存储评估.pdf - 第10页
1 1.2 SOT (Small Outline T ransistor) Package Sample batch #30: 1 1 years storage, MSL2, SOT23 DCN, lead finish : post assembly Tin (Sn) plated Figure 1 1-6. Unit After Bake 4hr/ 150°C Figure 1 1-7. Print Pattern Figure …
Figure 10-10. Reflow Oven
Figure 10-11. Substrate on
Transport Belt
Figure 10-12. Ultrasonic Flux
Cleaning
Samples from Table 5-1 were tested for solderability with a typical sample size of 9-10 units per lot. Example
images from the different packages and storage time are shown in the Section 11.1.
The package samples used for solderability testing were picked out of the tape and reel or from tubes baked for
four hours at 155°C in dry air to simulate standard J-STD-002 aging and then placed on the printed solder paste
pattern on the ceramic plate.
11 Solderability Test Results
11.1 Leadless Package
Sample batch #6: 13 years storage, MSL 3, lead finish: NiPdAu
Figure 11-1. Unit After Bake 4Hr/
150°C
Figure 11-2. Solder Paste Print
Patern
Figure 11-3. Bottom View After
Test
Figure 11-4. Side View
Figure 11-5. Cross Section
Through Thermal Pad, Showing
Intermatillic Between Base Ni
Layer on Copper and Solder
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SLPA019 – SEPTEMBER 2021
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11.2 SOT (Small Outline Transistor) Package
Sample batch #30: 11 years storage, MSL2, SOT23 DCN, lead finish: post assembly Tin (Sn) plated
Figure 11-6. Unit After Bake 4hr/
150°C
Figure 11-7. Print Pattern
Figure 11-8. Bottom View After
Test
Figure 11-9. Lead Side View After
Bake
Figure 11-10. Lead Side View After
Soldering
Sample batch #21: 17 years storage, MSL1, SOT23 DBV, lead finish: pre-plated NiPdAu
Figure 11-11. Unit After Bake 4hr/
150°C
Figure 11-12. Print Pattern
Figure 11-13. Bottom View After
Test
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Figure 11-14. Lead Side View After
Bake
Figure 11-15. Lead Side View After
Soldering
11.3 SOIC (Small Outline Integrated Circuit)
Sample batch #46: 21 years storage, MSL1, SOIC D, lead finish: pre-plated NiPdAu
Figure 11-16. Unit After Bake 4Hr/
150°C
Figure 11-17. Solder Paste Print
Pattern
Figure 11-18. Bottom View After
Test
Figure 11-19. Lead Side View After
Bake
Figure 11-20. Lead Side View After
Soldering
Figure 11-21. Lead Side View
Soldered PCB
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