(TI)对半导体器件的长期存储评估.pdf - 第6页
7 T ribocharge Evaluation – ESD T esting The measurement for the originally used tape and reel packing material was made in accordance with ANSI/ESD STM1 1.13-2018 T wo-Point Resistance Measurement. This specific type of…
Figure 6-5. Sample #47 Opened Box, MSL 1
Figure 6-6. Sample #42 Opened Box, MSL 3 Packing
Figure 6-7. Sample #10 Opened MBB, HIC,
Desiccant and Reel
Figure 6-8. Sample #10 HIC Detail View
The Humidity Identification Card (HIC) had been checked immediately after opening the MBB. No HIC samples
showed a change in the color dots indicating a change of the moisture content inside the MBB.
The functionality of the HIC samples had been checked by storing the cards at room conditions for 15 minutes
and in a 30°C/60% humidity oven for 15 minutes. The color dots from the tested HIC turned pink as expected for
the environment conditions they had been exposed to during the test. This proves that the HIC cards were still
functional after the long storage time in the MBB.
Figure 6-9. HIC Card Out of Sealed
MBB
Figure 6-10. HIC After 15 Minutes
at 30°C / 60% Rh
Figure 6-11. HIC After 15 Minutes
at Room Air Condition of 23°C/
≈30% Rh
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7 Tribocharge Evaluation – ESD Testing
The measurement for the originally used tape and reel packing material was made in accordance with
ANSI/ESD STM11.13-2018 Two-Point Resistance Measurement. This specific type of testing was used due
to the size of cover tape pockets.
Figure 7-1. Cover Tape Inside
Resistivity Measurement
Figure 7-2. Cover Tape Bottom
Figure 7-3. Cover Tape Pocket
Side Resistivity
The pocket tape (black) is in the conductive range, while the cover tape (clear) is in the dissipative range as
expected. No degradation was observable for the tested material.
A concentric ring setup was used to evaluate a large surface area of each original MBB. All bags were found to
be in the expected dissipative range.
Figure 7-4. Measurement of ESD Bag
8 Cover Tape Peel Strength Evaluation
8.1 Test Setup
A sample strip was cut from the original tape and reel and the peel force of the cover tape was measured during
the removal of the cover tape. The test is done to confirm that the cover tape adhesion did not change over the
long term storage of the reel. The peel force of the cover tape was measured within the 10 gram minimum force
and 130 gram maximum limit according industry standard EIA 481. The peeling speed of the cover tape was set
to 300 mm per minute. This test is also referenced as a peel-back test in the industry.
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Figure 8-1. Cover Tape Peel Strength Test Setup
Figure 8-2. Cover Tape Peel Strength Test
9 Cover Tape Peel Strength Measurement Results
Figure 9-1. Cover Tape Peel Strength Test Result
for 16 mm Tape. Reel #16 Manufactured September
2005
Figure 9-2. Cover Tape Peel Strength Test Result
for 8 mm Tape. Reel #20 Manufactured December
2000
10 Solderability Evaluation
10.1 Test Description
Samples from each of the selected lots were tested for solderability using the Surface Mount Process Simulation
Test (Test S1 of JEDEC standard J-STD-002E). Lead-free (SnAgCu) solder paste, with no-clean flux, was used
to reflow at ≈240°C peak package temperature in air atmosphere.
Figure 10-1 shows how solder paste printing is performed on a ceramic substrate using a manual solder stencil
fixture. The solder paste stencils are laser cut and electro polished. After printing the solder paste on the ceramic
plate substrate as shown in Figure 10-2, the substrate is fixed in a movable table under the microscope as
shown in Figure 10-3 to align the solder paste print pattern with the component leads in the holder as shown in
Figure 10-6 through an overlay optical image.
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