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113 www.nordsonefd.com/SolderVideo www.nordsonefd.com info@nordsonefd.com USA & Canada 800-556-3484 Europe 00800 7001 7001 Asia +86 (21) 3866 9006 Solder Solutions Solder Products SolderPlus Solder Paste SolderPlus …
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Solder Solutions
Paste / Flux / Thermal Compound
Nordson EFD offers proven, reliable solder paste
solutions, including:
• Clog-free solder pastes for dispensing applications
• Solder pastes for SMT print applications
• Flux pastes for repair and rework processes
Nordson EFD solder products are manufactured and
packaged in our ISO 9001:2015 certied facilities. For
optimal use, Nordson EFD’s solder pastes and ux are
packaged in our high-quality Optimum® syringe barrels and
cartridges. These packaging systems ensure consistent
solder deposits and seamless integration with most major
uid dispensing systems.
Please review the Solder Selection Guide (www.nordsonefd.
com/SolderSelectionGuide) and contact our solder
specialists to source the best solution for your soldering
process.
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Solder Solutions
Solder Products
SolderPlus Solder Paste
SolderPlus
®
dispense pastes are used where solder joints are needed but printing is
not possible, and solder wire is neither practical nor efcient.
SolderPlus dispensing paste formulations are engineered to meet your specic alloy,
ux, and special project needs. This is how Nordson EFD delivers consistent solder
paste performance.
• Available in no clean, RMA, RA, and water-soluble formulations
• Clog-free, top-to-bottom dispensing of the entire barrel
• Consistent deposit size
• Packaged in EFD’s syringe barrels for best dispensing performance
• No missed deposits
• Reliable batch-to-batch consistency
SolderPlus’s printable solder pastes are formulated for application on printed circuit
boards through stencils. The dependable performance and wide process windows
helps reduce manufacturing costs by increasing rst-pass yields and reducing defects,
rework, and rejects. Printable solder pastes are available in a wide range of lead-free
and leaded alloys and particle sizes, as well as many ux formulations, including no
clean, RMA, and water soluble with halogen- and halide-free options.
• Long stencil life
• Consistent part quality with good print denition
• Reliable batch-to-batch consistency
TOP SOLDERPLUS SOLUTIONS
Product Name Product Description
NC 21
NC 21 is optimized for dispensing applications. It is available in dispensing solder paste and
printing solder paste options with all advertised alloy options. It is also available as paste ux.
NC 23
NC 23 is optimized for printing with 24-hour print life. It is available with all advertised
alloy options.
RA 41
RA 41 is a general-purpose RA formulation. It is available in dispensing solder paste and
printing solder paste options with all advertised alloy options. It is also available as paste ux.
RMA 03
RMA 03 is optimized for printing with 24-hour print life. It is available with all advertised
alloy options.
RMA 04
RMA 04 is optimized for dispensing applications. It is available in dispensing solder paste
and printing solder paste options, with all advertised alloy options. It is also available as paste
ux.
WS 67
WS 67 is a general purpose WS formulation. It is available in dispensing solder paste and
printing solder paste options with all advertised alloy options. It is also available as paste ux.
WS 70
WS 70 is optimized for printing with 24-hour print life. It is available with all advertised
alloy options.
WS 71
WS 71 is optimized for dispensing applications. It is formulated for high activity for soldering
to stainless steel and many industrial applications.
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Solder Formulations
Solder Formulations
There are many possible options when formulating a solder paste. Nordson EFD’s
general purpose solder pastes will meet most application requirements. For special
requirements, EFD offers a range of specialized formulations. Please contact your
Nordson EFD solder sales specialist for a free consultation.
LEADED ALLOYS
Alloy: Solidus (°C) Liquidus (°C)
Sn43 Pb43 Bi14 144 163
Sn62 Pb36 Ag2 179 189
Sn63 Pb37 183E*
Sn60 Pb40 183 191
Sn10 Pb88 Ag2 268 290
Sn10 Pb90 275 302
Sn5 Pb92.5 Ag2.5 287 296
Sn5 Pb95 308 312
POWDER SIZE
Powder Type
Powder Size
(micron)
Gullwing Lead
Pitch (mm / in)
Square / Circle
Aperture (mm / in)
Dispense Dot Dia.
(mm / in)
General Purpose
Tip Gauge
Tapered Tip
Gauge
II 45−75 0.65 / 0.025 0.65 / 0.025 0.80 / 0.030 21 22
III 25−45 0.50 / 0.020 0.50 / 0.020 0.50 / 0.020 22 25
IV 20−38 0.30 / 0.012 0.30 / 0.012 0.30 / 0.012 25 27
V 15−25 0.20 / 0.008 0.15 / 0.006 0.25 / 0.010 27 –
VI 5−15 0.10 / 0.004 0.05 / 0.002 0.15 / 0.006 32 –
LEAD-FREE ALLOYS
Alloy: Solidus (°C) Liquidus (°C)
Sn42 Bi57 Ag1.0 137 139
Sn42 Bi58 138E*
Sn96.5 Ag3.0 Cu0.5 217 219
Sn96.3 Ag3.7 221E*
Sn95 Ag5 221 245
Sn100 232MP**
Sn99.3 Cu0.7 227E*
Sn95 Sb5 232 240
Sn89 Sb10.5 Cu0.5 242 262
Sn90 Sb10 243 257
Paste Features
Halide-Free
We offer a range of halide-free solder pastes that
meet environmental trends and regulations.
Rapid Reow
Our rapid reflow solder pastes will not spatter when
heated and melted by solder, iron, induction, laser,
hot bar, and other rapid reflow devices.
Pin Transfer and Dipping
Solder pastes that are applied by dipping a
component or pin into the paste.
Low Residue
The quantity of flux residue left after reflow is less
than with typical solder pastes.
Difcult-to-Solder Surfaces
Solder paste for difficult-to-wet metals such as
Alloy42 lead finishes and highly oxidized surfaces
of aged components and boards.
Gap Filling and/or Vertical Surfaces
The flux is designed to hold the alloy in place until
liquidus is reached. These formulas are suited to
bridging gaps, filling holes, and soldering joints on
vertical surfaces.
*Eutectic - Solidus and Liquidus are equal
**MP - Melting point
*Eutectic - Solidus and Liquidus are equal
**MP - Melting point