Nordson_EFD_10th_Edition_Product_Catalog.pdf - 第117页
115 www.nordsonefd.com info@nordsonefd.com USA & Canada 800-556-3484 Europe 00800 7001 7001 Asia +86 (21) 3866 9006 Solder Formulations No Clean (NC) NC ux consists of rosin, solvent, and a small amount of activator…
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Solder Formulations
Solder Formulations
There are many possible options when formulating a solder paste. Nordson EFD’s
general purpose solder pastes will meet most application requirements. For special
requirements, EFD offers a range of specialized formulations. Please contact your
Nordson EFD solder sales specialist for a free consultation.
LEADED ALLOYS
Alloy: Solidus (°C) Liquidus (°C)
Sn43 Pb43 Bi14 144 163
Sn62 Pb36 Ag2 179 189
Sn63 Pb37 183E*
Sn60 Pb40 183 191
Sn10 Pb88 Ag2 268 290
Sn10 Pb90 275 302
Sn5 Pb92.5 Ag2.5 287 296
Sn5 Pb95 308 312
POWDER SIZE
Powder Type
Powder Size
(micron)
Gullwing Lead
Pitch (mm / in)
Square / Circle
Aperture (mm / in)
Dispense Dot Dia.
(mm / in)
General Purpose
Tip Gauge
Tapered Tip
Gauge
II 45−75 0.65 / 0.025 0.65 / 0.025 0.80 / 0.030 21 22
III 25−45 0.50 / 0.020 0.50 / 0.020 0.50 / 0.020 22 25
IV 20−38 0.30 / 0.012 0.30 / 0.012 0.30 / 0.012 25 27
V 15−25 0.20 / 0.008 0.15 / 0.006 0.25 / 0.010 27 –
VI 5−15 0.10 / 0.004 0.05 / 0.002 0.15 / 0.006 32 –
LEAD-FREE ALLOYS
Alloy: Solidus (°C) Liquidus (°C)
Sn42 Bi57 Ag1.0 137 139
Sn42 Bi58 138E*
Sn96.5 Ag3.0 Cu0.5 217 219
Sn96.3 Ag3.7 221E*
Sn95 Ag5 221 245
Sn100 232MP**
Sn99.3 Cu0.7 227E*
Sn95 Sb5 232 240
Sn89 Sb10.5 Cu0.5 242 262
Sn90 Sb10 243 257
Paste Features
Halide-Free
We offer a range of halide-free solder pastes that
meet environmental trends and regulations.
Rapid Reow
Our rapid reflow solder pastes will not spatter when
heated and melted by solder, iron, induction, laser,
hot bar, and other rapid reflow devices.
Pin Transfer and Dipping
Solder pastes that are applied by dipping a
component or pin into the paste.
Low Residue
The quantity of flux residue left after reflow is less
than with typical solder pastes.
Difcult-to-Solder Surfaces
Solder paste for difficult-to-wet metals such as
Alloy42 lead finishes and highly oxidized surfaces
of aged components and boards.
Gap Filling and/or Vertical Surfaces
The flux is designed to hold the alloy in place until
liquidus is reached. These formulas are suited to
bridging gaps, filling holes, and soldering joints on
vertical surfaces.
*Eutectic - Solidus and Liquidus are equal
**MP - Melting point
*Eutectic - Solidus and Liquidus are equal
**MP - Melting point
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Solder Formulations
No Clean (NC) NC ux consists of rosin, solvent, and a small amount of activator. NC
ux typically has low-to-moderate activity and is suited to easily solderable surfaces.
IPC classication is usually ROL0 or ROL1. NC residue is clear, hard, non-corrosive,
non-conductive, and designed to be left on many types of assemblies. Residue may be
removed with an appropriate solvent. Some, but not all, NC uxes are more difcult to
remove than RMA uxes.
Rosin (R) R ux consists of rosin and solvent. Rosin ux has very low activity
and is suitable only for easy-to-solder surfaces. IPC classication is ROL0. R residue
is hard, non-corrosive, non-conductive, and may be left on. Residue may be removed
with an appropriate solvent.
Rosin Mildly Activated (RMA) RMA ux consists of rosin, solvent, and a small
amount of activator. Most RMA ux is fairly low in activity and best suited to easily
solderable surfaces. IPC classication is usually ROL0, ROL1, ROM0, or ROM1. RMA
ux residue is clear and soft. Most are non-corrosive and non-conductive. Many RMA
uxes pass SIR testing as a NC ux. Residue may be removed with an appropriate
solvent.
Rosin Activated (RA) RA ux consists of rosin, solvent, and aggressive activators.
RA ux has similar and higher activity than RMA for moderately and highly oxidized
surfaces. IPC classication is usually ROM0, ROM1, ROH0, or ROH1. In the absence
of testing to prove otherwise, RA ux residue is assumed to be corrosive. Assemblies
sensitive to corrosion or the possibility of electrical conduction through the residue
should be cleaned as soon as possible after assembly. Residue may be removed with
an appropriate solvent.
Water Soluble (WS) WS ux consists of activators, thixotrope, and solvent.
WS ux comes in a wide range of activity levels, from no activity to extremely
high activity for soldering to even the most difcult surfaces, such as stainless
steel. IPC classication normally starts with OR for organic. They come in
L, M, H activity levels and halide content of 0 or 1. By denition, residue
may be removed with water.
FLUX COMPARISON
Low Activity Medium Activity High Activity
R
RMA
NC
RA
WS
Flux Comparison chart shows relative activity ranges of each ux category. Note overlap of activity levels between ux groups.
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Thermal Compounds
Thermal Compounds
Non-silicone thermal compounds are used in a wide range of electronic and
electromechanical applications because they are resistant to thermal cycling
degredation. Thermal compounds are formulated to provide excellent heat transfer.
They are non-hazardous, and are RoHS and REACH compliant (lead-free). Their long
shelf-life stability ensures that they will not dry, harden, or melt in normal use.
For challenging applications, thermal compounds are available with specialty features.
Choosing the best thermal compound requires some understanding of the mechanics
of heat transfer and how the thickness of the thermal compound layer, the bond line
thickness, inuences product choice.
SPECIFICATIONS
Formula
52022 52054 53054 52055* 52050 52160 53053
Specic Gravity at 25° C
2.7 3.0 3.0 2.8 2.6 2.6 2.8
Bleed: 24 Hrs., % Weight
0.1 0.0 0.01 0.0 0.01 0.3 0.3
Evaporation: 150C, 24 Hrs., %Weight
0.15 <2.0 <2.0 1.0 0.6 0.5 0.5
Thermal Conductivity: W/m-K
0.92 1.3 1.6 1.3 3.8 2 3.5
Dielectric Strength: V/mil
305 265 265 265 351 n/a 318
Dielectric Constant: 25° C, 1000Hz
4.5 5.02 5.02 5.02 4.92 n/a 5
Dissipation Factor: 25° C, 1000Hz
0.0029 0.0022 0.0022 0.0022 0.0032 n/a 0.0027
Volume Resistivity: Ohm-cm
1.65x10^14 2.0x10^15 2.0x10^15 2.0x10^15 1.0x10^13 over current 2.15x10^15
Operating Temperature: ° C
-40 to 200 -40 to 180 -40 to 180 0 to 180 -40 to 200 -40 to 200 -40 to 200
Flow Rate: g/min
4 to 7 8 to 9 5 to 6 4.5 to 6.5 1 to 3 3 to 8 7 to 9
Minimum Bond Line: mm
0.0381 0.0127 0.0127 0.0127 0.0508 0.0254 0.1270
Viscosity: 25° C kCps
460 470 510 620 350 230 1000
Viscosity: 50° C kCps
400 410 470 550 60 170 400
Appearance
Smooth,
off-white paste
Smooth white
paste
Smooth white
paste
Smooth white
paste
Dark gray paste
Smooth, gray
paste
Off white
paste
Shelf Life
1 year 1 year 1 year 1 year 1 year 1 year 1 year
www.nordsonefd.com/TIM
*Water cleanable for easy clean up