Specification SIPLACE CA-Series2014版.pdf - 第10页

10 Machine Description Technical Data - SWS T echnical Data Flip Chip Die Att ach Minimum die thickness (silici um) - without com- ponent sensor 50 µm 50 µm Minimum die thickness (silicium) - with compo- nent sensor 100 …

Machine Description

Technical Data - SMT

Number of gan-

tries

CA4: 4 gantries

Component feed-

ing

– SIPLACE CA4: Up to four SWS possible in placement area 1 and 2

– Component trolley (X-Series)

(with tape reel mount and integrated waste tape bin,

40 locations à 8 mm X feeder module per component trolley)

– Matrix Tray Changer (on request)

Feeder module

types

– X-Series component trolley: Tapes, waffle pack trays

Supply capacity

(X-Series compo-

nent trolley)

160 tracks Width: 10.8 mm 4 mm X feeder modules

160 tracks Width: 10.8 mm 8 mm X feeder modules

160 tracks Width: 22.9 mm Smart Feeder 2x8 mm X

80 tracks Width: 22.6 mm Smart Feeder 12 mm X

52 tracks Width: 22.6 mm Smart Feeder 16 mm X

52 tracks Width: 34.4 mm 24 mm X feeder modules

40 tracks Width: 46.2 mm 32 mm X feeder modules

32 tracks Width: 58.0 mm 44 mm X feeder modules

24 tracks Width: 69.8 mm 56 mm X feeder modules

20 tracks Width 81.6 mm 72 mm X feeder modules

16 tracks Width: 105.2 mm 88 mm X feeder modules

Machine Description

Technical Data - SWS

Technical Data Flip Chip Die Attach

Minimum die thickness (silicium) - without com-

ponent sensor

50 µm 50 µm

Minimum die thickness (silicium) - with compo-

nent sensor

100 µm 100 µm

Minimum bump size 50 µm n/a

Minimum bump grid 100 µm n/a

SIPLACE Wafer System SWS Horizontal system, automatic wafer change, MCM

SWS wafer size 4" to 12"

4" / 6" with adapter on request

Wafer frame 12“/8“

6" on request

4" with adapter

Hoop /grip ring thickness Max. 3.5 mm

Wafer magazine

a) Depending on the wafer magazine, you may need to mechanically adjust the base plate for the wafer magazines.

Up to 12"

Die Ejection System Programmable ejection speed (synchronous and asynchronous)

Option: Linear Dipping Unit LDU Individually programmable speed

Flux viscosity 3,000 to 100,000 cPs

Accuracy of flux height ± 5 µm

Line Concept

Description

The SIPLACE concept is dis-

tinguished by its flexibility,

modularity, compact design

and high performance. It al-

lows a production line to be

individually configured from

identical and different mod-

ules. If the production re-

quirements change, the indi-

vidual placement machines

are so compact that they can

be recombined quickly and

easily.

Operated together with the

SIPLACE X series, the SI-

PLACE CA machine allows

you to individually configure

your production line with both

identical and differing mod-

ules. If the production re-

quirements change, the indi-

vidual placement machines

are so compact and can be

combined with such flexibility

that they can be recombined

quickly and easily.

The SIPLACE CA family has

the optimum placement sys-

tem for each individual per-

formance requirement.

System SIPLACE Placement lines

Placement

module

SIPLACE CA4, SIPLACE X-Series,

SIPLACE SX1/SX2, SX4

Peripheral

modules

Input/output stations, screen printer, sol-

dering furnace, inspection places etc.

available from SIPLACE

PCB conveyor Single and dual conveyor with auto-

matic width adjustment unit;

Dual conveyor in single conveyor mode

"Wide board" mode with "long board"

option and a combination of these for

both PCB conveyors. The maximum

PCB width is determined by the module

with the smallest PCB conveyor width.

Space required 6.7 m² per CA4 module