Specification SIPLACE CA-Series2014版.pdf - 第5页

5 Overview of Technical Data Maximum Values Pickup on SWS Pickup on X-t able Flip Chip Die Att ach SMD Accuracy a C&P20 M CPP TH a) 10µm at 3 σ in placement process with the "Embedded Wafer Level Ballgrid Array&…

SIPLACE CA-Series

Content

SIPLACE Station Software 39

Maximum Production Quality 42

Technical Data 43

Siemens Signal Interface - Connector Assignment 43

Siemens Signal Interface - Signal Sequence 44

SMEMA Interface - Connector Assignment 45

SMEMA Interface - Signal Sequence 46

Electrical Ratings and Compressed Air Supply 47

Electrical Connection and Interfaces 48

Dimensions and Installation Conditions 49

Dimensions and Setup Conditions - Machine Without SWS 51

Dimensions and Setup Conditions - Machine With SWS 52

Placement System’s Center of Gravity 53

Center of Gravity for SWS 54

Maneuvering Radii for the Component Trolleys 55

Spacing Distances for the Single Conveyor 56

Spacing Distances for the Flexible Dual Conveyor 57

Transportation and Delivery Conditions for

Machine 58

Transportation and Delivery Conditions for SWS 59

Option List 60

Placement Machine 60

SWS 61

Configuration Overview 62

Overview of Technical Data

Maximum Values

Pickup on SWS Pickup on

X-table

Flip Chip Die Attach SMD

Accuracy

C&P20 M

CPP

a) 10µm at 3σ in placement process with the "Embedded Wafer Level Ballgrid Array" option (on request).

± 10 µm at 3σ

± 25 µm at 3σ

± 10 µm at 3σ

± 25µm at 3σ

± 20 µm at 3σ

± 25 µm at 3σ

± 22 µm at 3σ

b) With stationary camera, type 25

Placement performance

c) The placement performance depends on several project-specific parameters. The ex-

pected throughput can be individually calculated on request.

4 SWS, without dipping 4 SWS SMD

C&P20 M

CPP

42,000 die/h

28,000 die/h

26,000 die/h

See page 8

Die / component size

Flip Chip Die Attach SMD

C&P20 M

CPP

0.5 x 0.5 mm

to 6 x 6 mm

0.5 x 0.5 mm

d e

to 27 x 27 mm

d) Smaller dies on request

e) Dipping: depends on process

0.8 x 0.8 mm

to 6 x 6 mm

0.8 x 0.8 mm

to 27 x 27 mm

See page 14

See page 15

See page 17

Feeder module

types

Tape feeder module, waffle pack tray, stick magazine

feeders, bulk case, dip module, application-specific

OEM feeder modules, SIPLACE Wafer Feeder (SWS)

Supply capacity

(Component trolley

SIPLACE X)

160 tape feeder modules 8 mm X

Substrate size 50 mm x 50 mm to 535 mm x 850 mm

f) 850 mm on request

Substrate thickness 0.3 mm to 4.5 mm

Machine Description

Overview

General

The SIPLACE CA (Chip As-

sembly) platform can place

bare dies directly from the

wafer, using the die attach or

flip chip process. This pro-

vides additional support for

the SMT placement options

available with SIPLACE X

series machines. The

SIPLACE CA can either be

used only for bare die or SMT

placement or in single pass

mode. In this case, both bare

dies and SMT components

can be placed during the

same process. Users benefit

from a combination of great-

er process flexibility and

higher placement speeds

which is unique to the elec-

tronics production industry.

The SIPLACE CA-Series is

available with 4 gantries.

The SIPLACE CA4 can be

configured with up to 4 SWSs

IPLACE Wafer System).

The SWS provides the place-

ment head with components

(dies) directly from the wafer

(max. 12“).

Placement Machine

The placement machine

uses the Collect&Place

method for high-speed

placement of standard com-

ponents.

The moving head picks the

components up from the

waiting SWS and places

them on the waiting printed

circuit board. This proven

SIPLACE principle has many

advantages:

• No downtime due to refill-

ing or splicing

• Reliable pickup of even

the smallest components

• No shifting of the compo-

nents on the circuit board

• Minimized travel range

High flexibility, economic effi-

ciency and reliable setups

are the guarantee for the

high level of productivity in

the SIPLACE CA series

placement systems.

Minimum down times

increase utilization and thus

help to increase productivity.

Even the very small 03015/

01005 components can be

processed with the

SIPLACE CA-Series.

SIPLACE Wafer System

SWS

The integration of the

SIPLACE Wafer Systems

(SWS) in the SIPLACE CA

enables you to place dies

directly from the wafer, using

the standard SMT placement

procedure. This unique

placement platform supports

both the flip chip and the die

attach process.

• Processes supported:

Flip chip, die attach (chip

on board), SMT

• Hoopring handling

• Horizontal wafer system

• Automatic wafer change

• Linear Dipping Unit

• Die attach unit

• Wafer map connection

(e.g. ALPS)

• Multi-die capability