Specification SIPLACE CA-Series2014版.pdf - 第8页
8 Machine Description Placement Head Configuration CPP_H = MultiStar CPP only in high assembly position Placement head types SIPLACE S peedS tar (C&P20 M) SIPLACE MultiS tar (CPP) SIPLACE T winS tar (TH) Placement pe…
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Machine Description
SIPLACE Wafer System
Description
The SIPLACE Wafer System
(SWS) makes the compo-
nents available to the place-
ment head, directly from the
wafer. The SWS therefore
extends the component
spectrum of the established
SIPLACE X machines, by
enabling placement of bare
dies from wafers.
The wafers are supplied fully
automatically out of the wafer
cassette and the dies inside
can be processed in the
established placement pro-
cedures.
Flip chip process - func-
tion
The wafer is fully automati-
cally pulled out of the wafer
cassette and is then trans-
ported to the wafer table. The
wafer table positions the die
above the ejection system
that releases the die from the
wafer foil. After this release
procedure, the flip unit noz-
zle takes the die, rotates it by
180° and makes it available
to the placement head for
pickup.
Options
The process spectrum is
supplemented by the follow-
ing options:
– Die attach unit:
The die attach unit takes
the die from the flip unit
nozzle and turns it, so that
it has the same top-bottom
orientation on the board
as it had on the wafer.
– Linear Dipping Unit
The Linear Dipping Unit
distributes precise layers
of flux for the flip chip pro-
cess. After taking over
from the flip unit, the
placement head dips the
die into the flux layer.
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Machine Description
Placement Head Configuration
CPP_H = MultiStar CPP only in high assembly position
Placement head types
SIPLACE SpeedStar (C&P20 M)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
Placement performance
The placement performance is affected by the different head combinations and positions, plus the conveyor
configuration. The various different options and customized applications also influence the placement per-
formance. On request, SIPLACE can calculate the actual performance of your machine configuration for
your individual product.
SIPLACE Benchmark value [components/h]
The SIPLACE benchmark value is established during the machine acceptance procedure and corresponds
to the SIPLACE scope of service and supply.
SIPLACE CA4 placement machine
a
a) Values only valid in conjunction with 4 X tables
See the note above for information about defining placement performance values.
Number of gantries 4
Placement area 1 Placement area 2 Benchmark value Option
C&P20 M / C&P20 M C&P20 M / C&P20 M 80,000
Without High Precision Flag
C&P20 M / C&P20 M C&P20 M / C&P20 M 64,000 With High Precision Flag
C&P20 M / C&P20 M CPP_H / CPP_H 76,000 Without High Precision Flag
C&P20 M / C&P20 M CPP_H / CPP_H 67,000 With High Precision Flag on
C&P20 M
CPP_H / CPP_H CPP_H / CPP_H 72,000 --
C&P20 M / C&P20 M CPP_H / TH 63,000 Without High Precision Flag
C&P20 M / C&P20 M CPP_H / TH 54,000 With High Precision Flag on
C&P20 M
CPP_H / CPP_H CPP_H / TH 59,000 --
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Machine Description
Technical Data - SMT
Number of gan-
tries
CA4: 4 gantries
Component feed-
ing
– SIPLACE CA4: Up to four SWS possible in placement area 1 and 2
– Component trolley (X-Series)
(with tape reel mount and integrated waste tape bin,
40 locations à 8 mm X feeder module per component trolley)
– Matrix Tray Changer (on request)
Feeder module
types
– X-Series component trolley: Tapes, waffle pack trays
Supply capacity
(X-Series compo-
nent trolley)
160 tracks Width: 10.8 mm 4 mm X feeder modules
160 tracks Width: 10.8 mm 8 mm X feeder modules
160 tracks Width: 22.9 mm Smart Feeder 2x8 mm X
80 tracks Width: 22.6 mm Smart Feeder 12 mm X
52 tracks Width: 22.6 mm Smart Feeder 16 mm X
52 tracks Width: 34.4 mm 24 mm X feeder modules
40 tracks Width: 46.2 mm 32 mm X feeder modules
32 tracks Width: 58.0 mm 44 mm X feeder modules
24 tracks Width: 69.8 mm 56 mm X feeder modules
20 tracks Width 81.6 mm 72 mm X feeder modules
16 tracks Width: 105.2 mm 88 mm X feeder modules