Specification SIPLACE CA-Series2014版.pdf - 第4页
4 SIPLACE CA-Series Content SIPLACE Station Software 39 Maximum Production Qua lity 42 Technical Data 43 Siemens Signal Interface - Connector Assi gnment 43 Siemens Signal Interface - Signal Sequence 44 SMEMA Interface -…
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SIPLACE CA-Series
Content
Overview of Technical Data 5
Maximum Values 5
Machine Description 6
Overview 6
SIPLACE Wafer System 7
Machine Description 8
Placement Head Configuration 8
Technical Data - SWS 10
Line Concept 11
Placement Heads 12
Overview 12
Standard Functions / Options 13
SIPLACE SpeedStar (C&P20 M) 14
SIPLACE MultiStar (CPP) 15
SIPLACE TwinStar (TH) 17
Nozzle Changers 18
Technical Data 19
PCB Conveyor 20
Single Conveyor 20
Technical Data for the Single Conveyor 21
Flexible Dual Conveyor 22
Technical Data for the Dual Conveyor 23
PCB Warpage 24
Sample Configuration 26
Component Feeding 27
SIPLACE X-Series Component Trolley 27
SIPLACE Wafer System 28
Technical Data 29
X Tape Feeder Modules 31
Alternative SIPLACE Feeder Modules 32
Dummy Feeder Modules 33
Vision Sensor Technology 34
PCB Position Recognition 34
Bad Board Recognition 35
03015/01005 Placement 36
SIPLACE Software Suite 37
General 37
Overview 38
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SIPLACE CA-Series
Content
SIPLACE Station Software 39
Maximum Production Quality 42
Technical Data 43
Siemens Signal Interface - Connector Assignment 43
Siemens Signal Interface - Signal Sequence 44
SMEMA Interface - Connector Assignment 45
SMEMA Interface - Signal Sequence 46
Electrical Ratings and Compressed Air Supply 47
Electrical Connection and Interfaces 48
Dimensions and Installation Conditions 49
Dimensions and Setup Conditions - Machine Without SWS 51
Dimensions and Setup Conditions - Machine With SWS 52
Placement System’s Center of Gravity 53
Center of Gravity for SWS 54
Maneuvering Radii for the Component Trolleys 55
Spacing Distances for the Single Conveyor 56
Spacing Distances for the Flexible Dual Conveyor 57
Transportation and Delivery Conditions for
Machine 58
Transportation and Delivery Conditions for SWS 59
Option List 60
Placement Machine 60
SWS 61
Configuration Overview 62
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Overview of Technical Data
Maximum Values
Pickup on SWS Pickup on
X-table
Flip Chip Die Attach SMD
Accuracy
a
C&P20 M
CPP
TH
a) 10µm at 3σ in placement process with the "Embedded Wafer Level Ballgrid Array" option (on request).
± 10 µm at 3σ
± 25 µm at 3σ
--
± 10 µm at 3σ
± 25µm at 3σ
--
± 20 µm at 3σ
± 25 µm at 3σ
± 22 µm at 3σ
b
b) With stationary camera, type 25
Placement performance
c
c) The placement performance depends on several project-specific parameters. The ex-
pected throughput can be individually calculated on request.
4 SWS, without dipping 4 SWS SMD
C&P20 M
CPP
TH
42,000 die/h
42,000 die/h
--
28,000 die/h
26,000 die/h
--
See page 8
Die / component size
Flip Chip Die Attach SMD
C&P20 M
CPP
TH
0.5 x 0.5 mm
d
e
to 6 x 6 mm
0.5 x 0.5 mm
d e
to 27 x 27 mm
--
d) Smaller dies on request
e) Dipping: depends on process
0.8 x 0.8 mm
d
to 6 x 6 mm
0.8 x 0.8 mm
d
to 27 x 27 mm
--
See page 14
See page 15
See page 17
Feeder module
types
Tape feeder module, waffle pack tray, stick magazine
feeders, bulk case, dip module, application-specific
OEM feeder modules, SIPLACE Wafer Feeder (SWS)
Supply capacity
(Component trolley
SIPLACE X)
160 tape feeder modules 8 mm X
Substrate size 50 mm x 50 mm to 535 mm x 850 mm
f
f) 850 mm on request
Substrate thickness 0.3 mm to 4.5 mm