Understanding_ the_Cleaning_Process_for_Automatic_Stencil_Printers.pdf - 第11页
Wipe T ypes 11 • Dr y Wipe – mos t common used – addresses the solder balls on the bottom of the stencil c aused by b leed - out fr om the aper ture • V acuum Wipe – address the aper ture to remove paste and address clog…
Clean Stencil
Subtract 1 - 2 prints from the determined number of prints for your “wipe frequency”
Stencil after a wiper cycle
Understanding the Cleaning Process for Automatic Stencil Printers
Wipe Types
11
• Dry Wipe – most common used – addresses the solder balls on the bottom of the stencil caused by bleed-out from the aperture
• Vacuum Wipe – address the aperture to remove paste and address clogging of the aperture
• Solvent wipe – used to address the flux on the bottom of the stencil
Wipe frequency
• >15 – excellent gasketing – aperture sizes are not challenging
• 10-15 – good gasketing with the occasional anomaly
• 5-10 – Average wipe frequency – some challenging apertures – some gasketing issues
• 2-5 – Poor gasketing – mismatch of materials – stencil design issues – very challenging components
• 1-each print – something is wrong - requiring a wipe after every print – micro components – pushing envelope
Understanding the Cleaning Process for Automatic Stencil Printers
Wiper profile – wipe 1
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Understanding the Cleaning Process for Automatic Stencil Printers