Understanding_ the_Cleaning_Process_for_Automatic_Stencil_Printers.pdf - 第3页

Primar y goal of the printing mac hine T o print or place an exact amount of ma terial in a precise location. Simply - Align the boar d to the stencil • Solder P as t e • Adhesives • Flux • Solder Spheres • Thick Film 3 …

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The automatic stencil wiper – first line of defense
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• The Printing process and why we need to focus on the wiping function
• Frequency of wiping
• Wiping options
• Wiper profiles
• Event driven wiping
• Advanced options
• Materials – Paper
• Materials – Solvent
• Preventive maintenance
• Random stuff
Understanding the Cleaning Process for Automatic Stencil Printers
Primary goal of the printing machine
To print or place an exact amount of material in a precise location.
Simply - Align the board to the stencil
• Solder Paste
• Adhesives
• Flux
• Solder Spheres
• Thick Film
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However the printing process
has become much more than
that…….
Understanding the Cleaning Process for Automatic Stencil Printers
To address defects and yield – the printing process has the largest impact
SMT Defects:
• Printing process is the major cause for yield loss (50-75%)
Auto stencil wiping is the critical tool for addressing these defects.
Printing Process is critical to success:
• Confirmed by 86% of SMT industry
(Value in Use Survey 2016)
Yield & Throughput influence up to 91% of the margin made on a particular assembly
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Materials
12%
Other
2%
Solder Print
53%
Placement
33%
0%
20%
40%
60%
80%
100%
Product Margin
Impacted by
Yield &
Throughput
Understanding the Cleaning Process for Automatic Stencil Printers