ENG_SS_108-90801_E.pdf - 第3页

Product specification ‘Multispring standard power’ 108-90801

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Rev. E Page 2 of 7

R1-1 (Rev. 02-00)

1. SCOPE .

This specification covers all the information as required in the IEC 60352-5 (Issue 5; Jan 2012) for a

Multispring Press-In zone (further named “Multispring”) for nominal hole-Ø 1.45mm and made from

0.8mm stock thickness.

The IEC requirements are supplemented with the requirements for automotive use (in the engine area)

based on the “Arbeitskreis Prüfrichtlinie für KFZ-Steckverbinder“.

2. PRINTED BOARD AND HOLE INFORMATION

 Printed board material according to :

IEC 61249-2-7 (replacement for the IEC 60249-2-4/5/11/12)

Other board materials are possible and have to be tested on request.

 Maximum number of conductive layers: not limited.

 Printed board thickness:

Normal range: min = 1.6mm ±0.14 mm; max = not limited.

Extended range: Min = 1.2mm … max = 1.6mm: allowed with some restrictions:

* The maximum deformation of the PCB-hole according to the IEC-norm cannot be

guaranteed for all types of PCB material used.

* With some plating combinations the hold force can be smaller than the limit of min.40N.

* Electrically less current can be put thru the press-fit and should be checked

* An application test is necessary to test the project specific situation

Smaller board thicknesses have to be tested.

 Plated-Through-Hole dimensions:

Hole-Ø prior to plating = 1.6±0.025 mm

Thickness of the PTH-wall > 25 µm Cu

Finished hole-Ø = 1.45-1.54mm

in case of HAL PCB’s or exceptional cases the former standard of 1.39-1.54mm is allowed.

 Printed board plating material :

HAL or galvanic tin plated 5 –15 µm

Chemical Sn > 0.5µm

0.05-0.2µm Au over 2.5-5 µm Ni

OSP (Organic Solderability Preservative) (not recommended)

Other plating materials have to be tested on request.

3. PRESS-IN ZONE INFORMATION

 Design : see dimensional drawing on page 3

 Material : CuSn4 , CuSn6 ,CuNiSi or CuCrAgFeTiSi or similar copper alloy.

Other materials have to be tested on request.

 Plating : - 0.4-1.5 µm Sn over min 0.8µm Ni.

- 0.4-1.5 µm SnPb over min 0.8µm Ni. (Technically possible but decommissioned)

- 0.3-1.1 µm S+D Advanced Indium over 1.27…2.2 µm Ni.

- Customer specific plating definitions are possible but have to be tested.

Not all combinations of plating, base material and PCB plating/technology are possible or

released. In case of doubt, please contact TE.

Product specification ‘Multispring standard power’ 108-90801

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Rev. E Page 3 of 7

R1-1 (Rev. 02-00)

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1.57

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Product specification ‘Multispring standard power’ 108-90801

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Rev. E Page 4 of 7

R1-1 (Rev. 02-00)

4. INFORMATION ON THE APPLICATION.

The Multispring as described can be used as a

Individual press-in termination.

Straight or right angle termination.

Rear plug up.

Wrapped connection.

Connector or module with pre-assembled press-in terminations.

5. INSTRUCTION AND TOOLS FOR THE PRESS-IN OPERATION.

 Depending on plating combination minimum 1 replacement is guaranteed with a new press-in

termination.

More repairs have to be tested on request.

 Press-in depth :

As on the dimensional drawing on page 3 for the minimum thickness printed board.

For thinner printed boards the position of the printed board should be situated in the middle of the

press-in zone. Notice that some press-fit parameters can be affected and have a lower performance

(e.g. Retention force) see also paragraph 2: ‘PCB definition’. In case of PCB’s with a smaller

thickness of 1.6mm nominal, a project specific test is recommended.

For thicker printed boards the position of the press-in zone should be preferably

in the middle or in the upper half of the printed board thickness. See the application drawing and

table.

For complex geometry with a high number of pins, the dimension of X±0.2mm can be interpreted of

the mean of all press-in depths. The maximum single press-in depth should however been within

Y±0.3mm.

PCB Thickness

Nominal Press-in

dimension X

Nominal Press-in

dimension Y

Tolerance Press-in

dimension Z

> 1.6 mm

0

0.2 (0.3 *)

1.6 mm

0

1.2…1.6 mm

0.1 - k

0.1 – k

With k = (1.6 – PCB Thickness) / 2

*) For complex applications with a high number of pins, the tolerance Z of ±0.2 mm can be extended

towards ±0.3 mm. The mean of all press-in dimensions of the application should however still lay

within the ±0.2 tolerance range.

For standalone pins as Single Pin Insertion, the depth tolerance of

+0.2 mm to -0.2 mm is mandatory.

The use of the middle of the Multispring as reference for press-in depth will be less accurate and is

not recommended. One should choose between dimension X or Y to define the right press-in depth

dimension. This choice of reference is determined by the application (housing, module, stand-alone

pin…) and the used press-in tooling (detection, reference side of the PCB,…). In that way the usual

big tolerances of the PCB thickness can be avoided to optimize the press-in process and the

tolerance calculation chain.