ENG_SS_108-90801_E.pdf - 第5页

Product specification ‘Multispring standard power’ 108-90801

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Rev. E Page 4 of 7

R1-1 (Rev. 02-00)

4. INFORMATION ON THE APPLICATION.

The Multispring as described can be used as a

Individual press-in termination.

Straight or right angle termination.

Rear plug up.

Wrapped connection.

Connector or module with pre-assembled press-in terminations.

5. INSTRUCTION AND TOOLS FOR THE PRESS-IN OPERATION.

 Depending on plating combination minimum 1 replacement is guaranteed with a new press-in

termination.

More repairs have to be tested on request.

 Press-in depth :

As on the dimensional drawing on page 3 for the minimum thickness printed board.

For thinner printed boards the position of the printed board should be situated in the middle of the

press-in zone. Notice that some press-fit parameters can be affected and have a lower performance

(e.g. Retention force) see also paragraph 2: ‘PCB definition’. In case of PCB’s with a smaller

thickness of 1.6mm nominal, a project specific test is recommended.

For thicker printed boards the position of the press-in zone should be preferably

in the middle or in the upper half of the printed board thickness. See the application drawing and

table.

For complex geometry with a high number of pins, the dimension of X±0.2mm can be interpreted of

the mean of all press-in depths. The maximum single press-in depth should however been within

Y±0.3mm.

PCB Thickness

Nominal Press-in

dimension X

Nominal Press-in

dimension Y

Tolerance Press-in

dimension Z

> 1.6 mm

0

0.2 (0.3 *)

1.6 mm

0

1.2…1.6 mm

0.1 - k

0.1 – k

With k = (1.6 – PCB Thickness) / 2

*) For complex applications with a high number of pins, the tolerance Z of ±0.2 mm can be extended

towards ±0.3 mm. The mean of all press-in dimensions of the application should however still lay

within the ±0.2 tolerance range.

For standalone pins as Single Pin Insertion, the depth tolerance of

+0.2 mm to -0.2 mm is mandatory.

The use of the middle of the Multispring as reference for press-in depth will be less accurate and is

not recommended. One should choose between dimension X or Y to define the right press-in depth

dimension. This choice of reference is determined by the application (housing, module, stand-alone

pin…) and the used press-in tooling (detection, reference side of the PCB,…). In that way the usual

big tolerances of the PCB thickness can be avoided to optimize the press-in process and the

tolerance calculation chain.

Product specification ‘Multispring standard power’ 108-90801

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Rev. E Page 5 of 7

R1-1 (Rev. 02-00)

The use of a lubricant, anti-tarnish or other post treatments on the Multispring zone can influence the

performance negatively and should therefore be avoided.

Press in force / distance should be controlled.

 Press-in speed:

Recommended maximum 5 mm/s for header applications. For stitched pins speeds up to 600 mm/s

are in use. As extreme high speeds can influence the press-in behaviour, an application specific

check is recommended. Higher speeds are likely possible but needs to be tested.

 Tool information :

The press-in tool has to be adapted to the actual application. To ensure an optimal quality of the

applied TE connectivity products, we recommend the utilization of application equipment from TE

connectivity.

The latest news and detailed information on application tooling can be found on

https://www.te.com/global-en/products/application-tooling.html

Contact person: siegfried.beck@te.com or TAC-EMEA@te.com

6. PRESS-IN CHARACTERISTICS.

6.1 Mechanical

Maximum press-in forces (performed on single multispring termination):

Plating multispring

Max. press-in forces

Typical

a)

Min. press-in forces

SnPb

160N a)

120-130N

40N

Sn

185N a)b)

125-150N

40N

In

200N a)b)

110-140N

40N

Ag

tbd

Au

tbd

a) in PCB with Chemical Sn

b) in PCB with Cu+OSP

Minimum push-out force per termination: 40 N (typical values 70-80N)

Values in other printed boards: have to be tested on request.

6.2 Electrical

Contact resistance < 0.5 m (measured values acc IEC 60352-5 in tin plated printed boards)

Derating (measured values acc IEC512-3 in 1.6 tin plated printed boards)

Product specification ‘Multispring standard power’ 108-90801

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Rev. E Page 6 of 7

R1-1 (Rev. 02-00)

Derating Multispring / PCB

0

5

10

15

20

25

30

35

0

20

40

60

80

100

120

Temp °C

I (Amp)

Measured values

Derating curve (80%)

6.3 Environmental

Temperature Range CuSnx materials: –40°C /+130°C

CuNiSi & CuCrAgFeTiSi –40°C /+150°C

Other temperatures can be used depending on the temperature limitations of the printed board used in

the application but have to be tested.

7. REQUIREMENTS

Qualification tests based on IEC 60352-5

Except for test group C and D (see below: severer requirements)

CP1: Contact resistance (IEC 60352-5)

CP2: Temperature shock (EN 60068 2-14)

Duration: 144 cycles -40°C / +130°C , 15 minutes each

CP3: Temperature cycling (EN 60068 2-14)

Test Nb -40°C / +100°C each 3h duration: 20 cycles

CP4: Storage in dry heat (EN 60068 2)

Duration: 120 h; temperature: +120°C

CP5: Visual examination (IEC 512 2-1a)

CP6: Industrial atmosphere (DIN 41640 T72)

0.20 ppm SO2; 0.01 ppm H2S; 0.20 ppm NO2; 0.01 ppm Cl2

Circulation volume 1 m3/h, 21 days; rel. humidity: 75%

CP7: Damp heat cyclic (EN 60068 2-30)

Variant 2; duration 10 cycles of 24h; lower limit: +25°C, upper limit: +55°C

CP8: Contact resistance (IEC 60352-5)

CP9: Visual examination (IEC 512 2-1a)

DP1: Contact resistance (IEC 60352-5)

DP2: Damp heat steady (IEC68-2-3 test Ca): 21 days

DP3: Temperature Shock (IEC68-2-14 test Na)

Duration: 100 cycles -40°C / +130°C , 1 h each

DP4: Contact resistance (IEC 60352-5)

DP5: Random vibration with temperature (EN 60068 2-64 meth.2 Fh)

5-1000 Hz; 4.2g

n

(eff.); 24 h/axis; all 3 axis.

3 temperature cycles of each 8 h/axis ; 1 h at 115°C / 1.5 h at –40°C

DP6: Contact resistance (IEC 60352-5)

DP7: Visual examination (IEC 512 2-1a)