ENG_SS_108-90801_E.pdf - 第7页
Product specification ‘ Multisprin g standard power ’ 108 - 90801 ..........................................................................................................................................................…
Product specification ‘Multispring standard power’ 108-90801
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Rev. E Page 5 of 7
R1-1 (Rev. 02-00)
The use of a lubricant, anti-tarnish or other post treatments on the Multispring zone can influence the
performance negatively and should therefore be avoided.
Press in force / distance should be controlled.
Press-in speed:
Recommended maximum 5 mm/s for header applications. For stitched pins speeds up to 600 mm/s
are in use. As extreme high speeds can influence the press-in behaviour, an application specific
check is recommended. Higher speeds are likely possible but needs to be tested.
Tool information :
The press-in tool has to be adapted to the actual application. To ensure an optimal quality of the
applied TE connectivity products, we recommend the utilization of application equipment from TE
connectivity.
The latest news and detailed information on application tooling can be found on
https://www.te.com/global-en/products/application-tooling.html
Contact person: siegfried.beck@te.com or TAC-EMEA@te.com
6. PRESS-IN CHARACTERISTICS.
6.1 Mechanical
Maximum press-in forces (performed on single multispring termination):
Plating multispring
Max. press-in forces
Typical
a)
Min. press-in forces
SnPb
160N a)
120-130N
40N
Sn
185N a)b)
125-150N
40N
In
200N a)b)
110-140N
40N
Ag
tbd
tbd
tbd
Au
tbd
tbd
tbd
a) in PCB with Chemical Sn
b) in PCB with Cu+OSP
Minimum push-out force per termination: 40 N (typical values 70-80N)
Values in other printed boards: have to be tested on request.
6.2 Electrical
Contact resistance < 0.5 m (measured values acc IEC 60352-5 in tin plated printed boards)
Derating (measured values acc IEC512-3 in 1.6 tin plated printed boards)
Product specification ‘Multispring standard power’ 108-90801
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Rev. E Page 6 of 7
R1-1 (Rev. 02-00)
Derating Multispring / PCB
0
5
10
15
20
25
30
35
0
20
40
60
80
100
120
Temp °C
I (Amp)
Measured values
Derating curve (80%)
6.3 Environmental
Temperature Range CuSnx materials: –40°C /+130°C
CuNiSi & CuCrAgFeTiSi –40°C /+150°C
Other temperatures can be used depending on the temperature limitations of the printed board used in
the application but have to be tested.
7. REQUIREMENTS
Qualification tests based on IEC 60352-5
Except for test group C and D (see below: severer requirements)
CP1: Contact resistance (IEC 60352-5)
CP2: Temperature shock (EN 60068 2-14)
Duration: 144 cycles -40°C / +130°C , 15 minutes each
CP3: Temperature cycling (EN 60068 2-14)
Test Nb -40°C / +100°C each 3h duration: 20 cycles
CP4: Storage in dry heat (EN 60068 2)
Duration: 120 h; temperature: +120°C
CP5: Visual examination (IEC 512 2-1a)
CP6: Industrial atmosphere (DIN 41640 T72)
0.20 ppm SO2; 0.01 ppm H2S; 0.20 ppm NO2; 0.01 ppm Cl2
Circulation volume 1 m3/h, 21 days; rel. humidity: 75%
CP7: Damp heat cyclic (EN 60068 2-30)
Variant 2; duration 10 cycles of 24h; lower limit: +25°C, upper limit: +55°C
CP8: Contact resistance (IEC 60352-5)
CP9: Visual examination (IEC 512 2-1a)
DP1: Contact resistance (IEC 60352-5)
DP2: Damp heat steady (IEC68-2-3 test Ca): 21 days
DP3: Temperature Shock (IEC68-2-14 test Na)
Duration: 100 cycles -40°C / +130°C , 1 h each
DP4: Contact resistance (IEC 60352-5)
DP5: Random vibration with temperature (EN 60068 2-64 meth.2 Fh)
5-1000 Hz; 4.2g
n
(eff.); 24 h/axis; all 3 axis.
3 temperature cycles of each 8 h/axis ; 1 h at 115°C / 1.5 h at –40°C
DP6: Contact resistance (IEC 60352-5)
DP7: Visual examination (IEC 512 2-1a)
Product specification ‘Multispring standard power’ 108-90801
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Rev. E Page 7 of 7
R1-1 (Rev. 02-00)
DP8: Shock test (EN 60068-2-27)
100 g; 6 ms; half-sine; 2 shocks per direction, 3 axis
DP9: Contact resistance (IEC 60352-5)
Additional requirements specific for different applications have to be tested on request.
8. RELATED DOCUMENTS
8.1 Test-Reports
See 142.403.02.01 & 1247.1170.01.01
.