solution-brochure.pdf - 第8页
BE TT ER L I G H TI N G , HI G H RE S OLU T IO N Whe n it come s to n ew packa ging t ech nol ogi es , sup erio r lightin g is a key aspe ct of our visio n systems . By usi ng a progra mma ble lighting mod ule , wh…
EFFICIENT HANDLING OF ANY BATCH SIZE
Our advanced software solutions let you easily
perform job scheduling, feeder optimization and line
balancing for your entire facility. You can prioritize
minimal changeover time, maximum throughput, or
a balance between the two as the software quickly
calculates and predicts the assembly time, kitting
and changeover procedures. By selecting the best
changeover strategy based on part commonality
and batch size, the MYPlan software can help to
increase actual throughput by up to 30%, all while
will you start a job that can’t be completed due to
missing components.
PAPERLESS GUIDANCE AND PERFORMANCE
TRACKING
After optimization, MYPlan generates a comprehen-
sive set of kitting instructions that provide operators
with simple, step-by-step tasks to keep production
running e ciently. You can also send the result elec-
tronically to the SMD Tower for automatic compo-
nent delivery and paperless guidance. Performance
tracking is easy thanks to TPSys’ comprehensive re-
porting tools. You can generate customized reports
on machine speed, production runs, error identifi ca-
tion and utilization. View data from the factory fl oor
during production, integrate it with your factory-
wide tracking system or export to a spreadsheet
program for further processing.
ERROR-FREE DATA PREPARATION
Within minutes, Mycronic’s MYCenter software
converts Gerber, ASCII centroid and Bill-of-Materials
information into ready-to-run machine programs.
Once imported, a graphic rendering of the PCB,
overlaying a Gerber background, is checked for er-
rors and can be edited as required. Any changes to
the program will generate immediate visual feed-
back. MYCenter’s intuitive “what you see is what you
get” interface makes it easy to add new shapes and
component handling rules to the machine library.
HANDLING OF ALTERNATIVE COMPONENT
Our software fully supports Bill-of-Materials that
include alternative components for a single mount
position. Each alternative can be given a strict prior-
ity and an expiration date. Once defi ned, the pick-
and-place machine will automatically mount the
correct alternative part, as specifi ed and approved
by the production engineer.
STORE DATA SAFELY FOR DECADES
MYTrace is a Windows-based traceability software,
developed for secure, long-term storage of trace-
ability data, and at the same time making the data
available for easy searching and reporting. Infor-
mation about each component placement is safely
stored, and a web-based search tool makes it pos-
sible to identify all PCBs that are a ected by factors
such as faulty component batches.
EXTRACT TRACEABILITY DATA IN SECONDS
This fully automatic system allows electronics manu-
facturers to quickly and easily trace mounted com-
ponents on printed circuit boards, saving both time
and resources. MYTrace is future-proof and modular,
and stores data in an application-independent format
that does not rely on the existence of any particular
database technology. This makes this traceability
software unique – it gives the customer an unpreced-
ented and unparalleled level of data security.
Smarter software for
better business
Our machine operating software includes smart features
such as early low-feeder warning, package autoteach
and power failure recovery.
A true “what you see is what you get” interface
makes it easy to program new boards.
The gerber background functionality makes it
easy to verify component rotation and package
defi nition.
As the SMT production environment becomes more complex and fast-paced,
comprehensive software solutions have quickly become a necessity. After all,
improved utilization, e ciency and customer responsiveness all depend on
a single set of reliable data. For these reasons, Mycronic is proud to o er the
richest software suite in the industry, with integrated applications covering the
entire chain of SMT assembly.
BETTER LIGHTING, HIGH RESOLUTION
When it comes to new packaging technologies,
superior lighting is a key aspect of our vision
systems. By using a programmable lighting module,
where light can be adjusted to front, side or ambient
lighting – depending on the package’s type and
material – our machines can handle virtually all new
packages. And with the Autoteach functionality,
optimal light settings adjust automatically.
HANDLE A GREATER MIX OF BOARDS
Increasing demands in terms of board size and
number of layers require a machine that can handle
boards that are large and small, thick and thin. That’s
why our machines are designed to handle a greater
board mix than our competitors. We can take on
boards as small as 70 x 50 mm (2.7” x 2.0”), or as
”«x 24”
as
well as odd-shaped boards. And with ISIC (Intelligent
Surface Impact Control), even placement on thin
panels and warped boards is not a problem.
Handle any job
– in record time
MOUNT ANY COMPONENT ON ANY BOARD
When it comes to component handling, Mycronic
odd-shaped and through-hole components can
be mounted with ease. Since older models can be
upgraded with the latest vision system and software,
one Mycronic machine can handle the components
of today and tomorrow. When all your placement
needs can be handled by one system, your sta only
has to learn how to operate one type of machine.
Plus, when feeders represent a large part of your
equipment investment, it’s much more economi-
cal to have a unified, modular feeder system that
enables you to share feeders among multiple
machines.
HIGH ACCURACY
When it comes to placing fine-pitch components,
our Midas mounthead is designed for ultra-sharp
precision. It’s linked to a number of sensors to
ensure that complex components like flip chips are
placed with a great deal of sensitivity and accuracy.
With its z-axis resolution of two micrometers, it
works together with our Intelligent Surface Impact
Control (ISIC) function to ensure that even the
most delicate of components are handled with
the correct mount force. This sophisticated servo
system for z-axis movement prevents high-impact
force and insucient mounting pressure – even on
warped boards. ISIC also helps avoid microcracks on
sensitive components.
Placement accuracy is maintained at all conditions thanks to the
unique Automatic Thermal Adaption (ATA) technology.
Our Intelligent Surface Impact Control (ISIC) feature handles even
the most delicate components with complete safety.
In an average day, you may be expected to mount everything from 01005s and
flip chips to large connectors and complex BGAs. Naturally, the greater the
variety of components your machine can place, the more you can use it.
STOP WAITING FOR STENCILS
Because it eliminates the need for stencils altogether,
jet printing represents a growing next-generation
technology – and new way of doing business. Instead
of waiting for stencils to arrive, you can focus on
incoming customer orders, changes and revisions,
with faster turnovers than ever before. Rather than
wasting valuable time cleaning, storing, retrieving
and ordering stencils, you can program and optimize
each job without interrupting your production line.
Put simply, it lets you take a customer’s order in the
morning and deliver fi nished boards in the afternoon.
ACHIEVE PERFECT SOLDER JOINTS
When it comes to solder joints, the limits of stencils
are more than apparent: larger components demand
thick stencils, small components need thin stencils,
and the result is a less-than-ideal compromise for
almost every component. And to further complicate
matters, all of these components must be mounted
on increasingly dense boards, making high-precision
joints more crucial than ever. With a MY600 Jet Print-
er, there’s no need to compromise on quality. As Klaus
Appel, owner of Appel-Elektronik GmbH in Germany,
explains: “Our latest product carries 69 components
on a square centimeter. Jet printing allow the kind of
paste control that makes this possible.”
MY600
The ultimate in agile
production
Waiting for stencils is a thing of the past. With jet
printing, it’s possible to prepare jobs in minutes
instead of days. For customers handling two or
three setups a day and 50 or more new stencils
every year, it’s an investment that pays for itself even
more quickly. But improved productivity is only part
of the story of the MY600. Thanks to perfect solder
joints and less rework, you can also rely on more
satisfi ed customers.
Completely software-driven, the MY600 Jet Printer
can easily apply precisely controlled solder paste
volumes or SMA onto complex boards for perfect
solder joints, every time. It o ers ideal results for
new applications such as jetting into board cavities.
And because the limitations and trade-o s of stencil
printing are eliminated, you’re always in ultimate
control of each solder application.
MY600 Jet Printer is quickly changing the competi-
tive landscape of the electronics industry.
PRINT A JOB IN MINUTES
At the heart of the jet printing system is a fl exible
software solution that streamlines SMT produc-
tion. Every job is prepared o ine, thus eliminating
interruptions in ongoing production. Using CAD or
Gerber data, you can prepare and print a new job in
minutes, making the MY600 the most fl exible and
unique solution in the industry.
You can jet paste at di erent
board levels or into cavities.
3D CAVITIES PACKAGE-ON-PACKAGEPIN-IN-PASTEQFN
thanks to jet printing.
Jet printing is ideal for
package-on-package (PoP).
Jet printing optimizes paste
volumes for pin-in-paste.
a software-driven solution, you can
print a job in minutes instead of days.
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2
3
THICK STENCIL
Optimized for large components.
COMMON ISSUES WITH SCREEN PRINTING SOLVED WITH JET PRINTING
DRY JOINTGOOD JOINT
1
2
1
2
3
1
2
3
THIN STENCIL
Optimized for small components.
STEPPED STENCIL
Require a larger board area.
GOOD JOINTLEAN JOINT LARGER DISTANCE
Each component get the
right amount of solder paste.
ALWAYS PERFECT JOINTS
With jet printing, the paste volume and shape are set individually
for every solder joint.
1
2
3
THICK STENCIL
Optimized for large components.
COMMON ISSUES WITH SCREEN PRINTING SOLVED WITH JET PRINTING
DRY JOINTGOOD JOINT
1
2
1
2
3
1
2
3
THIN STENCIL
Optimized for small components.
STEPPED STENCIL
Require a larger board area.
GOOD JOINTLEAN JOINT LARGER DISTANCE
Each component get the
right amount of solder paste.
ALWAYS PERFECT JOINTS
Waiting for stencils is a thing of the past. With jet printing, it’s possible to
prepare jobs in minutes instead of days. For customers handling two or three
setups a day and 50 or more new stencils every year, it’s an investment that
pays for itself even more quickly. But improved productivity is only part of the
story of the MY600. Thanks to perfect solder joints and less rework, you can
also rely on more satisfi ed customers.