Vision_Serie_EN_2023.pdf - 第13页
13 Power Cooling Unit Rehm CoolFlow In order to cool complex modules it is possible to extend the cooling zones using a power cooling unit. As part of this process, cold air is fed onto the board fr om above and below , …
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It is important to have a high-performance cooling tract in order to guarantee optimum
soldering results and ensure that modules are cooled gently.
Rehm Thermal Systems offers a wide range of cooling tract variants for reow convection
soldering with its VisionX-Series, which can be precisely ne-tuned to suit any production
process. The water-cooled standard solution with heat exchanger and adjustable ventilation
system works as an effective "Closed Loop" system. There are several efcient, additional
options for large and high-mass boards, primarily a power cooling unit as an extended
cooling tract or a bottom cooling system.
Stress-free to below 50 °C
with powerful cooling systems
Stress-free cooling using individually adjustable ventilators in the classic cooling zones
Gentle cooling through the use of the power cooling unit as an extended cooling tract
Optimum cooling of large, high-mass boards thanks to additional bottom cooling
Flexible combination possibilities through a range of different options
New, sustainable cooling principle as a result of liquid nitrogen cooling
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Power Cooling Unit
Rehm CoolFlow
In order to cool complex modules it is possible to extend
the cooling zones using a power cooling unit. As part of this
process, cold air is fed onto the board from above and below,
where it can be cooled in a more intensive, gentle manner as
a result of the process being extended. The power cooling
unit can be implemented in the form of an extension to the
standard cooling zones under nitrogen atmosphere and
is also available as a separate, downstream module for
increased cooling capacity for insensitive materials under
normal atmospheric conditions.
Rehm Thermal Systems has been working with its partner
Air Liquide to develop an innovative cooling principle for the
effective use of the nitrogen required for inertisation and
designed the rst coolant-water-free reow soldering system
with liquid nitrogen cooling. The liquid nitrogen, which reaches
temperatures as low as -196 °C, cools the inside of the cooling
tract, evaporates and is then used for inertisation whilst in a
gaseous state. This not only provides the system with the nec-
essary coldness, but also the inert environment. As a result,
the coolant water that is re-cooled using a high amount of
energy, as well as the cooling unit and refrigerant are no longer
required at all. This method could save around 17 tonnes of
CO
2
and 30,000 kWh per system, per year.
The Vision-Series transforms the classic cooling tract into a two or four-layer system, depending on the
facility. This design incorporates an active cooling process, water-cooled using heat exchangers following
an efcient "Closed Loop" system. The process air is cooled in the heat exchangers and then ows onto
the module from above. The air is subsequently sucked underneath, cleaned using a lter system and
is then ready for the next cooling process. Individually adjustable ventilators in each of the zones make
it possible to precisely control the cooling process and inuence the cooling gradient by adjusting the
speeds.
Bottom cooling makes it possible to cool high-mass boards
easily and effectively. The cold process air is blown onto the
board in equal measures from above and below in order to
facilitate a particularly homogeneous cooling process and
to reduce tension in the material. It is possible to adjust the
ventilator speeds for each module. This means additional
cooling measures, such as an outfeed belt with ventilators,
are unnecessary thanks to the low outlet temperatures. It is
predominantly modules with inhomogeneous distribution of
the copper positions that will be protected against twisting
and warping as a result of bottom cooling.
Closed Loop System
Bottom Cooling
Cooling zone with bottom cooling
Power Cooling Unit PCU
only VisionXP+
Vision-Series | Cooling
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2-in-1solution for reow soldering
VisionXP+ with or without vacuum
Energy-efcient, low-maintenance and void-free - with the Vision TripleX, we offer an innovative solution for reow sol-
dering. The combination of vacuum unit and condensation soldering process in only one system provides undreamt-of
possibilities!
Vision TripleX is a patented new development in the eld of convection and vapour phase soldering. The system is based
on the reow convection soldering systems of the Vision series and combines the convection soldering process with the
proven vapour phase soldering process of the Condenso series. Thus, three processes can be run in the Vision TripleX:
Reow convection soldering with and without vacuum as well as vapour phase soldering using Galden
®
. This offers
uniquely exible manufacturing options.
3-in-1: The combination of classical convection soldering, convection soldering
under vacuum and condensation soldering in only one system
Flexible temperature proling due to the combination of convection and condensation,
in combination with the applicable atmosphere (air, N2 and/or Galden
®
)
High quality solder joints on assemblies with large differences in
thermal mass
Compared to existing Condenso systems, the Vision TripleX requires no additional
carrier is necessary