Fuzion_Platform_brochure.pdf - 第3页
Increase utilization by up to 50% and maximize OEE High-mix agility • Reduce or eliminate setups with multiple, fixed family or flexible schemes, thereby increasing output or eliminating production shifts • Streamline ch…
A contemporary model for profitability
A Changing Market
The electronics landscape is continuously evolving to meet the demands of a
dynamic market. Products that were once exclusive have undergone mass global
adoption, driving extreme diversity and complexity, shortened product lifecycles,
and the expectation for higher performance at the lowest cost.
New Expectations
Today’s requirements present electronics manufacturers in all production
environments with a significant challenge to reduce costs and time-to-market in a
contracted market window – all while delivering
the best in features, flexibility and performance in
the products they build.
Whether prototyping or sustaining high-volume
production, manufacturers must leverage efficient,
adaptable, cost-effective solutions to meet these
objectives and ensure profitability in a highly
competitive market.
Maximize Competitive Advantage
Build Better. Build More. Spend Less.
Fuzion™ enables manufacturers to accommodate the most
diverse revenue stream and produce a full range of products in
a lean environment – build any product at any time, accelerate
new product introduction and ramp to volume, maximize
utilization, quality, and yield. Fuzion enables operational
excellence to deliver considerable cost savings, increased
productivity and ultimate profitability.
Maximize utilization and Overall Equipment
Effectiveness (OEE)
• High-mix agility
• Sustained high-volume productivity
Optimize performance for any product mix
• Build any product at any time
• Solutions for any environment
Accelerate NPI and achieve 100% first-pass yield
• Comprehensive prototyping solutions
• Seamless transition to volume
Enjoy lowest cost of operation and ownership
• Lower CapEx investment
• Reduced operating costs
Increase utilization by up to 50% and maximize OEE
High-mix agility
• Reduce or eliminate setups with multiple, fixed family or flexible schemes, thereby
increasing output or eliminating production shifts
• Streamline changeover with off-line/auto-online setup validation and rapid bank change
• Promote a lean environment with smaller lot sizes, reduced WIP and increased turns
Sustained high-volume productivity
• Continuous production flow enabled by splicing, duplicate/alternate feeder replenishment,
feeder-low warnings, and feeder hot swap
• Minimize replenishment times with easy-loading ion™ feeders
• PCB staging and component pre-pick for < 30 second pulse rates
Peak Efficiency
Ultimate Flexibility
Optimize performance for any product mix
Build any product at any time with unmatched flexibility
• Handle the broadest range of components, package types, board sizes
• Address odd-form requirements with 5kg placement force, automated gripper nozzle
change, and advanced feature recognition
• Support advanced process requirements with high-end accuracy and technologies
Solutions for any environment
• Comprehensive portfolio and scalable configurations (from LVHM to high-volume)
• Complete assembly line solutions from high-speed chip to extreme odd-form
• Realize machine/line balance and achieve predictable output regardless of complexity
due to the widest overlapping component range between placement heads
• Flexibility to meet new market challenges throughout the product lifecycle
• Eliminate setups and reduce setup time for up to 50% utilization improvement
• Eliminate head changes and machine reconfigurations for new products
• 20+% more boards in same time frame or eliminate production shifts and acheive the same output
Fuzion efficiency = greater output
Change the program, not the line
Chips
CSP
SOIC
SOT
TSOP
BGA
TQFP
QFP
ECAP
TANT
DPAK
Connector
QFP and BGA > 30mm
Connectors from 30 - 150mm
ECAPs and taller than 6mm
Streamlined Introduction
Value Designed In
Feeder
Inspection
Fiducial
Inspection
Pre-Placement
Inspection
Component
Teach
Component
Inspection
Seamlessly transfer from NPI
to volume production
2x FuzionXC Platform line
536 feeder inputs
lowest CapEx
12x mini module line
500 feeder inputs
2.1x CapEx
5x traditional platform line
500 feeder inputs
1.6x CapEx
Lowest cost per input. Most inputs per floor space.
Accelerate NPI and achieve 100% first-pass yield
Comprehensive prototyping solutions
• Prototype on a single platform
• Eliminate production validation time using off-line board and component teach and verification
• Ensure fast and precise NPI with direct data import, on-the-fly production editing, auto
board/feeder/component teach, and post-placement inspection
• Support NPI with tape, tube, strip, or tray feeding capability and a large on-line nozzle inventory
Seamlessly transfer from NPI to production volume
• Common platform supports common program, feeders
• No secondary process validation required
Enjoy lowest cost of operation and ownership
Lower CapEx investment
• Purchase fewer modules versus alternative solutions
• Leverage existing installed base of feeders, nozzles, spares, training, etc.
• Utilize more feeders at the lowest capital cost per input
• Benefit from investment protection with future-proof technologies and the highest
residual value
Reduced operating costs
• Decrease production costs with fewer operators, less maintenance/consumables,
power/air consumption, programming and labor/repair costs
• Consume less shop floor space with fewer modules and tighter line spacing
• Minimize scrap, waste and rework through closed-loop yield features
• Lowest cost per placement and superior yields for high-volume applications
Fastest time to market, highest yields
• Sequential process for complete board build
• Quickly generate and optimize fiducial, feeder, placement,
and component information
• Full editing capability for all aspects of programming in pre-
production NPI mode, and dynamic on-the-fly editing in full
production mode eliminate need for machine stoppages and
reduce scrap and repair costs
• Semi-automated solder paste and post-placement inspection
Post-Placement
Inspection