Fuzion_Platform_brochure.pdf - 第4页

Streamlined Introduction V alue Designed In Feeder Inspection Fiducial Inspection Pre-Placement Inspection Component Te a c h Component Inspection Seamlessly transfer from NPI to volume production 2x FuzionXC Platform li…

Increase utilization by up to 50% and maximize OEE

High-mix agility

• Reduce or eliminate setups with multiple, fixed family or flexible schemes, thereby

increasing output or eliminating production shifts

• Streamline changeover with off-line/auto-online setup validation and rapid bank change

• Promote a lean environment with smaller lot sizes, reduced WIP and increased turns

Sustained high-volume productivity

• Continuous production flow enabled by splicing, duplicate/alternate feeder replenishment,

feeder-low warnings, and feeder hot swap

• Minimize replenishment times with easy-loading ion™ feeders

• PCB staging and component pre-pick for < 30 second pulse rates

Peak Efficiency

Ultimate Flexibility

Optimize performance for any product mix

Build any product at any time with unmatched flexibility

• Handle the broadest range of components, package types, board sizes

• Address odd-form requirements with 5kg placement force, automated gripper nozzle

change, and advanced feature recognition

• Support advanced process requirements with high-end accuracy and technologies

Solutions for any environment

• Comprehensive portfolio and scalable configurations (from LVHM to high-volume)

• Complete assembly line solutions from high-speed chip to extreme odd-form

• Realize machine/line balance and achieve predictable output regardless of complexity

due to the widest overlapping component range between placement heads

• Flexibility to meet new market challenges throughout the product lifecycle

• Eliminate setups and reduce setup time for up to 50% utilization improvement

• Eliminate head changes and machine reconfigurations for new products

• 20+% more boards in same time frame or eliminate production shifts and acheive the same output

Fuzion efficiency = greater output

Change the program, not the line

Chips

CSP

SOIC

SOT

TSOP

BGA

TQFP

QFP

ECAP

TANT

DPAK

Connector

QFP and BGA > 30mm

Connectors from 30 - 150mm

ECAPs and taller than 6mm

Streamlined Introduction

Value Designed In

Feeder

Inspection

Fiducial

Inspection

Pre-Placement

Inspection

Component

Teach

Component

Inspection

Seamlessly transfer from NPI

to volume production

2x FuzionXC Platform line

536 feeder inputs

lowest CapEx

12x mini module line

500 feeder inputs

2.1x CapEx

5x traditional platform line

500 feeder inputs

1.6x CapEx

Lowest cost per input. Most inputs per floor space.

Accelerate NPI and achieve 100% first-pass yield

Comprehensive prototyping solutions

• Prototype on a single platform

• Eliminate production validation time using off-line board and component teach and verification

• Ensure fast and precise NPI with direct data import, on-the-fly production editing, auto

board/feeder/component teach, and post-placement inspection

• Support NPI with tape, tube, strip, or tray feeding capability and a large on-line nozzle inventory

Seamlessly transfer from NPI to production volume

• Common platform supports common program, feeders

• No secondary process validation required

Enjoy lowest cost of operation and ownership

Lower CapEx investment

• Purchase fewer modules versus alternative solutions

• Leverage existing installed base of feeders, nozzles, spares, training, etc.

• Utilize more feeders at the lowest capital cost per input

• Benefit from investment protection with future-proof technologies and the highest

residual value

Reduced operating costs

• Decrease production costs with fewer operators, less maintenance/consumables,

power/air consumption, programming and labor/repair costs

• Consume less shop floor space with fewer modules and tighter line spacing

• Minimize scrap, waste and rework through closed-loop yield features

• Lowest cost per placement and superior yields for high-volume applications

Fastest time to market, highest yields

• Sequential process for complete board build

• Quickly generate and optimize fiducial, feeder, placement,

and component information

• Full editing capability for all aspects of programming in pre-

production NPI mode, and dynamic on-the-fly editing in full

production mode eliminate need for machine stoppages and

reduce scrap and repair costs

• Semi-automated solder paste and post-placement inspection

Post-Placement

Inspection

Solutions for any Market

Medium-Volume, High-Mix

Quote any job and turn it quickly

Ultra High-Volume

Complete solution for high-volume

mobile phone production

Complex assemblies, EMS/ODM manufacturers, Server/Data Storage, Internet

Infrastructure, LED Signage and Displays

40-50k line cph real throughput

Advanced NPI software, edit on-the-fly for immediate first article

540+ 8mm inputs, 58 random access tray inputs, strip tape and track feeder support

Largest PCB size range: up to 610 x 1300mm (24" x 51")

Large component range: 01005 - 150mm connectors, micro BGA

PoP, odd-form capable

Leverage feeder capacity and flexible (Feeder Anywhere) setup capabilities

Scalable NPI – volume, smaller/low-volume OEM/EMS, higher-complexity markets

20-25k line cph real throughput

Advanced NPI software, Auto component teach and edit on-the-fly for immediate first article

270+ 8mm inputs, 58 random access tray inputs, strip tape and track feeder support

Large PCB size range: up to 610 x 1300mm (24" x 51")

Large component range: 01005 - 150mm, micro BGA, + PoP, odd-form

Off-line component teach and program validation

Direct CAD/Gerber import with BOM merge

Leverage component range and single-machine process capabilities

FuzionXC2-37 PTF

FuzionXC2-60 PTF FuzionXC2-37

Fuzion4-120 Fuzion4-120 Fuzion1-11 PTF

Medium-Volume, Medium-Mix

Highest flexibility (front/back setups)

Medium-Volume OEM, White Goods, Military, Medical

30k - 45k line cph real throughput

Rapid changeover with full feeder bank exchange, family setups

User-friendly offline setup and validation with self-ID feeders

390+ 8mm inputs, 40 random access tray inputs, track feeder support

Large PCB size range: up to 508 x 635mm ( 20" x 25")

Large component range: 01005 - 150mm

Extensive component range overlap across all modules for easy balancing

Leverage zero setup time with front/back changeover schemes

Fuzion1-30

Fuzion1-11/DTF

NPI / All-in-One

Single-machine solution from

prototyping to LVHM

High-Volume, Lower-Mix

Little derate and the highest utilization

for competitive cost advantages

Consumer, Automotive, Hard Drive, LED Lighting

100k - 150k line cph real throughput

Fully spliceable, hot swap, alternate, or duplicate feeder replenishment

Throughputs not reliant on gang-picking/duplication of feeders

Auto tray replenishment

400+ 8mm inputs (large reel capable), 58 random access tray inputs

01005 - 150mm, micro BGA, package-on-package (PoP), odd form shields, connectors

<25dpmo (real) enabled by FZ30 head technologies, ion feeders, closed-loop monitoring

Line Manager utilization tools for sustained output, LineChart to monitor factory performance

Fuzion4-120 Fuzion4-120 Fuzion1-11 PTF

Higher-Volume, Medium-Mix

Efficiency and no compromises for

constantly changing environments

Industrial, Telecom, Computer, TV, SetTop Box, Gaming, Tablet

60k - 80k line cph real throughput

Rapid changeover with full feeder bank exchange, family setups

User-friendly offline setup and validation with self-ID feeders

480+ 8mm inputs, 40 random access tray inputs, track feeder support

Large PCB size range: up to 508 x 635mm ( 20" x 25")

Increased multifunction and odd-form capacity (25mm tall, 5kg force capable)

Extensive component range overlap across all modules for easy balancing

Leverage zero setup time with front/back or left/right changeover schemes

Fuzion2-60 Fuzion2-60 Fuzion1-11/DTFFuzion2-37

Fuzion4-120 Fuzion4-120

Mobile Phone

280k - 320k line cph real throughput

Fully spliceable, hot swap, alternate, or duplicate feeder replenishment

Throughputs not reliant on gang-picking/duplication of feeders

PCB staging and component pre-pick for < 30 second pulse rates

~700 8mm inputs (large reel capable), 58 random access tray inputs, auto tray replenishment

Industry standard for 01005 – package-on-package (PoP), odd form shields, connectors

<25dpmo (real) enabled by FZ30 head technologies, ion feeders, closed-loop monitoring

Fastest placement head in the industry provides high throughput and low cost per placement

Line Manager utilization tools for sustained output, LineChart to monitor factory performance