Fuzion_Platform_brochure.pdf - 第6页
Base Frame • Robust and stable foundation for accurate and repeatable performance • Precision machined to within 1 μ m from corner to corner for extreme accuracy T echnologies for Performance, Flexibility & Yield FZ …
Solutions for any Market
Medium-Volume, High-Mix
Quote any job and turn it quickly
Ultra High-Volume
Complete solution for high-volume
mobile phone production
Complex assemblies, EMS/ODM manufacturers, Server/Data Storage, Internet
Infrastructure, LED Signage and Displays
40-50k line cph real throughput
Advanced NPI software, edit on-the-fly for immediate first article
540+ 8mm inputs, 58 random access tray inputs, strip tape and track feeder support
Largest PCB size range: up to 610 x 1300mm (24" x 51")
Large component range: 01005 - 150mm connectors, micro BGA
PoP, odd-form capable
Leverage feeder capacity and flexible (Feeder Anywhere) setup capabilities
Scalable NPI – volume, smaller/low-volume OEM/EMS, higher-complexity markets
20-25k line cph real throughput
Advanced NPI software, Auto component teach and edit on-the-fly for immediate first article
270+ 8mm inputs, 58 random access tray inputs, strip tape and track feeder support
Large PCB size range: up to 610 x 1300mm (24" x 51")
Large component range: 01005 - 150mm, micro BGA, + PoP, odd-form
Off-line component teach and program validation
Direct CAD/Gerber import with BOM merge
Leverage component range and single-machine process capabilities
FuzionXC2-37 PTF
FuzionXC2-60 PTF FuzionXC2-37
Fuzion4-120 Fuzion4-120 Fuzion1-11 PTF
Medium-Volume, Medium-Mix
Highest flexibility (front/back setups)
Medium-Volume OEM, White Goods, Military, Medical
30k - 45k line cph real throughput
Rapid changeover with full feeder bank exchange, family setups
User-friendly offline setup and validation with self-ID feeders
390+ 8mm inputs, 40 random access tray inputs, track feeder support
Large PCB size range: up to 508 x 635mm ( 20" x 25")
Large component range: 01005 - 150mm
Extensive component range overlap across all modules for easy balancing
Leverage zero setup time with front/back changeover schemes
Fuzion1-30
Fuzion1-30
Fuzion1-11/DTF
NPI / All-in-One
Single-machine solution from
prototyping to LVHM
High-Volume, Lower-Mix
Little derate and the highest utilization
for competitive cost advantages
Consumer, Automotive, Hard Drive, LED Lighting
100k - 150k line cph real throughput
Fully spliceable, hot swap, alternate, or duplicate feeder replenishment
Throughputs not reliant on gang-picking/duplication of feeders
Auto tray replenishment
400+ 8mm inputs (large reel capable), 58 random access tray inputs
01005 - 150mm, micro BGA, package-on-package (PoP), odd form shields, connectors
<25dpmo (real) enabled by FZ30 head technologies, ion feeders, closed-loop monitoring
Line Manager utilization tools for sustained output, LineChart to monitor factory performance
Fuzion4-120 Fuzion4-120 Fuzion1-11 PTF
Higher-Volume, Medium-Mix
Efficiency and no compromises for
constantly changing environments
Industrial, Telecom, Computer, TV, SetTop Box, Gaming, Tablet
60k - 80k line cph real throughput
Rapid changeover with full feeder bank exchange, family setups
User-friendly offline setup and validation with self-ID feeders
480+ 8mm inputs, 40 random access tray inputs, track feeder support
Large PCB size range: up to 508 x 635mm ( 20" x 25")
Increased multifunction and odd-form capacity (25mm tall, 5kg force capable)
Extensive component range overlap across all modules for easy balancing
Leverage zero setup time with front/back or left/right changeover schemes
Fuzion2-60 Fuzion2-60 Fuzion1-11/DTFFuzion2-37
Fuzion4-120 Fuzion4-120
Mobile Phone
280k - 320k line cph real throughput
Fully spliceable, hot swap, alternate, or duplicate feeder replenishment
Throughputs not reliant on gang-picking/duplication of feeders
PCB staging and component pre-pick for < 30 second pulse rates
~700 8mm inputs (large reel capable), 58 random access tray inputs, auto tray replenishment
Industry standard for 01005 – package-on-package (PoP), odd form shields, connectors
<25dpmo (real) enabled by FZ30 head technologies, ion feeders, closed-loop monitoring
Fastest placement head in the industry provides high throughput and low cost per placement
Line Manager utilization tools for sustained output, LineChart to monitor factory performance
Base Frame
• Robust and stable foundation for accurate and repeatable performance
• Precision machined to within 1μm from corner to corner for extreme
accuracy
Technologies for Performance, Flexibility & Yield
FZ Placement Heads
VRM Linear Motor Positioning System
• High-accuracy (1μm resolution), closed-loop positioning control supports
current, converging and emerging technologies
• High acceleration – up to 2.5G
• Dual-drive control is self correcting and reduces settle times
• Thermally stable, non-magnetic
• Fewer moving parts for minimal maintenance and no adjustments
• 20-year lineage – thousands of proven VRM platforms in the field today
• Direct drive technology stands the test of time to maintain its accuracy
indefinitely
Magellan Digital Upward-Looking Camera
• Exceptional flexibility for NPI through high-volume, high-throughput applications
• High resolution of 1024 x 1024 to facilitate small part feature recognition
• Large 55mm field-of-view improves throughput for applications that typically require multiple FOVs
• Complete feature-based recognition: full-lead/all-bump, missing-ball, orientation check, odd-form features
• Provides substantial throughput improvements for applications that require multiple scans
• Front, side, and on-axis lighting that can be used individually or in combination
• Lighting intensity is consistent across viewable area for faster, more accurate alignment and inspection
FZ30™ Placement Head
The FZ30 is the industry’s fastest, most accurate and most flexible high-speed placement head.
FZ7™ Placement Head
The FZ7 head quickly and accurately
places components as small as 0201
up to 55mm square with single field-of-
view inspection and up to 25mm tall.
• Precision accuracy (27μm @ Cpk>1)
• Advanced odd-form capability and
insertion forces up to 5kg
• Components up to 150mm with
multiple fields of view
• Standard Package-on-Package
functionality
FZ™ Placement Heads
• Extensive component ranges that significantly overlap between heads, delivering superior line balancing and the
ability to simply change the program, and not the line or heads, when changing products
• Robust design, low maintenance, industry-leading accuracy and performance
Maximized Performance
• Industry’s fastest tact time (55ms), 35,000 cph per head
• Industry’s most accurate high-speed placement head (34μm)
• Little derate, not reliant on gang picking, predictable throughputs on any mix
Uncompromising Flexibility
• Largest component range for a high-speed head (01005–30mm square): lead-
less, leaded, bumped, odd-form with little need to skip spindles
• Full-lead/all-bump inspection, missing-ball inspection/orientation check
Highest Quality and Yields
• Vertical Part Sensor (VPS) validates part presence, orientation, and thickness;
inspects nozzles and enables on-the-fly exchange of suspect nozzles
• Auto Pocket Teach and touchdown sense at both pick and place improves
pick ppm, guarantees ideal placement force, and reduces nozzle wear
• Single pick point eliminates gang picking (multiple pick point) concerns
• Auto nozzle centering/contamination check/bypass assure sustained yields
FZ30 - Unmatched flexibility and performance FZ30 - Best-in-class accuracy of
34μm
Chip
LED
Tant Cap
SOIC
TSOP
DPAK
QFP
BGA
PLCC
CSP
Electrolytic Cap
Connectors
CCGA
BNGA
Odd-Form
Pin-in-Paste
Fuzion Portfolio
Fuzion1-11 Versatile IC placement platform perfect for special processes such as Pin-in-Paste, Flip Chip and OFA
Single-beam, dual-drive overhead gantry system
One 7-spindle FZ7 and one 4-spindle FZ4 placement head
Upward-looking vision system
Single-Beam Models
Superb for high-mix NPI environments and large board applications. Also a high-volume line booster.
Single-beam, dual-drive overhead gantry system
One 30-spindle rotary FZ30 placement head
Dual on-the-head optics
Fuzion1-30
Best-in-class multi-function machine with fast placement of a wide component range for applications
where flexibility and performance per line length are important
Dual-beam, dual-drive overhead gantry system
Two 7-spindle FZ7 placement heads
Upward-looking vision system
Fuzion2-14
Fuzion2-37 A true multi-purpose platform. A versatile stand-alone prototyping solution, a flexible line balancer, or
a high-performance multi-function solution.
Dual-beam, dual-drive overhead gantry system
One 30-spindle rotary FZ30 and one 7-spindle FZ7 placement head
Dual on-the-head optics and upward-looking vision system
Dual-Beam Models
Flexible, high-speed productivity for medium-volume environments. A powerful line booster solution
or high-performance small part placer.
Dual-beam, dual-drive overhead gantry system
Two 30-spindle rotary FZ30 placement heads
Dual on-the-head optics
Fuzion2-60
FuzionXC2-37 High-capacity NPI, all-in-one, line balancer, or multifunction solution with a full component range
Dual-beam, dual-drive overhead gantry system
One 30-spindle rotary FZ30 and one 7-spindle FZ7 placement head
Dual on-the-head optics and upward-looking vision system
Dual-Beam
High-Capacity Models
Cost-efficient, high-performace turret replacement or high-input chip placer
Dual-beam, dual-drive overhead gantry system
Two 30-spindle rotary FZ30 placement heads
Dual on-the-head optics
FuzionXC2-60
Powerful performance for high-volume production environments: Consumer, Mobile, Notebook, Auto
Quad-beam, dual-drive overhead gantry system
Four 30-spindle rotary FZ30 placement heads
Dual on-the-head optics
Fuzion4-120
Quad-Beam Models
Fuzion1-11
Fuzion1-30
Fuzion2-14
Fuzion2-37
Fuzion2-60
FuzionXC2-37
FuzionXC2-60
Fuzion4-120
16,500 (Max)
11,400 (1-Bd IPC Chips)
35,000 (Max)
22,600 (1-Bd IPC Chips)
30,750 (Max)
21,750 (1-Bd IPC Chips)
48,000 (Max)
27,500 (1-Bd IPC Chips)
66,500 (Max)
40,500 (1-Bd IPC Chips)
43,000 (Max)
20,500 (1-Bd IPC Chips)
65,500 (Max)
30,000 (1-Bd IPC Chips)
140,000 (Max)
81,000 (1-Bd IPC Chips)
Model Throughput (cph) Accuracy (μm@>
1.00 Cpk)
Max Board Size
Component Range (mm)
Max Feeder Inputs (8mm)
±38 (Chips)
±27 (ICs)
±34 (Chips)
±34 (ICs)
±38 (Chips)
±27 (ICs)
±34 (Chips)
±27 (ICs)
±34 (Chips)
±34 (ICs)
±34 (Chips)
±27 (ICs)
±34 (Chips)
±34 (ICs)
±34 (Chips)
±34 (ICs)
508 x 813mm
20 x 32"
508 x 1016mm
20 x 40"
508 x 813mm
20 x 32"
508 x 1016mm
20 x 40"
508 x 1016mm
20 x 40"
610 x 1300mm
24 x 51.2"
610 x 1300mm
24 x 51.2"
500 x 700mm
19.7 x 27.6"
120 (2 ULC)
136
120 (2 ULC)
128 (1 ULC)
136
272
264
144
(0201) .25 x .5 x .15 (Min)
150 square and up to 25 tall
(01005) .18 x .38 x .10 (Min)
30 x 30 x 6 (Max)
(0201) .25 x .5 x .15 (Min)
150 square and up to 25 tall
(01005) .18 x .38 x .10 (Min)
150 square and up to 25 tall
(01005) .18 x .38 x .10 (Min)
30 x 30 x 6 (Max)
(01005) .18 x .38 x .10 (Min)
150 square and up to 25 tall
(01005) .18 x .38 x .10 (Min)
30 x 30 x 6 (Max)
(01005) .18 x .38 x .10 (Min)
30 x 30 x 6 (Max)