Fuzion_Platform_brochure.pdf - 第5页

Solutions for any Market Medium-V olume, High-Mix Quote any job and turn it quickly Ultra High-V olume Complete solution for high-volume mobile phone production Complex assemblies, EMS/ODM manufacturers, Server/Data Stor…

Streamlined Introduction

Value Designed In

Feeder

Inspection

Fiducial

Inspection

Pre-Placement

Inspection

Component

Teach

Component

Inspection

Seamlessly transfer from NPI

to volume production

2x FuzionXC Platform line

536 feeder inputs

lowest CapEx

12x mini module line

500 feeder inputs

2.1x CapEx

5x traditional platform line

500 feeder inputs

1.6x CapEx

Lowest cost per input. Most inputs per floor space.

Accelerate NPI and achieve 100% first-pass yield

Comprehensive prototyping solutions

• Prototype on a single platform

• Eliminate production validation time using off-line board and component teach and verification

• Ensure fast and precise NPI with direct data import, on-the-fly production editing, auto

board/feeder/component teach, and post-placement inspection

• Support NPI with tape, tube, strip, or tray feeding capability and a large on-line nozzle inventory

Seamlessly transfer from NPI to production volume

• Common platform supports common program, feeders

• No secondary process validation required

Enjoy lowest cost of operation and ownership

Lower CapEx investment

• Purchase fewer modules versus alternative solutions

• Leverage existing installed base of feeders, nozzles, spares, training, etc.

• Utilize more feeders at the lowest capital cost per input

• Benefit from investment protection with future-proof technologies and the highest

residual value

Reduced operating costs

• Decrease production costs with fewer operators, less maintenance/consumables,

power/air consumption, programming and labor/repair costs

• Consume less shop floor space with fewer modules and tighter line spacing

• Minimize scrap, waste and rework through closed-loop yield features

• Lowest cost per placement and superior yields for high-volume applications

Fastest time to market, highest yields

• Sequential process for complete board build

• Quickly generate and optimize fiducial, feeder, placement,

and component information

• Full editing capability for all aspects of programming in pre-

production NPI mode, and dynamic on-the-fly editing in full

production mode eliminate need for machine stoppages and

reduce scrap and repair costs

• Semi-automated solder paste and post-placement inspection

Post-Placement

Inspection

Solutions for any Market

Medium-Volume, High-Mix

Quote any job and turn it quickly

Ultra High-Volume

Complete solution for high-volume

mobile phone production

Complex assemblies, EMS/ODM manufacturers, Server/Data Storage, Internet

Infrastructure, LED Signage and Displays

40-50k line cph real throughput

Advanced NPI software, edit on-the-fly for immediate first article

540+ 8mm inputs, 58 random access tray inputs, strip tape and track feeder support

Largest PCB size range: up to 610 x 1300mm (24" x 51")

Large component range: 01005 - 150mm connectors, micro BGA

PoP, odd-form capable

Leverage feeder capacity and flexible (Feeder Anywhere) setup capabilities

Scalable NPI – volume, smaller/low-volume OEM/EMS, higher-complexity markets

20-25k line cph real throughput

Advanced NPI software, Auto component teach and edit on-the-fly for immediate first article

270+ 8mm inputs, 58 random access tray inputs, strip tape and track feeder support

Large PCB size range: up to 610 x 1300mm (24" x 51")

Large component range: 01005 - 150mm, micro BGA, + PoP, odd-form

Off-line component teach and program validation

Direct CAD/Gerber import with BOM merge

Leverage component range and single-machine process capabilities

FuzionXC2-37 PTF

FuzionXC2-60 PTF FuzionXC2-37

Fuzion4-120 Fuzion4-120 Fuzion1-11 PTF

Medium-Volume, Medium-Mix

Highest flexibility (front/back setups)

Medium-Volume OEM, White Goods, Military, Medical

30k - 45k line cph real throughput

Rapid changeover with full feeder bank exchange, family setups

User-friendly offline setup and validation with self-ID feeders

390+ 8mm inputs, 40 random access tray inputs, track feeder support

Large PCB size range: up to 508 x 635mm ( 20" x 25")

Large component range: 01005 - 150mm

Extensive component range overlap across all modules for easy balancing

Leverage zero setup time with front/back changeover schemes

Fuzion1-30

Fuzion1-11/DTF

NPI / All-in-One

Single-machine solution from

prototyping to LVHM

High-Volume, Lower-Mix

Little derate and the highest utilization

for competitive cost advantages

Consumer, Automotive, Hard Drive, LED Lighting

100k - 150k line cph real throughput

Fully spliceable, hot swap, alternate, or duplicate feeder replenishment

Throughputs not reliant on gang-picking/duplication of feeders

Auto tray replenishment

400+ 8mm inputs (large reel capable), 58 random access tray inputs

01005 - 150mm, micro BGA, package-on-package (PoP), odd form shields, connectors

<25dpmo (real) enabled by FZ30 head technologies, ion feeders, closed-loop monitoring

Line Manager utilization tools for sustained output, LineChart to monitor factory performance

Fuzion4-120 Fuzion4-120 Fuzion1-11 PTF

Higher-Volume, Medium-Mix

Efficiency and no compromises for

constantly changing environments

Industrial, Telecom, Computer, TV, SetTop Box, Gaming, Tablet

60k - 80k line cph real throughput

Rapid changeover with full feeder bank exchange, family setups

User-friendly offline setup and validation with self-ID feeders

480+ 8mm inputs, 40 random access tray inputs, track feeder support

Large PCB size range: up to 508 x 635mm ( 20" x 25")

Increased multifunction and odd-form capacity (25mm tall, 5kg force capable)

Extensive component range overlap across all modules for easy balancing

Leverage zero setup time with front/back or left/right changeover schemes

Fuzion2-60 Fuzion2-60 Fuzion1-11/DTFFuzion2-37

Fuzion4-120 Fuzion4-120

Mobile Phone

280k - 320k line cph real throughput

Fully spliceable, hot swap, alternate, or duplicate feeder replenishment

Throughputs not reliant on gang-picking/duplication of feeders

PCB staging and component pre-pick for < 30 second pulse rates

~700 8mm inputs (large reel capable), 58 random access tray inputs, auto tray replenishment

Industry standard for 01005 – package-on-package (PoP), odd form shields, connectors

<25dpmo (real) enabled by FZ30 head technologies, ion feeders, closed-loop monitoring

Fastest placement head in the industry provides high throughput and low cost per placement

Line Manager utilization tools for sustained output, LineChart to monitor factory performance

Base Frame

• Robust and stable foundation for accurate and repeatable performance

• Precision machined to within 1μm from corner to corner for extreme

accuracy

Technologies for Performance, Flexibility & Yield

FZ Placement Heads

VRM Linear Motor Positioning System

• High-accuracy (1μm resolution), closed-loop positioning control supports

current, converging and emerging technologies

• High acceleration – up to 2.5G

• Dual-drive control is self correcting and reduces settle times

• Thermally stable, non-magnetic

• Fewer moving parts for minimal maintenance and no adjustments

• 20-year lineage – thousands of proven VRM platforms in the field today

• Direct drive technology stands the test of time to maintain its accuracy

indefinitely

Magellan Digital Upward-Looking Camera

• Exceptional flexibility for NPI through high-volume, high-throughput applications

• High resolution of 1024 x 1024 to facilitate small part feature recognition

• Large 55mm field-of-view improves throughput for applications that typically require multiple FOVs

• Complete feature-based recognition: full-lead/all-bump, missing-ball, orientation check, odd-form features

• Provides substantial throughput improvements for applications that require multiple scans

• Front, side, and on-axis lighting that can be used individually or in combination

• Lighting intensity is consistent across viewable area for faster, more accurate alignment and inspection

FZ30™ Placement Head

The FZ30 is the industry’s fastest, most accurate and most flexible high-speed placement head.

FZ7™ Placement Head

The FZ7 head quickly and accurately

places components as small as 0201

up to 55mm square with single field-of-

view inspection and up to 25mm tall.

• Precision accuracy (27μm @ Cpk>1)

• Advanced odd-form capability and

insertion forces up to 5kg

• Components up to 150mm with

multiple fields of view

• Standard Package-on-Package

functionality

FZ™ Placement Heads

• Extensive component ranges that significantly overlap between heads, delivering superior line balancing and the

ability to simply change the program, and not the line or heads, when changing products

• Robust design, low maintenance, industry-leading accuracy and performance

Maximized Performance

• Industry’s fastest tact time (55ms), 35,000 cph per head

• Industry’s most accurate high-speed placement head (34μm)

• Little derate, not reliant on gang picking, predictable throughputs on any mix

Uncompromising Flexibility

• Largest component range for a high-speed head (01005–30mm square): lead-

less, leaded, bumped, odd-form with little need to skip spindles

• Full-lead/all-bump inspection, missing-ball inspection/orientation check

Highest Quality and Yields

• Vertical Part Sensor (VPS) validates part presence, orientation, and thickness;

inspects nozzles and enables on-the-fly exchange of suspect nozzles

• Auto Pocket Teach and touchdown sense at both pick and place improves

pick ppm, guarantees ideal placement force, and reduces nozzle wear

• Single pick point eliminates gang picking (multiple pick point) concerns

• Auto nozzle centering/contamination check/bypass assure sustained yields

FZ30 - Unmatched flexibility and performance FZ30 - Best-in-class accuracy of

34μm

Chip

LED

Tant Cap

SOIC

TSOP

DPAK

QFP

BGA

PLCC

CSP

Electrolytic Cap

Connectors

CCGA

BNGA

Odd-Form

Pin-in-Paste