三星贴片机说明书.pdf - 第35页
1-3 1.1.2. a lgorithm OS Mic rosoft E mbedded W indows XP …
Samsung Component Placer SM421 Introduction
1-2
1.1.1.
1-1. Head Assembly
Z
R,
X-YTwin ServoYAC Ser
voMotor
backup table
, Linkage,
PCB
flying cameraFOV 25mm Mega Pixel Camera加
FOV 16mm Mega Pixel Camera(FOV 16mm Mega Pixel Camera)
0402 (
FOV 16mm Mega Pixel Camera )
Flying Visio
n
RMoto
r
Spindle
1-3
1.1.2.
algorithm
OSMicrosoftEmbedded Windows XP
MMI
1.2.
1.2.1.
1-1. Head
Vision
Gantry1 Head
Head 1 Head 2Head 3Head 4Head 5 Head 6
Vision
System
SM421
25mm
Vision
25mm
Vision
25mm
Vision
25mm
Vision
25mm
Vision
25mm
Vision
FOV 16/25
Mega Pixel
Head1~6FOV16mmFlying Vision Camera
0402 ChipFOV 25mm Mega Pixel Camera
”1.2.21-3”
1.2.2.
1.2.2.1. Flying Vision
Samsung Component Placer SM421 Introduction
1-4
1-2.
(Vision
)
Components
(Options)
FOV25mm Mega Pixel Camera
FOV16mm Mega Pixel Camera
Chips
0603~22mm 0402 ~ 14mm
IC,
Connector
22mm ,
Lead Pitch : 0.5mm
14mm ,
Lead Pitch : 0.4mm
BGA,
CSP
17mm ,
Ball Pitch : 0.75mm
14mm ,
Ball Pitch : 0.65mm
Maximum
Height
12mm
1.2.2.2. Stage Vision
1-3.
(Vision
)
Components
(Options)
Standard
FOV45mm
FOV35mm
Chips
42.0mm , Lead Pitch: 0.4mm
.
32.0mm , Lead Pitch : 0.3mm
.
Connector 55~75mm()
– MFOV
,
Lead Pitch: 1.0mm
IC,
Connector
42~55mm, Lead Pitch : 0.8mm
.(MFOV
)
32~42mm, Lead Pitch : 0.5mm
.(MFOV
)
42~55mm, Lead Pitch : 0.65mm
.(MFOV
)
42.0mm , Ball Pitch : 1.0mm
.
32.0mm , Ball Pitch: 0.5mm
.
BGA
42~55mm, Ball Pitch : 1.0mm
. (MFOV
)
42~55mm, Ball Pitch: 1.0mm
(MFOV
)
Maximum
Height
15mm
MFOV()54.0mmBGA75.0mm
ConnectorPitch
(Local Agent)