三星贴片机说明书.pdf - 第36页

Samsung C omponent Placer SM42 1 Intr oductio n 1-4  1-2.  (V ision  ) Components     (Options)   FOV25mm Mega Pixel Camera FOV16mm Mega Pixel Camera Chips 0603~  22 mm 0402 ~  14mm IC, Connector  2…

100%1 / 115

1-3
1.1.2. 



algorithm
OSMicrosoftEmbedded Windows XP
MMI




1.2. 
1.2.1. 

1-1. Head
Vision

Gantry1 Head
Head 1 Head 2Head 3Head 4Head 5 Head 6
Vision
System
SM421
25mm
Vision
25mm
Vision
25mm
Vision
25mm
Vision
25mm
Vision
25mm
Vision
FOV 16/25
Mega Pixel
Head1~6FOV16mmFlying Vision Camera
0402 ChipFOV 25mm Mega Pixel Camera
”1.2.21-3”
1.2.2. 
1.2.2.1. Flying Vision

Samsung Component Placer SM421 Introduction
1-4
1-2.

(Vision

)
Components
(Options)
FOV25mm Mega Pixel Camera
FOV16mm Mega Pixel Camera
Chips
0603~22mm 0402 ~ 14mm
IC,
Connector
22mm ,
Lead Pitch : 0.5mm 
14mm ,
Lead Pitch : 0.4mm 
BGA,
CSP
17mm ,
Ball Pitch : 0.75mm 
14mm ,
Ball Pitch : 0.65mm 
Maximum
Height
12mm
1.2.2.2. Stage Vision
1-3.

(Vision

)
Components
(Options)
Standard
FOV45mm
FOV35mm
Chips
42.0mm  , Lead Pitch: 0.4mm
.
32.0mm , Lead Pitch : 0.3mm
.
Connector 55~75mm()
– MFOV

,
Lead Pitch: 1.0mm 
IC,
Connector
42~55mm, Lead Pitch : 0.8mm
.(MFOV

)
32~42mm, Lead Pitch : 0.5mm
.(MFOV

)
42~55mm, Lead Pitch : 0.65mm
.(MFOV

)
42.0mm , Ball Pitch : 1.0mm
.
32.0mm , Ball Pitch: 0.5mm
.
BGA
42~55mm, Ball Pitch : 1.0mm
. (MFOV

)
42~55mm, Ball Pitch: 1.0mm
 (MFOV

)
Maximum
Height
15mm
MFOV()54.0mmBGA75.0mm
ConnectorPitch
(Local Agent)

1-5
1.2.3. 



1-4.

Specification (XY: mm, θ: °)
Chip 0402 XY : ±0.05 , : ±5.0 , Cp≥1.0FOV16mm (Flying)
Chip 0603 XY : ±0.08 , : ±5.0 , Cp≥1.0FOV25mm (Flying)
Chip 1005 XY : ±0.10 , : ±5.0 , Cp≥1.0
FOV25mm (Flying)
QFP100 0.5 P
XY : ±0.06 , : ±0.25 , Cp≥
1.0
FOV 35, 45mm (Stage)
QFP168 0.3 P XY : ±0.03 , : ±0.2 , Cp≥1.0FOV 35mm (Stage)
QFP256 0.4 P XY : ±0.05 , : ±0.1 , Cp≥1.0FOV 35, 45mm (Stage)
FOV 35mm (Stage)
MFOV 
QFP304 0.5 P
XY : ±0.06 , : ±0.1 , Cp≥1.0
FOV 45mm (Stage)
FOV25mm (Flying)
BGA256 1.0 P
XY : ±0.10 , : ±0.4 , Cp≥1.0
FOV 35, 45mm (Stage)
BGA 12mm 0.5 P XY : ±0.06 , : ±0.3 , Cp≥1.0FOV 35, 45mm (Stage)
FOV25mm (Flying)
BGA 17mm 0.75 P XY : ±0.10 , : ±0.4 , Cp≥1.0
FOV 35, 45mm (Stage)
FOV 35mm (Stage)
MFOV

BGA 52mm 1.27 P XY : ±0.10 , : ±0.3 , Cp≥1.0
FOV 45mm (Stage)
Connector 75mm 1.27 P
XY : ±0.18 , : ±0.25 , Cp≥
1.0
FOV 45mm (Stage)
MFOV

R