IPC_Publications_Catalog_2019_searchableE.pdf - 第17页
IPC-A-630 电子产品整机的制造、检验和测试的可接受 性标准 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures IPC-9262 组装行业应用之 AOI 设备的特性描述与鉴 定 Specification for Charactfflization and Verification of Assembly…
IPC中文标准目录
标准代码
标准中文名称（已翻译）
标准英文名称
IPC-A-600J
印制板的可接受性
Acceptability of Printed Boards
IPC-A-610G
电子组件的可接受性
Acceptability of Electronic Assemblies
IPC/WHMA-A-620C
线缆及线束组件的要求与验收
Requirements and Acceptance for Cable and Wire Hamess
Assemblies
IPC/WHMA-A-
620CS
线缆及线束组件的要求与验收
——航空航天应用附件
Space Applications Electronic Hardware Addendum to IPC/
WHMA-A-620C
IPC-7711/21C
电子组件的返工返修
Rework, Modification and Repair of Electronic Assemblies
IPC-J-STD-001G
焊接的电气和电子组件要求
Requirements for Soldered Electrical and Electronic Assemblies
IPC-J-STD-001GS
IPC J-STD-001F焊接的电气和电子组件
要求航天应用电子部件补充标准
Space Applications Electronic Hardware Addendum to J-STD-001F
IPC-6012D
刚性印制板鉴定与性能规范
Qualification and Perfonnance Specification for Rigid Printed
Boards
IPC-2221A
印制板设计通用标准
Generic Standard on Printed Board Design
IPC-2223C
挠性印制板设计分标准
Sectional Design Standard for Flexible Printed Boards
*IPC-A-600J
印制板的可接受性
Acceptability of Printed Boards
*IPC-6012D
刚性印制板鉴定与性能规范
Qualification and Perfonnance Specification for Rigid Printed
Boards
IPC-1601A
印制板操作和贮存指南
Printed Board Handling and Storage Guidelines
IPC-4101E
刚性及多层印制板用基材规范
Specification for Base Materials for Rigid and Multilayer Printed
Boards
IPC-4202A
挠性印制电路用挠性基底介质
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
IPC-4204A-WAM1
挠性印制电路用挠性覆金属箔介质材料
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible
Printed Circuitry
IPC-4412B
印制板用处理E玻璃纤维布规范
Specification for Finished Fabric Woven from "E" Glass for Printed
Boards
IPC-4552A
印制电路板化学镀镍/浸金 （ENIG）镀覆
性能规范
Specification for Electroless Nickel/Immersion Gold (ENIG)
Plating for Printed Circuit Boards
IPC-4553A
印制板浸银规范
Specification for Immersion Silver Plating for Printed Boards
IPC-4554
印制板浸锡规范
Specification for Immersion Tin Plating for Printed Circuit Boards
with Amendment 1
IPC-4556
印制板化学镍/钯/浸金（ENEPIG）规 范
Specification for Electroless Nickel/Electroless Palladium/ Immgig
Gold (ENEPIG) Plating for Printed Circuit Boards
IPC-4562A
印制板用金属箔
Metal Foil for Printed Board Applications
IPC-6011
印制板通用性能规范
Generic Performance Specification for Printed Boards
IPC-6012D-Space
刚性印制板鉴定与性能规范 一航空航天应
用附件
Space and Military Avionics A^lications Addendum to IPC-6012D,
Qualification and Perfonnan
IPC-6012D-Auto
刚性印制板鉴定与性能规范 一汽车应用附
件
Automotive Applications Addendum to IPC-6012D, Qualficiation
and Perfonnance Specification for Rigid Printed Boards
IPC-6013D
挠性印制板的鉴定及性能规范
Qualification and Performance Specification for Flexible Printed
Boards
IPC-6018C
高波（微频）印制板的鉴定及性能规范
Qualification and Perfonnance Specification for High Frequency
(Microwave) Printed Boards
IPC-SM-84OE
永久性阻焊剂和挠性覆盖材料的鉴定和 性
能规范
Qualification and Performance Specification of Permanent Solder
Mask and Flexible Cover Materials
IPC-CH-65B
印制电路板和组件的清洗指南
Guidelines for Cleaning of Printed Boards and Assemblies
IPC-9121
印制板制造工艺问题解答
Troubleshooting for PCB Fabrication Processes
IPC-CC-830C-CN
印制线路组件用电气绝缘化合物的鉴定 及
性能
Qualification and Perfonnance of Electrical Insulating Compound
for Printed Wring Assemblies
*为认证课程类标准
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IPC-4202B-CN
挠性印制电路用挠性基底介质
Flexible Base Dielectrics for Use in Flexible Printed Boards
IPC-A-630
电子产品整机的制造、检验和测试的可接受
性标准
Acceptability Standard for Manufacture, Inspection, and Testing
of Electronic Enclosures
IPC-9262
组装行业应用之 AOI 设备的特性描述与鉴
定
Specification for Charactfflization and Verification of
AssemblyLevel Automatic Optical Inspection Equipment
www.ipc.org/onlinestore
标准代码
标准中文名祢（已翻译）
标准英文名称 |
♦IPC-A-610G
电子组件的可接受性
Acceptability of Electronic Assemblies
*IPC/WHMA-A-620C
线缆及线束组件的要求与验收
Requirements and Acceptance for Cable and Wire Hamess
Assemblies
*IPC/WHMA-A-620CS
线缆及线束组件的要求与验收
航空航天应用附件
Space Applications Electronic Hardware Addendum to IPC/
WHMA-A-620C
♦IPC-7711/21C
电子组件的返工返修
Rework, Modification and Repair of Electronic Assemblies
♦IPC-J-STD-001G
焊接的电气和电子组件要求
Requirements for Soldered Electrical and Electronic Assemblies
♦IPC-J-STD-OOIGS
IPC J-STD-001F焊接的电气和电子组件
要求航天应用电子部件补充标准
Space Applications Electronic Hardware Addendum to J-STD-001F
IPC-J-STD-004B
助焊剂要求
Requirements for Soldering Fluxes - includes Amendment 1
IPC-J-STD-005A
焊膏要求
Requirements for Soldering Pastes
IPC-HDBK-005
焊膏评估指南
Guide to Solder Paste Assessment
IPC-J-STD-006C
电子焊接领域电子级焊料合金及含有助焊
剂与不含助焊剂的固体焊料的要求
Requirements far Electronic Grade Soldo: Alloys and Fluxed and
Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-J-STD-020E
非气密表面贴装器件潮湿/再流焊敏感度分
级
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices
IPC-J-STD-033D
对湿度、回流焊敏感的表面贴装器件的处
置、包装、发运及使用方法
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
IPC-J-STD-075
组装工艺中非IC电子元器件的分级
Classification of Non-IC Electronic Components for Assembly
Processes
IPC-J-STD-609A
元器件、印制电路板和印制电路板组件的
有铅、无铅及其它属性的标记和标签
Marking and Labeling of Components, PCBs and PCBAs to
Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
IPC-7093
底部端子元器件（BTC）设计和组装工艺
的实施
Design and Assembly Process Implementation for Bottom
Tbnnination Con^x)nents
IPC-7525B
模板设计指导
Stencil Design Guidelines
IPC-9252A
未组装印制板电气测试要求
Requirements for Electrical Tbsting of Unpcqjulated Printed Boards
IPC-SM-817A
表面贴装用绝缘粘合剂通用规范
General Requirements for Dielectric Surface Mount Adhesives
IPC-SM-785
表面贴装焊接连接加速可靠性测试指南
Guidelines for Accelerated Reliability Testing of Surface Mount
Attachments
IPC-7527
焊膏印刷要求
Requirements for Solder Paste Printing
IPC-7801
再流焊炉工艺控制标准
Reflow Oven Process Control Standard
IPC- 7530A-CN
群焊工艺温度曲线指南（再流焊和波峰 焊）
Guidelines for Ibmperature Profiling for Mass Soldering (Reflow &
Wave) Processes
IPC-7095C
BGA设计与组装工艺的实施
Design and Assembly Process Implementation for BGAs
IPC-7535
锡渣抗氧化还原剂要求
Requirements for Solder Dross Reduction Chemicals
IPC-DRM-18J
元器件识别、培训和参考指南
Component Identification Training and Reference Guide
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*为认证课程类标准
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IPC中文标准目录
标准代码
标准中文名称（已翻译）
标准英文名称 I
IPC-9691B
IPC-TM-650测试方法2.6.25耐导电阳极 丝
（CAF）测试（电化学迁移测试）用 户指
南
User Guide for the IPC-TM-650, Method 2.6.25, Conductive
Anodic Filament (CAF) Resistance Test (Electrochemical Migration
Testing)
IPC-9701A
表面贴装焊接连接的性能测试方法及鉴 定
要求
Performance Test Methods and Qualification Requirements for
Surface Mount Solder Attachments
IPC-9702
板极互连的单向弯曲特性描述
Monotonic Bend Characterization of Boaid-Level Intercoimects
IPC/JEDEC-9704A
印制板应变测试指南
Printed Circuit Assembly Strain Gage Test Guideline
IPC-9708
鉴定印制板组件焊盘坑裂的测试方法
Test Methods for Characterization of Printed Board Assembly Pad
Cratering
IPCTM-650
测试方法手册（目前已翻译约110个测试方
法）
Tbst Methods Manual
IPC-J-STD-002E
元器件引线、端子、焊片、接线柱和导 线
的可焊性测试
Solderability Itests far Component Leads, Terminations, Lugs,
Tbrminals and Wires
IPC-J-STD-003C
印制板可焊性测试
Solderability Tests for Printed Boards
IPCT50M（双语版本）
电子电路互连与封装术语及定义
Tferms and Definitions for Interconnecting and Packaging
Electronic Circuits
IPC-6903A
印刷电子设计与生产的术语及定义
Terms and Definitions for the Design and Manufacture of Printed
Electronics
IPC-4591A
印刷电子功能导电材料要求
Requirements for Printed Electronics Functional Conductive
Materials
IPC-9204
印刷电子柔性与可拉伸性能测试指南
Guideline on Flexibility and Stretchability Testing for Printed
Electronics
IPC-4921A
印刷电子基材（基板）要求
Requirements for Printed Electronlics Base Materials(Substrates)
IPC-1720A
组装资格认证纲要
Assembly Qualification Profile
IPC-1401
供应链社会管理体系指南
Supply Chain Social Responsibility Management System Guidance
IPC-J-STD-001G-AM1
焊接的电气和电子组件要求一修订本1
Requirements for Soldered Electrical and Electronic Assemblies
Amradment 1
IPC-6012D-AM1
刚性印制板鉴定与性能规范一修订本
Qualification and PerfOTmance Specification fbr Rigid Printed
Boards Amendment 1
IPC-WP-024
IPC智能织物结构的可靠性和可洗性白皮
书——为市场做好准备
IPC White Paper on Reliability and Washability of Smart Textile
Structures - Readiness for the Market
IPC-WP-019A
综述全球离子洁净度要求的变更
An Overview on the Global Change in Ionic Cleanliness
Requirements
DRM-SMT-G
表面贴装焊点评估培训与参考指南
Surface Mount Solder Joint Evaluation Training & Reference Guide
DRM-PTH-G
通孔焊点评估培训与参考指南
Through-Hole Solder Joint Evaluation Training & Reference Guide
P-SMT2-G
表面贴装焊点评估海报（
一套三张
）-2 级
产品
Through-Hole Solder Joint Evaluation Wall Poster - Class 2
P-SMT3-G
表面贴装焊点评估海报（一套三张）-3 级
产品
Through-Hole Solder Joint Evaluation Wall Poster - Class 3
P-PTH2-G
通孔焊点评估海报-2级产品
Surface Mount Solder Joint Evaluation Wall Posters (Set of 3)-
Class 2
P-PTH3-G
通孔焊点评估海报-3级产品
Surface Mount Solder Joint Evaluation Wall Posters (Set of 3)-
Class 3
P-MICRO
镀覆孔显微剖切图中的各种现象
PCB Multi-Issue Microsection Wall Poster
*为认证课程类标准
16
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