SM411 Administrator’s Guide(Chi Ver1).pdf - 第12页
Samsung Component Placer SM41 1 Administrator ’ s Guide 8 9 10.2 10.3 10.4 10.5 1 . . . PCB .................................................................................................1 1-9 rt [F2] ......…
3
4.9. (Part Dump All) .....................................................4-19
4.10. (Docking C ................................................................4-19 art)
4.11 (Data Logging) ...........................................................4-19 .
4 1.1. ........................................................................................................4-20 .1
4.11.2. FileLoad ..................................................................................................4-20
.....................................................................................4-20 4.11.3. RebootRT...........
5 . Help (shortcut) .................................................................5-1
5.1. (Language) .......................................................................... 5-1
5.2. (About SM411…) ..................................................................5-2
(Help) 5.3. ......................................................................................5-2
Programming Reference
第 6 章.
6.1.
6.2. ay
6.3.
6.4.
6.5.
7 .
.1
7.1.5. Hemt ............................................................................7-51
7.1.6.
P
Board .............................................................................................6-1
基本定 (Basic Setup) .........................................................................6-1
Arr PCB ..................................................................................... 6-7
(Fiducial Mark) ................................................................6-11
Bad Mark .....................................................................................6-19
(Accept Mark) ................................................................. 6-23
.............................................................................................7-1
7.1. ......................................................................................... 7-5
7 .1. Align Data .......................................................................................7-16
7.1.2. CHIP ............................................................................7-27
7.1.3. IC .................................................................................7-38
7.1.4. User IC .........................................................................7-46
Connector ....................................................................7-51
7.1.7. BGA ..............................................................................7-52
7.1.8. FLI CHIP ....................................................................7-59
Samsung Component Placer SM411 Administrator’s Guide
8
9
10.2
10.3
10.4
10.5
1
.
.
.
PCB.................................................................................................11-9
rt[F2] .............................................................................. 11-10
11.6. [F6] ....................................................................................
11.7. [F7] 11-12
11.8. [F8] .................................................................................... 11-12
Tea
. ...................................................................................... 8-1
8.1. Feeder[F4] ........................................................................... 8-1
8.1.1. Feeder Base ................................................................... 8-1
8.1.2. Stick Unit ................................................................................ 8-10
8.1.3. Tray Feeder................................................................... 8-15
. Step Programming ................................................................................. 9-1
10 . Optimization......................................................................................... 10-1
10.1. Feeder ............................................................................................. 10-1
. Nozzle ............................................................................................. 10-3
. FeederLane ......................................................................................... 10-5
. Parameter............................................................................................ 10-6
. (Optimizer) ..................................................................... 10-8
10.6. Optimizer Dialog .................................................................................. 10-8
10.7. Optimization Result ........................................................................... 10-11
1 . Production Setup ..................................................................................11-1
11.1. Product Main ....................................................................................... 11-1
11 1.1. ...........................................................................................11-1
11 1.2. ..................................................................................................11-4
11 1.3. .......................................................................................11-6
11.1.4.
11.2. Sta
11.3. Stop[F3]............................................................................... 11-10
11.4. Cont.[F4] .................................................................... 11-10
11.5. Finish[F5]........................................................................... 11-10
T/F 11-11
PCB ..................................................................................
ching & Test
1
12.2
2 . Teaching ............................................................................................. 12-1
12.1. Fiducial Mark Teaching ....................................................................... 12-1
. Point Teaching..................................................................................... 12-7
12.2.1. ............................................................................................. 12-7
4
5
12.2.2. ............................................................................................12-16
12.2.3. Reference Point ................................................................12-18
13
13.2
13.3. ................................................................................
PCB File Do ........................................................................13-5
Fiducial Mark ...........................................................................13-6
(Pickup Error) ....................................................................13-7
13.4.
..........................................................................13-15
Block
Cal
. Placement Test.....................................................................................13-1
13.1. .............................................................. 13-1
. ............................................................................................. 13-4
13-5
13.3.1. wnload Error
13.3.2.
13.3.3.
13.3.4. ........................................................................................13-11
13.3.5. ........................................................................................13-13
...........................................................................................13-15
13.4.1.
13.4.2. ..............................................................................13-15
13.4.3. ........................................................13-16
13.4.4. .............................................13-19
ibration & Setup
1
14.1
14.2.
14.3. [F9]
.
4 . Machine Calibration.............................................................................. 14-1
. Head [F2] ............................................................................................. 14-1
14.1.1. Head TAP ....................................................................................14-1
14.1.2. <> TAP ..........................................................................14-3
14.1.3. <R > TAP ................................................................................14-4
14.1.4. <> TAP ...................................................................14-5
14.1.5. <> TAP ..........................................................................14-6
Camera [F5] ......................................................................14-7
........................................................................................... 14-10
14.3.1. ................................................................................................14-11
14.3.2. ................................................................................................14-14
14 3.3. .....................................................................................14-16
14.3.4. Common XY Calibration .......................................................................14-20
14.3.5. Conveyor Calibration ............................................................................14-23
14.3.6. X-XY Compensation .............................................................................14-30
14.3.7. Gantry Thermal Mapping ......................................................................14-33