NYT-M2_DS_2020v1F.pdf - 第3页

4 | YESTECH M2 Micro Elec tronics Inspection 5 | YESTECH M2 Micro Elec tronics Inspection Wire bond height Wire bonds which do no t follow the design pa th can cause bridging, opens, or may not be adequa tely encapsula t…

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2 | YESTECH M2 Micro Electronics Inspection 3 | YESTECH M2 Micro Electronics Inspection
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The Electronics People
Surface
preparation
Underll
Conductive
paste apply
Wire bond
inspection
Bond voiding
Die placement
Wire bond
inspection
Bump
metrology
Die adhesion
testing
Bond test
Bonded wafer
delamination
Package
delamination
Via cleaning
WLP underll
Bump and via
metrology
Stacked die
attach
Surface
preparation
Surface
preparation
Surface
preparation
Surface
preparation
Bond voiding
Die placement
Wire bond
inspection
W
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Founded in 1954, Nordson Corporation is a
market leading industrial technology company
with annual revenues of over $2 billion and
more than 7,500 employees worldwide.
Nordson oers a wide range of products which are focused on providing process, test and inspection
solutions for the electronics and semiconductor industry. Whether you need to prepare a PCB using
MARCH plasma treatment technology, or check for package level delamination with SONOSCAN acoustic
inspection, we provide best in class technology solutions for PCBA and package level electronics
manufacture, and the global support network to keep you running and minimize downtime.
Bump
metrology
Die inspection
Underll llet
inspection
Die placement
contamination
4 | YESTECH M2 Micro Electronics Inspection 5 | YESTECH M2 Micro Electronics Inspection
Wire bond height
Wire bonds which do not follow the design path can cause
bridging, opens, or may not be adequately encapsulated.
Optical metrology measures bond height and wire sweep
which are great quality indicators.
Problems Solved
Underll
Too little underll can lead to poor adhesion,
too much can lead to contamination. Inspect
underll to ensure within limits.
Ever increasing requirements for durability and reliability, along with a continuous drive to smaller
components means that ensuring quality product manufacture is now more important than ever.
M2 automated optical inspection ensures product quality is maximised. Reduce costly returns
from the eld and the associated damage to reputation and future business.
Bond quality
The position of the wire bond conrms
good on pad location, and can also indicate
process dri. The shape of wire bonds indicates
the bond quality. Inspect both with AOI.
SPI
Solder paste or epoxy is oen applied
as part of the encapsulation process.
Inspect position and quantity of paste
to ensure good encapsulation reow.
Chip outs and cracks
Can signicantly aect
device performance.
Contamination
Contaminated dies can suer functional and
lifetime issues. Foreign object detection
screens for contamination.
6 | YESTECH M2 Micro Electronics Inspection 7 | YESTECH M2 Micro Electronics Inspection
Advanced Inspection Metrology
Automatic 3D optical inspection
ULTRA High Resolution 3D Moire with reect
suppression and shadow free technology.
The system oers a combination of technologies
that include 3D, 2.5D and 2D optical imaging to
achieve current highly demanding line speeds.
Automatic bond wire metrology
AFVM Automatic Focus Variation Metrology technology.
Automatically measure bond wire height using FVM
technology for High Resolution Optical 3D Surface Metrology.
3D sensor showing large Field
of View with high reective
surfaces and 01005 components.
High speed inline automatic inspection and
measurement optical inspection system.
AFVM Camera showing two measurement levels including bond wire loop height.
Powerful, proprietary lighting
Multi angle, multi color programmable LED lighting combined with coax illumination ensures
highest measurement accuracy and defects have nowhere to hide.
Dynamic Z height correction
Auto Focus and FVM Focus Variation
Metrology technology for on the y
automatic bond wire and surface
height measurements.
High speed linear motor
Ultra high accuracy linear motors
with closed loop allow for precise
micro measurements.
Handling
• Dual lane JEDEC tray.
• Strip PCBA.
• Leadframe approved conveyor.
• Vacuum xturing – Hold exible and warped
circuits in place for most accurate defect detection
and measurements.