NYT-M2_DS_2020v1F.pdf - 第4页
6 | YESTECH M2 Micro Elec tronics Inspection 7 | YESTECH M2 Micro Elec tronics Inspection Adv anc ed Inspection Me trology Aut omatic 3D op tical inspec tion UL TRA High R esolution 3D Moire with reect suppression and s…
4 | YESTECH M2 Micro Electronics Inspection 5 | YESTECH M2 Micro Electronics Inspection
Wire bond height
Wire bonds which do not follow the design path can cause
bridging, opens, or may not be adequately encapsulated.
Optical metrology measures bond height and wire sweep
which are great quality indicators.
Problems Solved
Underll
Too little underll can lead to poor adhesion,
too much can lead to contamination. Inspect
underll to ensure within limits.
Ever increasing requirements for durability and reliability, along with a continuous drive to smaller
components means that ensuring quality product manufacture is now more important than ever.
M2 automated optical inspection ensures product quality is maximised. Reduce costly returns
from the eld and the associated damage to reputation and future business.
Bond quality
The position of the wire bond conrms
good on pad location, and can also indicate
process dri. The shape of wire bonds indicates
the bond quality. Inspect both with AOI.
SPI
Solder paste or epoxy is oen applied
as part of the encapsulation process.
Inspect position and quantity of paste
to ensure good encapsulation reow.
Chip outs and cracks
Can signicantly aect
device performance.
Contamination
Contaminated dies can suer functional and
lifetime issues. Foreign object detection
screens for contamination.
6 | YESTECH M2 Micro Electronics Inspection 7 | YESTECH M2 Micro Electronics Inspection
Advanced Inspection Metrology
Automatic 3D optical inspection
ULTRA High Resolution 3D Moire with reect
suppression and shadow free technology.
The system oers a combination of technologies
that include 3D, 2.5D and 2D optical imaging to
achieve current highly demanding line speeds.
Automatic bond wire metrology
AFVM Automatic Focus Variation Metrology technology.
Automatically measure bond wire height using FVM
technology for High Resolution Optical 3D Surface Metrology.
3D sensor showing large Field
of View with high reective
surfaces and 01005 components.
High speed inline automatic inspection and
measurement optical inspection system.
AFVM Camera showing two measurement levels including bond wire loop height.
Powerful, proprietary lighting
Multi angle, multi color programmable LED lighting combined with coax illumination ensures
highest measurement accuracy and defects have nowhere to hide.
Dynamic Z height correction
Auto Focus and FVM Focus Variation
Metrology technology for on the y
automatic bond wire and surface
height measurements.
High speed linear motor
Ultra high accuracy linear motors
with closed loop allow for precise
micro measurements.
Handling
• Dual lane JEDEC tray.
• Strip PCBA.
• Leadframe approved conveyor.
• Vacuum xturing – Hold exible and warped
circuits in place for most accurate defect detection
and measurements.
8 | YESTECH M2 Micro Electronics Inspection 9 | YESTECH M2 Micro Electronics Inspection
Fast, Easy Setup
BGA micro bump inspection and measurement with 3D Moire technology.
Bond Wire loop height measurement with 3D Moire technology metrology.
Easy UI
Industry leading NYTVision inspection soware.
Robust, exible and intuitive programming.
Libraries
Central libraries allow fast setup of inspection recipes.
Local libraries enable easy recipe specic customization.
Auto programming
Program recipes fast with 3D auto programming option.
M2 uses 3D height information to nd features in product
design data to identify components and automatically
create inspection recipes.
3D algorithms for semi
Wire bond inspection algorithm, foreign object detection
algorithm, crack and scratch detection, blob analysis for
die chip out and Histogram measurement for % squeeze
out around perimeter of die.
AI ready programming tools
Auto tune enabled machine learning enhances and
simplies programming and process control.
Advanced microelectronics automatic inspection should be as easy and
intuitive to use as possible. M2 enables operators and occasional users
to setup powerful recipes quickly, and with minimal training.