NYT-M2_DS_2020v1F.pdf - 第5页
8 | YESTECH M2 Micro Elec tronics Inspection 9 | YESTECH M2 Micro Elec tronics Inspection F as t , Easy Se tup BGA micro bump inspection and me asurement with 3D Moire technology. Bond Wire loop height measurement with 3…
6 | YESTECH M2 Micro Electronics Inspection 7 | YESTECH M2 Micro Electronics Inspection
Advanced Inspection Metrology
Automatic 3D optical inspection
ULTRA High Resolution 3D Moire with reect
suppression and shadow free technology.
The system oers a combination of technologies
that include 3D, 2.5D and 2D optical imaging to
achieve current highly demanding line speeds.
Automatic bond wire metrology
AFVM Automatic Focus Variation Metrology technology.
Automatically measure bond wire height using FVM
technology for High Resolution Optical 3D Surface Metrology.
3D sensor showing large Field
of View with high reective
surfaces and 01005 components.
High speed inline automatic inspection and
measurement optical inspection system.
AFVM Camera showing two measurement levels including bond wire loop height.
Powerful, proprietary lighting
Multi angle, multi color programmable LED lighting combined with coax illumination ensures
highest measurement accuracy and defects have nowhere to hide.
Dynamic Z height correction
Auto Focus and FVM Focus Variation
Metrology technology for on the y
automatic bond wire and surface
height measurements.
High speed linear motor
Ultra high accuracy linear motors
with closed loop allow for precise
micro measurements.
Handling
• Dual lane JEDEC tray.
• Strip PCBA.
• Leadframe approved conveyor.
• Vacuum xturing – Hold exible and warped
circuits in place for most accurate defect detection
and measurements.
8 | YESTECH M2 Micro Electronics Inspection 9 | YESTECH M2 Micro Electronics Inspection
Fast, Easy Setup
BGA micro bump inspection and measurement with 3D Moire technology.
Bond Wire loop height measurement with 3D Moire technology metrology.
Easy UI
Industry leading NYTVision inspection soware.
Robust, exible and intuitive programming.
Libraries
Central libraries allow fast setup of inspection recipes.
Local libraries enable easy recipe specic customization.
Auto programming
Program recipes fast with 3D auto programming option.
M2 uses 3D height information to nd features in product
design data to identify components and automatically
create inspection recipes.
3D algorithms for semi
Wire bond inspection algorithm, foreign object detection
algorithm, crack and scratch detection, blob analysis for
die chip out and Histogram measurement for % squeeze
out around perimeter of die.
AI ready programming tools
Auto tune enabled machine learning enhances and
simplies programming and process control.
Advanced microelectronics automatic inspection should be as easy and
intuitive to use as possible. M2 enables operators and occasional users
to setup powerful recipes quickly, and with minimal training.
10 | YESTECH M2 Micro Electronics Inspection 11 | YESTECH M2 Micro Electronics Inspection
Real Time Process Control Solutions
M2 (Basic
conguration)
Single or dual camera
conguration
Low mix, high volume inspection
on limited number of areas
AFVM- Automatic
Focus Variation
Metrology
Secondary camera with
high speed automatic
FVM technology
Ability to measure bond wire
height at high speed
Barcode read
Included with camera
Enables proper historical
and MES traceability
Vacuum table
conveyor
Customized strip
handling solutions
Avoid warping variation in
strips and lead frames
Live CPK charting via Vudata soware package.
M2 3D ULTRA
3D Moire high
resolution module
3D component and bond
wire height measurement
High magnication
inspection
Up to 64 high
resolution projections
Advanced reconstruction for high
reective surfaces and micro devices
Barcode read
Included with sensor
Micro QFN and 2D
Enables proper historical
and MES traceability
3D ULTRA reection
suppression with
blue light
High power dynamic reection
suppression sensor
Accurately image and measure
highly reective dies
M2 allows production line control and monitoring via Auto CPK
and defect alarm tools.
USL
UCL
Mean
LCL
LSL
2σ
153μm
143μm
133μm
123μm
113μm
103μm
93μm
83μm
73μm
0 2 4 6 8 10 12
Offset
Live Average = 119.31 Min = 102 Max = 136 σ = 8.96 Cp = 1.3 Cpk = 1.14
1σ
-1σ
-2σ
Site 1 - Coating Strip Thickness