NYT-M2_DS_2020v1F.pdf - 第6页

10 | YESTECH M2 Micro Elec tronics Inspection 11 | YESTECH M2 Micro Elec tronics Inspection R e al Time Pr oc ess Contr ol Solutions M2 (Basic c ongura tion) Single or dual camer a congur ation Low mix, high volume ins…

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8 | YESTECH M2 Micro Electronics Inspection 9 | YESTECH M2 Micro Electronics Inspection
Fast, Easy Setup
BGA micro bump inspection and measurement with 3D Moire technology.
Bond Wire loop height measurement with 3D Moire technology metrology.
Easy UI
Industry leading NYTVision inspection soware.
Robust, exible and intuitive programming.
Libraries
Central libraries allow fast setup of inspection recipes.
Local libraries enable easy recipe specic customization.
Auto programming
Program recipes fast with 3D auto programming option.
M2 uses 3D height information to nd features in product
design data to identify components and automatically
create inspection recipes.
3D algorithms for semi
Wire bond inspection algorithm, foreign object detection
algorithm, crack and scratch detection, blob analysis for
die chip out and Histogram measurement for % squeeze
out around perimeter of die.
AI ready programming tools
Auto tune enabled machine learning enhances and
simplies programming and process control.
Advanced microelectronics automatic inspection should be as easy and
intuitive to use as possible. M2 enables operators and occasional users
to setup powerful recipes quickly, and with minimal training.
10 | YESTECH M2 Micro Electronics Inspection 11 | YESTECH M2 Micro Electronics Inspection
Real Time Process Control Solutions
M2 (Basic
conguration)
Single or dual camera
conguration
Low mix, high volume inspection
on limited number of areas
AFVM- Automatic
Focus Variation
Metrology
Secondary camera with
high speed automatic
FVM technology
Ability to measure bond wire
height at high speed
Barcode read
Included with camera
Enables proper historical
and MES traceability
Vacuum table
conveyor
Customized strip
handling solutions
Avoid warping variation in
strips and lead frames
Live CPK charting via Vudata soware package.
M2 3D ULTRA
3D Moire high
resolution module
3D component and bond
wire height measurement
High magnication
inspection
Up to 64 high
resolution projections
Advanced reconstruction for high
reective surfaces and micro devices
Barcode read
Included with sensor
Micro QFN and 2D
Enables proper historical
and MES traceability
3D ULTRA reection
suppression with
blue light
High power dynamic reection
suppression sensor
Accurately image and measure
highly reective dies
M2 allows production line control and monitoring via Auto CPK
and defect alarm tools.
USL
UCL
Mean
LCL
LSL
2σ
153μm
143μm
133μm
123μm
113μm
103μm
93μm
83μm
73μm
0 2 4 6 8 10 12
Offset
Live Average = 119.31 Min = 102 Max = 136 σ = 8.96 Cp = 1.3 Cpk = 1.14
1σ
-1σ
-2σ
Site 1 - Coating Strip Thickness
Specications at a Glance
Specications subject to change without prior notice.
Copyright © Nordson 2020. Other products and
company names mentioned are trademarks or trade
names of their respective companies.
YESTECH products are patent protected and covered by
the patent listed at www.nordson.com/yestechpatents
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estech.com
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estech.com
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estech.com
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Americas + 1 760 918 8471
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estech.com
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estech.com
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estech.com
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estech.com
Inspection Capabilities
Throughput
Maximum inspection area
Device types
75-125 mm
2
/sec
356 mm × 320 mm × 25 mm XYZ ~ (14 × 12.6× 1 in.)
JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA, MEMs, wale packs
Defects Detected
Wires Missing, damaged, no stick, o pad, club foot, lied
Die Missing, wrong, polarity, chipped, cracked, contamination
Part Position, missing, wrong, polarity, skew, tombstone
Epoxy Contamination, insuicient, excessive, bridging
Solder Contamination, insuicient, excessive, bridging
Soware
Algorithms Color, OCV, OCR, barcode recognition, both image and rule-based algorithms
Data requirements ASCII Text, X-Y position, part #, ref. #, polarity
CAD translation package Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Operating system Windows 10
O-line soware Optional - Rework, review and program creation
SPC soware Optional - Real-time local and remote Vudata package
Hardware
Material handling SMEMA width conveyor, pass / fail signals, board clamping
Conveyor length 915 mm (36 in.)
Conveyor height 950mm ± 35 mm (37.5 ± 1.3 in.)
Lighting Proprietary Fusion Lighting™ multiangle LED
Imaging M2 Basic: Dual 5 megapixel color camera (0.34 to 9 micron pixel size) resolution 2448 × 2048
M2 Ultra 3D: 5 cameras Ultra High resolution 3D sensor option
Optics Proprietary high resolution, low distortion with coaxial illumination and optional FV Metrology module
AFVM - Metrology module FVM - Focus Variation Measurement sensor
Facilities
Power 100-240 VAC, 50/60 Hz, 10 amps
Air input 60 to 90 PSI (0.4 to 0.6 Mpa), 2 CFM
Footprint 915 mm × 1074 mm × 1494 mm (36 × 42.3 × 58.8 in)
Weight 770 kg (1700 lbs)