BT Catalogue EN.pdf - 第10页

Specifications subject t o change without prior notic e. Copyright © Nordson 2022. Other product s and compa- ny names mentioned are trademarks or tr ade names of their respective c ompanies. Nordson products ar e pat en…

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Nordson - Bond Testing | 1514 | Nordson - Bond Testing
Find Every Failure
Solder Ball
Wirebond Pull
Wirebond Shear
Passivation Shear
Stud Pull
Ribbon
Surface Pad
Ribbon Pull
Micro-pillar Shear (base) Micro-pillar Shear (cap)
Micro-pillar
Cold Bump Pull
Ball Shear
Tab Bond ShearDie Shear
Wirebond
Die
Micro-pillar PullHot Bump Pull
Surface Mount Device Shear
Test Components Advanced Tests
Variable heights and dimensions.
For diicult to grip or small dimensions.
Larger components and higher forces.
Standard Pull Tests
Standard Shear Tests
Tab
Surface Mount Device
Nordson - Bond Testing | 1716 | Nordson - Bond Testing
Failure Mode Description Illustration
Type A:
Ductile
A – Ductile: Solder ball fracture at or above the surface
of the solder mask within the bulk solder material.
Type B:
Quasi-Ductile
B – Quasi-Ductile: Mixed ductile/brittle fracture with the
dominant failure mode (>50% area) being ductile.
Type A:
Pad Li
Or
Type B:
Pad Crater
A – Pad Li: Solder pad lis with solder ball.
B – Pad Crater: Lied pad includes ruptured
base material.
Non-wet
Solder ball lis from pad and any portion of the pad
top-surface plating is exposed.
Type A:
Brittle
A – Brittle: The break is at the solder/intermetallic
interface or intermetallic/base metal interface.
Type B:
Quasi-Brittle
B – Quasi-Brittle: Mixed brittle/ductile fracture with the
dominant failure mode (>50% area) being brittle.
Ball Extrusion
Solder ball is stretched but not fractured. Invalid failure
– repeat test with replacement solder ball samples aer
appropriate adjustments.
Bond Test Failure Modes
Solder Ball Shear Testing Solder Ball Pull Testing
Failure Mode Description Illustration
Ductile
Solder ball fracture at or above the surface of the solder
mask within the bulk solder material.
Pad Li
Solder pad lis with solder ball; lied pad may include
ruptured base material.
Ball Li
Solder ball lis from pad; pad is not completely covered
by solder/intermetallic and the top surface of the pad
plating is exposed.
Interfacial Break
The break is at the solder/intermetallic interface or
intermetallic/base metal interface. The interfacial
fracture may extend across the entire pad or be the
dominant failure mode at the tool contact region.
Ductile
(pad fracture
surface view)
Quasi-Ductile
(pad fracture
surface view)
Pad CraterPad Li
Brittle
(pad fracture
surface view)
Quasi-Brittle
(pad fracture
surface view)
Lied pad includes
ruptured base material
or
or
Pad separation at base
material
Dominant failure mode at tool
contact is interfacial fracture
100% interfacial
fracture
Specifications subject to change without prior notice.
Copyright © Nordson 2022. Other products and compa-
ny names mentioned are trademarks or trade names of
their respective companies.
Nordson products are patent protected and covered by
the patent listed at www.nordson.com.
BR-BT-281122-V5
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For more information, speak with your
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