BT Catalogue EN.pdf - 第6页
Nordson- Bond T es ting | 11 10 | Nordson - Bond T es ting Aut oma tion L e adfr ame Solution - 4600-LF W af er Solution - 4600- W High precision aut oma t ed w af er handling with OCR. High precision aut oma t ed leadfr…
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Automation
Test More With Automation Automated Testing - 4600 Series
Maximum repeatability for the most
demanding applications.
Highest complexity
products
Maximum repeatability
and accountability
My interconnects are extremely small and it is
crucial to remove operator influence. The 4600
allows me to test a whole batch at once.
Ultimate precision
For the most complex devices
with a high density of bumps or
very fine pitch wires, automation
is the only way to ensure
maximum test accuracy.
Automation gives you the
precision required to achieve
the highest data integrity, test
aer test.
Small dimensions
High density
Complex product
Fine pitch
Manual 4600
Handler
Wafer / Lead Frame
Test repeatability
Rotary encoders High resolution linear encoders
Data integrity
Operator alignment
Fiducial recognition
alignment
Fiducial recognition +
OCR
Test procedure
Operator control Automatic test
Product safety
Manual
load / unload
Automatic
load / unload
Throughput and ROI
Variable
(operator dependent)
Nordson- Bond Testing | 1110 | Nordson - Bond Testing
Automation
Leadframe Solution - 4600-LF
Wafer Solution - 4600-W
High precision automated wafer
handling with OCR.
High precision automated
leadframe handling with OCR.
My wafers have sensitive fine pitch bumps and it’s
too easy to damage them. 4600-W gives me peace
of mind with zero broken wafers.
My product is flexible and high density, it can
only be handled by a robot. 4600-LF guarantees
more repeatable test results.
Micro-bumps,
micro pillars
50mm - 250mm
wafers
Fine pitch wires
and bumps
25 - 100 mm wide,
100 - 320 mm long strips
Robotic handler
Extreme precision
Robotic handler
Extreme precision
Nordson- Bond Testing | 1312 | Nordson - Bond Testing
Automation
Dedicated Wafer Tester - 4800 Semiconductor Wafer Tester - 4800 INTEGRA
™
High density interconnect
quality control.
Integrated wafer handling that’s
clean room compatible.
I perform fine pitch testing on bumps and pillars
for a range of wafer sizes. The 4800 even handles
my extremely warped wafers.
I test a high volume of wafers and achieve the
highest throughput with the 4800 INTEGRA. It’s
fire and forget so I can be more eicient.
Micro-bumps,
micro pillars
Micro-bumps,
micro pillars
50mm - 300mm
wafers
Island of
automation
Robotic handler
Ultimate precision Extreme precision