BT Catalogue EN.pdf - 第8页

Nordson - Bond T es ting | 15 14 | Nordson - Bond T es ting Find E ver y F ailure Solder Ball Wirebond Pull Wirebond Shear P assiv ation She ar Stud Pull Ribbon Surfac e P ad Ribbon Pull Micro-pillar Shear (b ase) Micro-…

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Automation
Dedicated Wafer Tester - 4800 Semiconductor Wafer Tester - 4800 INTEGRA
™
High density interconnect
quality control.
Integrated wafer handling that’s
clean room compatible.
I perform fine pitch testing on bumps and pillars
for a range of wafer sizes. The 4800 even handles
my extremely warped wafers.
I test a high volume of wafers and achieve the
highest throughput with the 4800 INTEGRA. It’s
fire and forget so I can be more eicient.
Micro-bumps,
micro pillars
Micro-bumps,
micro pillars
50mm - 300mm
wafers
Island of
automation
Robotic handler
Ultimate precision Extreme precision
Nordson - Bond Testing | 1514 | Nordson - Bond Testing
Find Every Failure
Solder Ball
Wirebond Pull
Wirebond Shear
Passivation Shear
Stud Pull
Ribbon
Surface Pad
Ribbon Pull
Micro-pillar Shear (base) Micro-pillar Shear (cap)
Micro-pillar
Cold Bump Pull
Ball Shear
Tab Bond ShearDie Shear
Wirebond
Die
Micro-pillar PullHot Bump Pull
Surface Mount Device Shear
Test Components Advanced Tests
Variable heights and dimensions.
For diicult to grip or small dimensions.
Larger components and higher forces.
Standard Pull Tests
Standard Shear Tests
Tab
Surface Mount Device
Nordson - Bond Testing | 1716 | Nordson - Bond Testing
Failure Mode Description Illustration
Type A:
Ductile
A – Ductile: Solder ball fracture at or above the surface
of the solder mask within the bulk solder material.
Type B:
Quasi-Ductile
B – Quasi-Ductile: Mixed ductile/brittle fracture with the
dominant failure mode (>50% area) being ductile.
Type A:
Pad Li
Or
Type B:
Pad Crater
A – Pad Li: Solder pad lis with solder ball.
B – Pad Crater: Lied pad includes ruptured
base material.
Non-wet
Solder ball lis from pad and any portion of the pad
top-surface plating is exposed.
Type A:
Brittle
A – Brittle: The break is at the solder/intermetallic
interface or intermetallic/base metal interface.
Type B:
Quasi-Brittle
B – Quasi-Brittle: Mixed brittle/ductile fracture with the
dominant failure mode (>50% area) being brittle.
Ball Extrusion
Solder ball is stretched but not fractured. Invalid failure
– repeat test with replacement solder ball samples aer
appropriate adjustments.
Bond Test Failure Modes
Solder Ball Shear Testing Solder Ball Pull Testing
Failure Mode Description Illustration
Ductile
Solder ball fracture at or above the surface of the solder
mask within the bulk solder material.
Pad Li
Solder pad lis with solder ball; lied pad may include
ruptured base material.
Ball Li
Solder ball lis from pad; pad is not completely covered
by solder/intermetallic and the top surface of the pad
plating is exposed.
Interfacial Break
The break is at the solder/intermetallic interface or
intermetallic/base metal interface. The interfacial
fracture may extend across the entire pad or be the
dominant failure mode at the tool contact region.
Ductile
(pad fracture
surface view)
Quasi-Ductile
(pad fracture
surface view)
Pad CraterPad Li
Brittle
(pad fracture
surface view)
Quasi-Brittle
(pad fracture
surface view)
Lied pad includes
ruptured base material
or
or
Pad separation at base
material
Dominant failure mode at tool
contact is interfacial fracture
100% interfacial
fracture