BT Catalogue EN.pdf - 第5页
Nordson- Bond T es ting | 9 8 | Nordson - Bond T es ting Aut oma tion T es t More With Aut omation Aut omat ed T es ting - 4600 Series Maximum repe a t ability for the mos t demanding applica tions. Highest c omple xity …
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Bond Testing
Simple PCBAs
and components
Complex and high
density components
Ergonomic and
easy-to-use
High precision Very high precision
High accuracy
and high flexibility
Fast set-up, easy to learn,
maximum comfort.
Superior accuracy for complex samples
and advanced test types.
Gold Standard Bondtester - STELLAR 4000
Advanced Bondtester - 4000Plus
I spend a lot of time manually testing.
I chose the STELLAR 4000 as it is the most
ergonomic and easy-to-use system.
My samples are complex with a wide variety
of components. The 4000Plus gives me the
accuracy and flexibility I need.
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Automation
Test More With Automation Automated Testing - 4600 Series
Maximum repeatability for the most
demanding applications.
Highest complexity
products
Maximum repeatability
and accountability
My interconnects are extremely small and it is
crucial to remove operator influence. The 4600
allows me to test a whole batch at once.
Ultimate precision
For the most complex devices
with a high density of bumps or
very fine pitch wires, automation
is the only way to ensure
maximum test accuracy.
Automation gives you the
precision required to achieve
the highest data integrity, test
aer test.
Small dimensions
High density
Complex product
Fine pitch
Manual 4600
Handler
Wafer / Lead Frame
Test repeatability
Rotary encoders High resolution linear encoders
Data integrity
Operator alignment
Fiducial recognition
alignment
Fiducial recognition +
OCR
Test procedure
Operator control Automatic test
Product safety
Manual
load / unload
Automatic
load / unload
Throughput and ROI
Variable
(operator dependent)
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Automation
Leadframe Solution - 4600-LF
Wafer Solution - 4600-W
High precision automated wafer
handling with OCR.
High precision automated
leadframe handling with OCR.
My wafers have sensitive fine pitch bumps and it’s
too easy to damage them. 4600-W gives me peace
of mind with zero broken wafers.
My product is flexible and high density, it can
only be handled by a robot. 4600-LF guarantees
more repeatable test results.
Micro-bumps,
micro pillars
50mm - 250mm
wafers
Fine pitch wires
and bumps
25 - 100 mm wide,
100 - 320 mm long strips
Robotic handler
Extreme precision
Robotic handler
Extreme precision