IPC-CC-830B.pdf - 第4页
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IPC-CC-830B
Qualification and
Performance of Electrical
Insulating Compound for
Printed Wiring Assemblies
Developed by the Conformal Coating Task Group (5-33a) of the Cleaning
and Coating Committee (5-30)
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
Supersedes:
IPC-CC-830A with
Amendment 1 - July 1999
IPC-CC-830A - October 1998
IPC-CC-830 - January 1984
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
®
August 9, 2002
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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This Page Intentionally Left Blank
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--```-`-`,,`,,`,`,,`---

Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members
of the Conformal Coating Task Group (5-33a) of the Cleaning and Coating Committee (5-30) are shown below, it is not
possible to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC
extend their gratitude.
Cleaning and Coating
Committee
Conformal Coating
Task Group
Chair
Frank Cala, Ph.D.
Church and Dwight Co. Inc.
Chair
John Waryold
Humiseal Division/Chase Corporation
Conformal Coating Task Group
David C. Adams, Rockwell Collins
Paul Alexander, Shin-Etsu Silicone
Norazmi Alias, UCB Asia Pacific
Sdn Bhd
Patricia J. Amick, Boeing Aircraft &
Missiles
Lloyd Armogan, Rockwell Collins
Kim M. Atkins, Specialized Coating
Services
Richard A. Barnett, Compaq
Computer Corporation
James P. Barlett, Ph.D., P.E., North
Dakota State University
Heather Benedict, Plexus Corporation
Paul A. Berry, P.E., Dow Corning
Corporation
Fred J. Biederman, Convergent
Networks
Gerald Leslie Bogert, Bechtel Plant
Machinery, Inc.
Rex L. Breunsbach, Electronic
Controls Design, Inc.
Alan M. H. Brewing, National
Physical Laboratory
Ronald J. Brock, NSWC-Crane
Rick Carlson, Taiyo America Inc.
Willy Chang, Boeing Phantom Works
Henry G Clausen, Charles Stark
Draper Labs
M. Lee Collier, Electra Polymers &
Chemicals America
David J. Corbett, Defense Supply
Center Columbus
Lawrence N. Crane, Ph.D., Loctite
Dexter
Amelia A. DeBaggis, Honeywell Inc.
William C. Dieffenbacher, BAE
Systems Controls
William E. Donges, Asymtek - A
Nordson Company
David A. Douthit, LoCan, LLC
Jari Drlik, Lockheed Martin Space
Systems
Bernard Ecker, Northrop Grumman
Thomas G. Farrell, Underwriters
Labs Inc.
Joe R. Felty, Raytheon Systems
Company
Larry Fisher, Dexter Electronic
Materials
Neil S. Fox, Sierra Polymer
Company
Pierre Gadoua, CMC Electronics Inc.
Mahendra S. Gandhi, Space Systems/
Loral
Alan L. Gillespie, Boeing Aircraft &
Missiles
Scott D. Glasspoole, Honeywell Inc.
Sharon K. Goudie, Dow Corning
Corporation
Hue T. Green, Lockheed Martin
Space Systems
Michael R. Green Lockheed Marin
Space Systems
David Greenman, Concoat Limited
James Gryga, Rockwell Automation/
Allen-Bradley
James Heaton, Loctite Dexter
David Hill, 3M Company
Phillip E. Hinton, Hinton PWB
Engineering
Bruce Houghton, Celestica Inc.
Christopher Hunt, Ph.D., National
Physical Laboratory
Les Hymes, The Complete
Connection
Bernard Icore, Northrop Grumman
Corporation
Buck Johnson, 3M Company
David H. Johnson, U.S. Air Force
Ted Jones, InSurf
Joseph E. Kane, BAE Systems
Controls
Donald Karp, Trace
Laboratories-Central
William G. Kenyon, Ph.D., Global
Centre for Process Change, Inc.
Daoud Khourma, Parylene
Engineering
Phil Kinner, Concoat Limited
Jeffrey F. Koon, Raytheon Company
Vijay Kumar, Lockheed Martin
Missile & Fire Control
John W. Lampe
Roger H. Landolt, Enthone Inc.
James Lawrence, Humiseal Division/
Chase Corporation
Curtis A. Lustig, Shipley Company,
L.L.C.
James F. Maguire, Intel Corporation
Rene R. Martinez, TRW Electronics
& Technology Division
Brian C. McCrory, Delsen Testing
Laboratories
August 2002 IPC-CC-830B
iii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--```-`-`,,`,,`,`,,`---