IPC-CC-830B.pdf - 第6页
Renee J. Michalkiewicz, T race Laboratories-East James Minadeo, AI T echnologies, Inc. W illiam P . Mor gan, Sandia National Labs Albuquerque John Moylan, Delsen T esting Laboratories Karl B. Mueller , Boeing Aircraft &a…
Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members
of the Conformal Coating Task Group (5-33a) of the Cleaning and Coating Committee (5-30) are shown below, it is not
possible to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC
extend their gratitude.
Cleaning and Coating
Committee
Conformal Coating
Task Group
Chair
Frank Cala, Ph.D.
Church and Dwight Co. Inc.
Chair
John Waryold
Humiseal Division/Chase Corporation
Conformal Coating Task Group
David C. Adams, Rockwell Collins
Paul Alexander, Shin-Etsu Silicone
Norazmi Alias, UCB Asia Pacific
Sdn Bhd
Patricia J. Amick, Boeing Aircraft &
Missiles
Lloyd Armogan, Rockwell Collins
Kim M. Atkins, Specialized Coating
Services
Richard A. Barnett, Compaq
Computer Corporation
James P. Barlett, Ph.D., P.E., North
Dakota State University
Heather Benedict, Plexus Corporation
Paul A. Berry, P.E., Dow Corning
Corporation
Fred J. Biederman, Convergent
Networks
Gerald Leslie Bogert, Bechtel Plant
Machinery, Inc.
Rex L. Breunsbach, Electronic
Controls Design, Inc.
Alan M. H. Brewing, National
Physical Laboratory
Ronald J. Brock, NSWC-Crane
Rick Carlson, Taiyo America Inc.
Willy Chang, Boeing Phantom Works
Henry G Clausen, Charles Stark
Draper Labs
M. Lee Collier, Electra Polymers &
Chemicals America
David J. Corbett, Defense Supply
Center Columbus
Lawrence N. Crane, Ph.D., Loctite
Dexter
Amelia A. DeBaggis, Honeywell Inc.
William C. Dieffenbacher, BAE
Systems Controls
William E. Donges, Asymtek - A
Nordson Company
David A. Douthit, LoCan, LLC
Jari Drlik, Lockheed Martin Space
Systems
Bernard Ecker, Northrop Grumman
Thomas G. Farrell, Underwriters
Labs Inc.
Joe R. Felty, Raytheon Systems
Company
Larry Fisher, Dexter Electronic
Materials
Neil S. Fox, Sierra Polymer
Company
Pierre Gadoua, CMC Electronics Inc.
Mahendra S. Gandhi, Space Systems/
Loral
Alan L. Gillespie, Boeing Aircraft &
Missiles
Scott D. Glasspoole, Honeywell Inc.
Sharon K. Goudie, Dow Corning
Corporation
Hue T. Green, Lockheed Martin
Space Systems
Michael R. Green Lockheed Marin
Space Systems
David Greenman, Concoat Limited
James Gryga, Rockwell Automation/
Allen-Bradley
James Heaton, Loctite Dexter
David Hill, 3M Company
Phillip E. Hinton, Hinton PWB
Engineering
Bruce Houghton, Celestica Inc.
Christopher Hunt, Ph.D., National
Physical Laboratory
Les Hymes, The Complete
Connection
Bernard Icore, Northrop Grumman
Corporation
Buck Johnson, 3M Company
David H. Johnson, U.S. Air Force
Ted Jones, InSurf
Joseph E. Kane, BAE Systems
Controls
Donald Karp, Trace
Laboratories-Central
William G. Kenyon, Ph.D., Global
Centre for Process Change, Inc.
Daoud Khourma, Parylene
Engineering
Phil Kinner, Concoat Limited
Jeffrey F. Koon, Raytheon Company
Vijay Kumar, Lockheed Martin
Missile & Fire Control
John W. Lampe
Roger H. Landolt, Enthone Inc.
James Lawrence, Humiseal Division/
Chase Corporation
Curtis A. Lustig, Shipley Company,
L.L.C.
James F. Maguire, Intel Corporation
Rene R. Martinez, TRW Electronics
& Technology Division
Brian C. McCrory, Delsen Testing
Laboratories
August 2002 IPC-CC-830B
iii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Renee J. Michalkiewicz, Trace
Laboratories-East
James Minadeo, AI Technologies,
Inc.
William P. Morgan, Sandia National
Labs Albuquerque
John Moylan, Delsen Testing
Laboratories
Karl B. Mueller, Boeing Aircraft &
Missiles
Terry L. Munson, CSL Inc.
Graham Naisbitt, Concoat Limited
Robert Netzel, Northrop Grumman
Corporation
Mark Neuber, Shin-Etsu Chemical
Co. Ltd.
Debora L. Obitz, Trace
Laboratories-East
Jan Obrzut, Ph.D., NIST
Nobuhiro Ohta, Shin-Etsu Chemical
Co. Ltd.
Roger A. Olson, Specialty Coating
Systems Inc.
Scott S. Opperhauser, Trace
Laboratories-East
Douglas O. Pauls, Rockwell Collins
Jeffrey Quarberg, Sauer Danfoss
William A. Rasmus, Jr., Northrop
Grumman Space Systems
Alan D. Rice, TRW
Barry Ritchie, Dow Corning
Corporation
Allen J Robarge, Specialty Coating
Systems Inc.
John H. Rohlfing, Delphi Delco
Electronics Systems
Leo Roos, Ph.D., Polyclad Laminates
J. Hugh Russell, Defense Supply
Center Richmond
Joseph C. Salvini, Underwriters
Laboratories Inc.
Henry Sanftleben, Delphi Delco
Electronics Systems
Darrell C. Schneider, Viasystems Inc.
Stanley S. Seelig, Dynaloy, Inc.
Joseph L. Sherfick, NSWC-Crane
Lowell Sherman, Defense Supply
Center Columbus
Hans L. Shin, Pacific Testing
Laboratories, Inc.
John C. Sines, BAE Systems
Controls
John E. Sohn, Ph.D.,
Patrick Sprague, Northrop Grumman
Corporation
Karen A. Tellefsen, Ph.D., Loctite
Corporation
Brian J. Toleno, Ph.D., Loctite
Corporation
William Tran, Shipley Company,
LLC
Laura J. Turbini, Ph.D., University of
Toronto
Paula VanDenberg, Plasma Systems
Crystal E. Vanderpan, Underwriters
Laboratories Inc.
David A. Vaughan
Donald Waddell, Rockwell
Automation
Larry Waksman, Shin-Etsu Silicone
Chris I. Wall, Electra Polymers &
Chemicals Ltd.
Philip W. Wittmer, Delphi Delco
Electronics Systems
Fonda B. Wu, Raytheon Systems
Company
Lamar Young, Specialty Coating
Systems Inc.
Don Youngblood, Honeywell Inc.
IPC-CC-830B August 2002
iv
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--```-`-`,,`,,`,`,,`---
Table of Contents
1 SCOPE ....................................................................... 1
1.1 Scope ...................................................................... 1
1.2 Purpose ................................................................... 1
1.3
Classification ......................................................... 1
1.3.1
Types....................................................................... 1
1.3.2
Classes.................................................................... 1
1.4
Interpretation .......................................................... 1
2 APPLICABLE DOCUMENTS ..................................... 1
2.1
IPC ......................................................................... 1
2.2
Government ........................................................... 2
2.3
American Society for Testing of Materials .......... 2
2.4
Underwriters Laboratories .................................... 2
2.5
ANSI ...................................................................... 2
2.6
ISO ........................................................................ 2
3 REQUIREMENTS ....................................................... 2
3.1
General Requirements ........................................... 2
3.1.1
Terms and Definitions............................................ 2
3.1.2
Conflict ................................................................... 2
3.2
Inspection and Testing Requirements.................... 2
3.2.1
Qualification Inspection and Testing..................... 2
3.2.2 Qualification Retention Inspection
and Testing ............................................................. 2
3.2.3
Quality Conformance Inspection Testing.............. 2
3.2.4
Additional Testing.................................................. 3
3.3
Materials Requirements ........................................ 3
3.3.1
Materials................................................................. 3
3.3.2
Shelf Life................................................................ 3
3.3.3
Cure ........................................................................ 3
3.4
Chemical Requirements ........................................ 3
3.4.1 Fourier Transform Infrared Spectroscopy
Test (FTIR)............................................................. 3
3.5
Physical Requirements .......................................... 4
3.5.1
Viscosity ................................................................. 4
3.5.2
Appearance............................................................. 4
3.5.3
Fluorescence........................................................... 4
3.5.4
Fungus Resistance.................................................. 4
3.5.5
Flexibility................................................................ 4
3.5.6
Flammability........................................................... 4
3.6
Electrical Requirements ........................................ 4
3.6.1
Dielectric Withstanding Voltage (DWV)............... 4
3.7
Environmental Requirements ................................ 4
3.7.1
Moisture and Insulation Resistance....................... 4
3.7.2 Thermal Shock ....................................................... 4
3.7.3 Temperature and Humidity Aging (Hydrolytic
Stability) ................................................................. 4
4 QUALITY ASSURANCE PROVISION ....................... 5
4.1 Responsibility for Inspection................................. 5
4.2 Categories of Inspection ....................................... 5
4.2.1 Qualification Inspection ......................................... 5
4.2.2 Qualification Retention Inspection ........................ 5
4.2.3 Quality Conformance Inspection........................... 5
4.3 Frequency of Inspection ....................................... 5
4.3.1 Qualification Inspection ......................................... 5
4.3.2 Qualification Retention Inspection ........................ 5
4.3.3 Quality Conformance Inspection........................... 5
4.4 Product Change...................................................... 5
4.5 Test Equipment and Inspection Facilities.............. 5
4.5.1 Standard Laboratory Conditions............................ 5
4.5.2 Permissible Temperature Variation in
Environmental Chambers....................................... 6
4.5.3 Reference Conditions............................................. 6
4.6 Inspection Routine.................................................. 6
4.7 Inspection Sampling .............................................. 6
4.7.1 Test Vehicles ......................................................... 6
4.7.2 Sample Size............................................................ 6
4.7.3 Preparation Prior to Coating.................................. 6
4.7.4 Coating.................................................................... 7
4.8 Failures ................................................................... 7
4.9 Inspection Reporting ............................................. 7
4.9.1 Qualification Reporting.......................................... 7
4.9.2 Qualification Retention Reporting......................... 7
4.9.3 Quality Conformance Reporting............................ 7
5 PREPARATION FOR DELIVERY .............................. 7
5.1 Containers............................................................... 7
5.2 Packaging................................................................ 8
5.3 Marking .................................................................. 8
6 NOTES ........................................................................ 8
6.1 Order Data.............................................................. 8
6.2 Formulation Change............................................... 8
6.3
Conditioning........................................................... 8
6.4
Cleanliness.............................................................. 8
6.5
Adhesion................................................................. 8
6.6
Solvent Compatibility ............................................ 8
6.7 Identification of Solvent Sensitive Conformal
Coatings.................................................................. 8
August 2002 IPC-CC-830B
v
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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