1OM-1505-004_w.pdf - 第147页

1OM-1505 4-18 3. Program Change Operation: Chap.4 1002-002 3.13 Paste Kneading Knead solder paste on the stencil using the "Paste Kneading" tab sheet in the "INDIVIDUAL SETUP" window (Operation Sequen…

1OM-1505

3. Program Change Operation: Chap.4

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3.9 Stencil Recognition Test

Perform the stencil recognition test using the "Stencil Recog Test" tab sheet

(Operation Sequence: [MAINT] button in the main menu → [DEVICE CHECK]

button → [Stencil Recog Test] tab).

Reference

Refer to "8.2 Stencil Recognition Test" in "Chapter 2 (Vol. 3)" for details.

3.10 Stencil Recognition

Perform the stencil recognition after the stencil attachment or removal, power

input, system clearance or stencil coordinate change operation.

The stencil recognition operation is performed using the [Stencil Recog] button on

the "Semi-Auto Opn" tab sheet (Operation Sequence: ([PRODUCT CHG.] button

in the main menu → [INDIVIDUAL SET-UP] button → [Semi-Auto Opn] tab),

or the [Stencil Recog] button in the "CTRL" window.

Reference

Refer to "5.1 Semi-Auto Opn" in "Chapter 3 (Vol. 2)" or "2.4 Control Menu" in

"Chapter 2"for details.

3.11 Inaccurate Position Correction

When any positional deviation is found between the stencil opening and PCB

pattern, in the print check before the printing operation, correct the position

visually or using the PEC recognition camera.

This corrected data is reﬂected as parameters for "Printing Correction (Back)" and

"Printing Correction (For.)" in the "Print" tab sheet in the "Pattern Program" edit

window.

The positional deviation between the PCB and the stencil is checked or adjusted

using the "Inaccurate Posn. Correction" tab sheet in the "TEACHING" window

(Operation Sequence: [MAINT] button on the main menu → [TEACHING]

button → [Inaccurate Posn. Correction] tab).

Reference

Refer to "7.1 Inaccurate Position Correction" in "Chapter 3 (Vol. 2)" for details.

3.12 Solder Paste Replenishment

Put the solder paste on the stencil.

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1OM-1505

4-18

3. Program Change Operation: Chap.4

1002-002

3.13 Paste Kneading

Knead solder paste on the stencil using the "Paste Kneading" tab sheet in the

"INDIVIDUAL SETUP" window (Operation Sequence: [PRODUCT CHG.]

button in the main menu → [INDIVIDUAL SETUP] button → [Paste Kneading]

tab).

Note

In the case of well kneaded solder paste, this operation is not required.

Reference

Refer to "5.4 Paste Kneding" in "Chapter 3 (Vol. 2)" for details.

1OM-1505

4. Test Print and Automatic Operation : Chap.4

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4. Test Print and Automatic Operation

4.1 Test Print

Print a PCB in each of backward and forward printing mode, and check the print

result. If any positional deviation is found, correct the parameters for "Printing

Correction (Back)" and "Printing Correction (For.)" in the "Print" tab sheet in the

"Pattern Program" edit window.

Note

The correction of inaccurate position data can be performed using the teaching

operation.

Reference

Refer to "7.1 Inaccurate Posn. Correction" in "Chapter 3 (Vol. 2)" for details.

4.2 Automatic Operation

Display the "Product." window on the touch screen and press the [START] button

on the operation panel to start the PCB production.