Condenso_Series_EN.pdf - 第12页

12 Condenso series CondensoXS smart Safe pr ocess due to injection Depending on the choice of basic model, the CondensoXS smart can be loaded and unloaded manually or automatical - ly . With both models, loading is carri…

Loading Concept

The possibilities of CondensoXC

Handling

Gentle cooling

Front loading with pre-assembled product carriers

The CondensoXC is manually loaded with pre-as-

sembled product carriers from the front on the

operator’s side. In this way, the assemblies can

be easily placed on and removed from the inter-

changeable product carriers. The product carrier

is on a rail system to ensure full access to the

working area. Assemblies up to 500 x 540 mm

(W x L) can be placed on the product carriers.

Gentle cooling processes by convection

After the soldering process, the assembly is

cooled by convection to the required temperature.

After cooling the bulkhead opens automatically

and the product carrier can be completely pulled

out on a rail for easy unloading. In addition, a

water-cooled cooling zone is optionally available

to enhance the cooling capacity.

1. 4.

1. Loading

2. Soldering/Vacuum

3. Cooling

4. Unloading

cooling

gentle

Condenso series

CondensoXS smart

Safe process due to injection

Depending on the choice of basic model, the CondensoXS

smart can be loaded and unloaded manually or automatical-

ly. With both models, loading is carried out with pre-loaded

product carriers that can hold assemblies up to 650 x 650

mm (W x L). In the case of manual loading, the product

carriers are inserted from the side and removed in the same

way. With the automated model, a handling device can be

tted to the infeed for automatic loading. On the operator’s

side, there is also the option to position the assemblies

on the product carrier or remove them from it when it has

already been inserted.

Flexible cooling options, a vacuum and the injection prin-

ciple also ensure reliable processes with this model in a

partially automated production environment with a medi-

um-size production volume.

Manual or alternatively automatic loading

Flexible cooling inside and outside the process chamber (within optional)

Process chamber for a maximum assembly size of 650 x 650 mm

MES and traceability solutions (optional)

Touch user interface

Loading Concept

The possibilities of CondensoXS smart

Cooling

Handling

Flexible cooling process achievable

Various cooling processes can be used, depending on

requirements. The system is equipped with air cooling in

the cooling section as standard. Cooling is also possible

inside the process chamber under liquid either with or

without nitrogen. For particularly large and heavy boards,

water cooling is also recommended for the cooling section.

This allows cooling to take place from the underside, too.

Flexible cooling gradients can thus be achieved.

Loading with product carriers can be carried out manually

or automatically. The basic product carrier is designed for

a max. surface load of 5 kg. Adjustable LP edge supports

(max. 5 kg surface load) and an adjustable centre support

(max. 5 kg surface load) are available as options.

For particularly heavy assemblies, the surface load can be

increased from 5 kg to a maximum of 15 kg as an option.

1. Loading assembled workpiece carier

2. Soldering/Vacuum/Cooling under Liquidus

3. Unloading

4. Unloading workpiece carrier

5. Manual loading / unloading of single PCB's