Condenso_Series_EN.pdf - 第14页

14 Condenso series CondensoXM smart Inline system for automated pr ocesses The CondensoXM smart can be integrated into any produc - tion environment. Y ou can install the system as an island solution for several producti…

Loading Concept

The possibilities of CondensoXS smart

Cooling

Handling

Flexible cooling process achievable

Various cooling processes can be used, depending on

requirements. The system is equipped with air cooling in

the cooling section as standard. Cooling is also possible

inside the process chamber under liquid either with or

without nitrogen. For particularly large and heavy boards,

water cooling is also recommended for the cooling section.

This allows cooling to take place from the underside, too.

Flexible cooling gradients can thus be achieved.

Loading with product carriers can be carried out manually

or automatically. The basic product carrier is designed for

a max. surface load of 5 kg. Adjustable LP edge supports

(max. 5 kg surface load) and an adjustable centre support

(max. 5 kg surface load) are available as options.

For particularly heavy assemblies, the surface load can be

increased from 5 kg to a maximum of 15 kg as an option.

1. Loading assembled workpiece carier

2. Soldering/Vacuum/Cooling under Liquidus

3. Unloading

4. Unloading workpiece carrier

5. Manual loading / unloading of single PCB's

Condenso series

CondensoXM smart

Inline system for automated processes

The CondensoXM smart can be integrated into any produc-

tion environment. You can install the system as an island

solution for several production areas and load it manually.

Alternatively, upstream handling systems can be used to

automate loading. This reduces cycle times and ensures the

optimal soldering results even with larger volumes.

Flexible cooling options inside and outside the process

chamber – with and without nitrogen – guarantee optimal

cooling rates and the correct temperature for downstream

production processes such as x-ray inspection or function-

al testing. Virtually void-free soldering results can also be

achieved with the vacuum option.

During the process a visual inspection is possible

Manual, alternatively automated loading and unloading of pre-assemled product carriers

Process chamber for a maximum assembly size of 650 x 650 mm

Prozess Galden

injection and ltering in a closed loop

Loading Concept

The possibilities of CondensoXM smart

Vacuum pump

Software

The CondensoXM smart can be equipped with an additional

vacuum pump. This increases reliability, which is necessary

in particular for critical assemblies which make increased

demands on the vacuum process. Moreover, two vacuum

pumps can be used to reduce the cycle time and thus in-

crease productivity for vacuum applications under 10 mbar

in particular.

The option of a second vacuum pump is also available

with the CondensoXS smart, CondensoXS smartline and

CondensoX Line models.

With ViCON Condenso, Rehm offers a clear software pack-

age for the Condenso series that is intuitive to use with

its touchscreen interface. All messages, commands and

parameters are visible at a glance on the main screen with

its machine view. Simple proling with clearly structured

process stages is therefore possible – with or without the

vacuum option. With numerous other features, such as a

favourites bar that can be set up as required, structured

grouping of parameters and individual process monitoring

and documentation, ViCON offers you optimal support for

your manufacturing processes.

1. Loading assembled workpiece carier

2. Soldering/Vacuum/Cooling under Liquidus

3. Unloading

4. Unloading workpiece carrier

5. Manual loading / unloading of single PCB's