Condenso_Series_EN.pdf - 第9页
9 Condenso vacuum technology is used in a wide range of processes. Oxidation is reduced for drying and adhesive processes, and soldered joint reliability is increased during reow soldering by reducing voids. Condenso va…
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Void-free (cavity-free) soldering with unleaded
solders is an important requirement for man-
ufacturing power electronics. However, lower
void rates can only be achieved with soldering
processes where the molten solder is subjected
to a vacuum.
The residues that remain in the soldered joint can
escape more easily due to the vacuum. The Con-
denso series can be tted with a vacuum pump
as an option for this reason. You end up with
soldered joints with a surface binding proportion
of up to 99 %. Vacuum can also be drawn during
the melt phase, even before the actual solder-
ing process. This doesn’t just allow the Galden
®
steam to be evenly distributed in the process area,
but also enables the solvent and moisture to be
de-gassed from the solder paste. In addition, the
atmosphere can also be varied in the process
chamber throughout the whole dwell time as well
the temperature.
Why vacuum?
Reliable, reproducible soldered joints
Tliq
t
T
Pressure
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Condenso vacuum technology is used in a wide range of processes. Oxidation is reduced
for drying and adhesive processes, and soldered joint reliability is increased during
reow soldering by reducing voids.
Condenso vacuum technology
for void-free results
›
Pre-vacuum:
- Prevention of oxidation, drying (solder paste, adhesives)
- Homogeneous Galden-gas-distribution (3-dimensional soldering)
- Micro wave plasma (pre-cleaning)
›
Vacuum during reow soldering: Improved wetting
›
Vacuum after reow soldering: Avoiding voids
Surface contacts
up to 99 %
Improved lling of
micro vias and
THD-solder joints
Minimum of voids
(particularly important on
power electronics)
Improved
wetting
With VacuumWithout Vacuum
Condenso series | Vacuum
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Condenso series
CondensoXC
Optimal results with the smallest footprint
The CondensoXC is a space-saving, powerful system for
laboratory applications, small series production and proto-
typing. Exact proling by means of the injection principle and
the option of soldering under an inert atmosphere provides
the optimal soldering results. Void-free soldering can also be
carried out easily with the vacuum option, which increases
the reliability of assemblies signicantly.
With a footprint of just 2.3 m², this system is specially de-
signed for small series and is also ideal for prototype produc-
tion. As a batch system, it can be used flexibly, irrespective of
the production environment.
Stable process for reliable results
Process chamber for a maximum assembly size of 500 x 540 mm (W x L)
Camera for process observation (optional)
Patentierted injektion prinziple
Vacuum process (optional)