Condenso_Series_EN.pdf - 第13页

13 Loading Concept The possibilities of CondensoXS smar t Cooling Handling Flexible cooling process achievable Various cooling pr ocesses can be used, depending on requirements. The system is equipped with air cooling in…

Condenso series

CondensoXS smart

Safe process due to injection

Depending on the choice of basic model, the CondensoXS

smart can be loaded and unloaded manually or automatical-

ly. With both models, loading is carried out with pre-loaded

product carriers that can hold assemblies up to 650 x 650

mm (W x L). In the case of manual loading, the product

carriers are inserted from the side and removed in the same

way. With the automated model, a handling device can be

tted to the infeed for automatic loading. On the operator’s

side, there is also the option to position the assemblies

on the product carrier or remove them from it when it has

already been inserted.

Flexible cooling options, a vacuum and the injection prin-

ciple also ensure reliable processes with this model in a

partially automated production environment with a medi-

um-size production volume.

Manual or alternatively automatic loading

Flexible cooling inside and outside the process chamber (within optional)

Process chamber for a maximum assembly size of 650 x 650 mm

MES and traceability solutions (optional)

Touch user interface

Loading Concept

The possibilities of CondensoXS smart

Cooling

Handling

Flexible cooling process achievable

Various cooling processes can be used, depending on

requirements. The system is equipped with air cooling in

the cooling section as standard. Cooling is also possible

inside the process chamber under liquid either with or

without nitrogen. For particularly large and heavy boards,

water cooling is also recommended for the cooling section.

This allows cooling to take place from the underside, too.

Flexible cooling gradients can thus be achieved.

Loading with product carriers can be carried out manually

or automatically. The basic product carrier is designed for

a max. surface load of 5 kg. Adjustable LP edge supports

(max. 5 kg surface load) and an adjustable centre support

(max. 5 kg surface load) are available as options.

For particularly heavy assemblies, the surface load can be

increased from 5 kg to a maximum of 15 kg as an option.

1. Loading assembled workpiece carier

2. Soldering/Vacuum/Cooling under Liquidus

3. Unloading

4. Unloading workpiece carrier

5. Manual loading / unloading of single PCB's

Condenso series

CondensoXM smart

Inline system for automated processes

The CondensoXM smart can be integrated into any produc-

tion environment. You can install the system as an island

solution for several production areas and load it manually.

Alternatively, upstream handling systems can be used to

automate loading. This reduces cycle times and ensures the

optimal soldering results even with larger volumes.

Flexible cooling options inside and outside the process

chamber – with and without nitrogen – guarantee optimal

cooling rates and the correct temperature for downstream

production processes such as x-ray inspection or function-

al testing. Virtually void-free soldering results can also be

achieved with the vacuum option.

During the process a visual inspection is possible

Manual, alternatively automated loading and unloading of pre-assemled product carriers

Process chamber for a maximum assembly size of 650 x 650 mm

Prozess Galden

injection and ltering in a closed loop