Condenso_Series_EN.pdf - 第17页

17 Loading Concept The possibilities of Condenso smar tline Automatic Loading Internal carrier return transport The Condenso smartline works with a pusher for loading the product carriers already in the system. The assem…

Condenso series

Condenso smartline

Ideal for series production of power electronics

The Condenso smartline is designed for a production envi-

ronment that requires a fully automated inline connection.

Loading is carried out directly from the feed conveyor in front

of the system. The soldering process takes place in the pro-

cess chamber, which can be flooded with nitrogen. If cooling

under liquid is required, this can be integrated into the

process chamber as an option. After the soldering process,

the product carrier is moved into the cooling zone and the

assemblies are cooled down to the optimal temperature.

The assemblies are then removed automatically onto a

downstream conveyor belt. The empty product carrier is

moved back to the loading area in the system. With the

advantages of the inline condensation soldering process, a

high throughput and the integrated product carrier return, the

Condenso smartline meets the highest demands of series

production in power electronics.

Inline system with integrated goods carrier return transport

Fast product change possible

Traceability and MES connection

Inert process atmosphere during the soldering process

No Galden

carryover, active Galden

ltering

Loading Concept

The possibilities of Condenso smartline

Automatic Loading

Internal carrier return transport

The Condenso smartline works with a pusher for loading

the product carriers already in the system. The assemblies

are pushed from a feed conveyor onto the product carrier.

The product carrier can be equipped with a centre support

for each track. A maximum of 6 tracks are possible on each

product carrier. The max. assembly size is 650 x 650 mm.

Unloading of the product carriers is also carried out with

the pusher, which moves them onto the downstream con-

veyor belt.

The product carriers in the Condenso smartline are moved

internally from the unloading area back to the loading area.

As a result, no additional magazine modules or external

product carrier systems are required in the area around the

system. This saves space and also reduces the amount of

contamination of the product carriers thanks to the closed

loop system, thereby ensuring that little servicing work is

required and downtimes are reduced.

1. Loading

2. Inlet area

3. Soldering/Vacuum

4. Cooling

5. Unloading

Condenso series

CondensoX-Line

Reliable and repeatable

The CondensoX-Line enables vacuum condensation solde-

ring processes to be easily integrated into standard SMD

lines. This allows void-free solder joints to be manufactured

in a completely inert process environment (<100ppm O2),

whether they are standard modules with BGA devices or DCB

substrates for power electronics.

By building a 3-chamber system, low cycle times can be

achieved for inert soldering processes. The nal gas-tight

cooling chamber provides for controlled and rapid cooling

of the assemblies by means of adjustable convection with

less than 100 ppm residual oxygen in the atmosphere. The

CondensoX-Line meets the highest demands of mass pro-

duction in the power electronics.

Ideal for the processing of massive assemblies (IGBT, Heatsinks)

Reliable condensation soldering process for SMD manufacturing in a continuous process

Horizontal transport of the modules of the entire process

Inert process atmosphere during the entire soldering process

Cooling section can be used with <100ppm residual oxygen

Void-free soldering with the use of vacuum for best results