KE-3010_SPE_EN.pdf - 第5页
7. Con trol Sys tem ............................................................................................................................... 68 7.1. Contr ol .......................................................…
5.2.10. Applicability to long PWB (factory-set option) ....................................................... 33
5.2.11. Solder recognition lighting (factory-set option) ...................................................... 33
5.2.12. Residual number-of-components control function (option) ................................... 33
5.2.13. Auto PWB width adjusting function
(Automatic Board Adjustment/AWC factory-set option) ...................................... 33
5.2.14. Coplanarity (Factory-Set Option) .......................................................................... 34
5.2.15. Offset Placement After Solder Screen-printing (Factory-Set Option) ................... 35
5.2.16. Fluxer (Factory-Set Option) ................................................................................... 36
5.2.17. Electrical Leakage Breaker (Factory-Set Option) ................................................. 36
5.2.18. Ionizer (Factory-Set Option) .................................................................................. 37
5.2.19. IC Collection Belt (Option) ..................................................................................... 37
5.2.20. Handheld Operating Device (HOD: Factory-set option) ....................................... 37
5.2.21. Tape Cutter Unit (Option for the electric type of bank) ......................................... 37
5.2.22. Automatic Tape Cutter (Option) ............................................................................ 37
5.2.23. Connector Bracket (Option for the Fixed Bank) .................................................... 37
5.2.24. Flexible Calibration System, The adjustment jig (FCS is an option.) .................... 37
5.2.25. Placement Monitor (Factory-Set Option)............................................................... 38
5.2.26. Rotary-type Solder Device (Factory-Set Option) .................................................. 41
5.2.27. Multi-code Reader / Bottom view type Multi-code Reader
(Factory-Set Option) ............................................................................................ 42
5.2.28. Software to support production (Option) ............................................................... 42
6. Component supply unit................................................................................................................... 44
6.1. List of Feeder Bank Specifications ....................................................................................... 44
6.2. Maximum Number of Feeders Available on a Mounter ....................................................... 45
6.3. Tape Feeder ......................................................................................................................... 47
6.3.1. Tape feeder for mechanical bank ............................................................................ 47
6.3.2. Tape feeder for electric bank ................................................................................... 52
6.3.3. Feeder calibration jig ............................................................................................... 54
6.3.4. Feeder setup stand .................................................................................................. 55
6.3.5. Electric Trolley Power Station ................................................................................. 56
6.4. Stick Feeder ......................................................................................................................... 57
6.5. Stack Stick Feeder (for a mechanical bank) ........................................................................ 59
6.6. Tray Holder ........................................................................................................................... 60
6.7. TR Series .............................................................................................................................. 61
6.7.1. Overview .................................................................................................................. 61
6.7.2. Correspondence table for the TR series ................................................................. 62
6.7.3. Specifications .......................................................................................................... 62
6.7.4. Options .................................................................................................................... 65
6.8. Multi-die server ..................................................................................................................... 66
6.8.1. Overview .................................................................................................................. 66
6.8.2. Basic Specifications ................................................................................................. 66
6.8.3. Facility Specification ................................................................................................ 67
6.8.4. External dimensions ................................................................................................ 67
6.8.5. Options .................................................................................................................... 67
7. Control System ............................................................................................................................... 68
7.1. Control .................................................................................................................................. 68
7.1.1. Saving a program .................................................................................................... 68
7.1.2. Limit of a production program.................................................................................. 68
7.2. Production Mode .................................................................................................................. 68
8. Other Specifications ....................................................................................................................... 69
8.1. Electrical interfaces .............................................................................................................. 69
8.1.1. Kinds and meanings of electrical signals ................................................................ 69
8.2. Specifications for connections between the front and rear devices..................................... 69
8.2.1. Specifications of the connecting cable .................................................................... 70
8.3. Data interface ....................................................................................................................... 70
8.4. Utility connections................................................................................................................. 70
9. Safety specifications ....................................................................................................................... 71
9.1. Standards specifications ...................................................................................................... 71
9.2. Specifications for the CE Marking (for EN Machine) ........................................................... 71
10. Reliability specifications ............................................................................................................... 72
10.1. Lifetime of devices .............................................................................................................. 72
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1.
Introduction
1.1. General
KE-3010/3020V/3020VR, which inherit the flexibility in performance under the modular
concepts that have been built up so far in order to keep a key position of the future flexible
modular line, are general-purpose mounters with a multiple-head in an one-by-one system
that further improves the safety, reliability, maintainability and economy.
KE-3010/3020V/3020VR, having a good affinity for high-speed modular mounter FX-3R, can
construct the line that operates stably attaching electric feeders. Moreover,
KE-3010/3020V/3020VR can also use the component supply unit (tape, stick, or bulk feeders)
and production program used in the existing KE series. This permits a reduction of
installation cost and a smooth startup of the system. *1
KE-3010/3020V/3020VR is provided with an S-VCS function (option for a KE-3010) that
permits vision recognition continuously at a high speed, so that the tact has been improved
about 61% as compared with our existing machine model KE-3020/3020R (JUKI specified IC
Components).
Additionally, combination of this machine and floor productivity operating system to be used
with the JUKI mounters and dispensers, allow you to manage the productions not only per line
but also per floor. The IS manages and optimizes the information and jobs for a whole
manufacturing floor comprehensively to provide you improved productivity, better
manufacturing quality, and cost reduction. *2
*1. For details of compatibility of the bank, feeder, etc. with the former machine, refer to
“Chapter 6 Component Supply Unit.”
*2. For the detailed functions of floor productivity operating system, refer to the functional
specification of each system.
1.2. Model variations
KE-3010: This model uses a multi-laser-head LNC60 sensor to place components from
small chip components to □33.5mm components at high speed thanks to its
laser recognition capability. When you attach an optional MNVC on this model,
image of components whose sizes are described above can be recognized.
This drastically improves the component placement cycle time of these
components, which are to be recognized with a VCS.
KE-3020V: This model is equipped with an MNVC as a standard device as well as a
multi-laser-head. This model can use its IC head to recognize image of IC
components such as large QFP and BGA components to place them on boards
also.
KE-3020VR: This model has the same features as a KE-3020V, and uses an FMLA as an IC
head to recognize various components from a small chip to □33.5mm
components with laser to place them on boards. Moreover, it uses the
multi-laser-head and the IC head to pick components at the same time to place
them on boards at the higher speed.
* For a table of recognition units, refer to “Chapter 4 Specifications.”