KE-3010_SPE_EN.pdf - 第7页
- 2 - 2. Featu res High Precision and High Speed Placement of Components ① High - speed placement is avai lable th ank s t o t he laser alignment sensor (LN C60) that can recognize six nozzles simultaneously . ② KE - 301…
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1.
Introduction
1.1. General
KE-3010/3020V/3020VR, which inherit the flexibility in performance under the modular
concepts that have been built up so far in order to keep a key position of the future flexible
modular line, are general-purpose mounters with a multiple-head in an one-by-one system
that further improves the safety, reliability, maintainability and economy.
KE-3010/3020V/3020VR, having a good affinity for high-speed modular mounter FX-3R, can
construct the line that operates stably attaching electric feeders. Moreover,
KE-3010/3020V/3020VR can also use the component supply unit (tape, stick, or bulk feeders)
and production program used in the existing KE series. This permits a reduction of
installation cost and a smooth startup of the system. *1
KE-3010/3020V/3020VR is provided with an S-VCS function (option for a KE-3010) that
permits vision recognition continuously at a high speed, so that the tact has been improved
about 61% as compared with our existing machine model KE-3020/3020R (JUKI specified IC
Components).
Additionally, combination of this machine and floor productivity operating system to be used
with the JUKI mounters and dispensers, allow you to manage the productions not only per line
but also per floor. The IS manages and optimizes the information and jobs for a whole
manufacturing floor comprehensively to provide you improved productivity, better
manufacturing quality, and cost reduction. *2
*1. For details of compatibility of the bank, feeder, etc. with the former machine, refer to
“Chapter 6 Component Supply Unit.”
*2. For the detailed functions of floor productivity operating system, refer to the functional
specification of each system.
1.2. Model variations
KE-3010: This model uses a multi-laser-head LNC60 sensor to place components from
small chip components to □33.5mm components at high speed thanks to its
laser recognition capability. When you attach an optional MNVC on this model,
image of components whose sizes are described above can be recognized.
This drastically improves the component placement cycle time of these
components, which are to be recognized with a VCS.
KE-3020V: This model is equipped with an MNVC as a standard device as well as a
multi-laser-head. This model can use its IC head to recognize image of IC
components such as large QFP and BGA components to place them on boards
also.
KE-3020VR: This model has the same features as a KE-3020V, and uses an FMLA as an IC
head to recognize various components from a small chip to □33.5mm
components with laser to place them on boards. Moreover, it uses the
multi-laser-head and the IC head to pick components at the same time to place
them on boards at the higher speed.
* For a table of recognition units, refer to “Chapter 4 Specifications.”
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2.
Features
High Precision and High Speed Placement of Components
① High-speed placement is available thanks to the laser alignment sensor (LNC60) that can
recognize six nozzles simultaneously.
② KE-3010 consists of six nozzles of LNC60 head, KE-3020V consists of six nozzles of
LNC60 head + 7 nozzles of IC head (CDS), and KE-3020VR consists of 6 nozzles of LNC
head + seven nozzles of IC head (FMLA) that permits laser recognition.
③ The independent AC servomotor is used to move up/down (Z axis) or rotate (theta axis)
each nozzle: this feature enables high-speed and high precision placement of
components regardless of the used placement pattern.
④ This machine adopts an SVC function, namely, a new vision recognition system that
permits vision recognition continuously at a high speed, so that the vision recognition tact
has been improved.
⑤ The Flexible Calibration System (FCS), which allows a mounter itself to recognize a
component placement position error and correct it, can maintain the component
placement accuracy that is realized at the factory or control the component placement
accuracy after the line configuration is changed. (Option)
Effective tact
① Automatic tool change unit (ATC) allows nozzles to be replaced at the same time.
② A stepping motor is used for the transport motor of the IN/OUT buffer. This permits
exerting independent speed control.
Operation rate
① With a non-stop operation function adopted, components can be supplied without
stopping the mounter by automatically switching over to the pickup of the rear side even if
“no-components” occurs on the front side. (Option)
② As a tray component supplying device, a dual-tray server (DTS: TR1SNR/EB), a matrix
tray server (MTS: TR5SNX/5DNX) and/or a matrix tray changer (MTC: TR6SNV/6SXLX,
TR6DNV/6DXLX) can be attached on this machine. A high-speed matrix tray server
(MTS: TR7DN) supplies components from the left and right tray stackers that use a new
independent driving system to shorten the time required for switching trays according to
the component pick-up position. As a result, the availability ratio for supplying tray
components is improved.
③ The time required for changeover is shortened and the number of component pick-up
errors is reduced thanks to the automatic teaching function of a component (supplied with
a paper tape whose component type is from 0402 to 3216) pick-up position.
④ The HMS equipped as the standard device allows you to check the component pick-up
height and to perform a teaching operation easily to prevent the operation rate from being
lowered by a component pick-up error.
Low Frequency of Failure Occurrence / Low Component Lost Rate
① Since the laser unit continues monitoring the component pick-up condition until just before
a component is placed on a board, it allows you to check whether a component drops or
not.
② The function of self-calibrating the timing of releasing the vacuum pressure prevented the
components at a placement moment from being brought back.
③ The support table that holds a PWB during the production is driven by motor so that the
PWB is unclamped without being vibrated, which means that the placed components are
not shifted. The time of clamping and unclamping the PWB has been reduced as well.
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④ When you select the high-density component placement function (Pick-up Position
Preference mode), the mounter can pick up the center of a component correctly to
prevent the tip of a nozzle from being in contact with the adjacent component when
components are already placed in the limited area.
⑤ A high-resolution (260,000 pulses/rotation) AC servomotor, although it is very small: □ 15
mm, is attached on all theta axes to improve the component placement accuracy.
⑥ Use of a vacuum pump greatly improves the stability of air supply available when the
machine picks up a component.
⑦ By attaching an ionizer to the ceiling of the machine, the ion in the machine is well
balanced and static electricity in PWBs or SMT components is removed at high speed.
⑧ A stable pick-up is achieved by improving a pick-up position accuracy with an automatic
pick-up position correction function for electric tape feeders.
⑨ For components fed by a shuttle of a matrix tray changer (MTC), such defective
components as crocked legs and the like can also be collected automatically into the
original trays
⑩ As process of component measurement operation performed while Component data is
being created, components are returned to the feeder from which they were picked up
after measurement.
⑪ The production management system is provided which performs “prevention of a
component placement error” that prevents a component from being placed at a wrong
position due to a feeder-setting mistake, quality control operation such as the “traceability”
function, “improvement of the workability of preparations,” and “management of the
number of remaining components.”
Machine stability at installation
① A “Super Foot,” which is not easily affected by the floor condition, is provided as an
option.
Versatility
① Regarding the VCS lighting to be used for component recognition, the type (axial falling,
side, downward, or transmission) and the wavelength (color) can be switched. Fine
lighting control can also be exerted. Accordingly, the recognizing capacity of QFP, BGA,
and FBGA and the applicability to odd-shape components have been improved. The
operator can select lighting matched to each component.
② A high-resolution camera can be added thereto as an option, in addition to a standard
component recognition camera (maximum component size = is 50 mm×150 mm or □74
mm).
③ As a lighting unit that permits light quantity adjustment under software control is used,
resulted in enhancing both recognizing the marks on the flexible PWBs and the same via
the pattern matching function. The function of recognizing the area marks also made it
possible to place a multiple number of components upon a set of mark corrections.
④ A bad mark indicating a defective circuit can be detected with an OCC or a dedicated bad
mark reader (option). Moreover, the recognition time can be reduced with "Extension bad
mark" function that can freely set the mark position.
⑤ The components can be picked up and placed under a certain amount of load by adopting
a load calibration stage (load cell) and a load control nozzle. (Option)
⑥ The 3 bank specifications of “Mechanical feeder bank”, “Electric feeder bank”, and
“Mechanical/electric combined feeder bank (for overall change specification only)” are
prepared. The same mechanical feeder or overall change table cart as the existing
machine can be used continuously, and the existing tape feeder, bulk feeder, and stick
feeder can be used.