SOM-1627-002.pdf - 第9页
4. Classification of Component Shapes Component shapes are classified to distinguish each component library data group. The BGA/CSP components are included in the “Area Array” group. BGA: Ball Grid Array CSP: Chip Scale …
3. Rough View
Fig. 1 Light Source Device (TCM-X200)
The
-marked area is specially specified.
Fig. 2 Lighting Unit
The
-marked area shows the lighting (Front Lighting 3 Ring)
for BGA/CSP components.
3. Rough View
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Note
Note
4. Classification of Component Shapes
Component shapes are classified to distinguish each component library
data group.
The BGA/CSP components are included in the “Area Array” group.
BGA: Ball Grid Array
CSP: Chip Scale Package
LGA: Land Grid Array
Table 2
Component Shape Applicable Components (Reference)
BGA/CSP • Grid Array Components
BGA, LGA, CSP, and other similar-
shaped components
Fig. 3
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Note
4. Classification of Component Shapes
5. Component Library Data
5.1 List of Data
5.1.1 List of Common Component Data
The common component data applies to all leadless, leaded and area
array components and is classified into three lists.
Fig. 4
A01 List of Identification Data
Table 3
No. Data Name Reference No. Remarks
1 Component ID A01_01 See “Note” below.
2 Comment A01_02 See “Note” below.
3 Component Shape A01_03
4 Component Type A01_04 See “Note” below.
Refer to the instruction manual “Component Library for TCM-X
Series” for details.
5. Component Library Data
List of Common
Component Data
• Leadless Components
“Cylindrical, Square, Deform
(Simple)”
• Leaded Components
“IC, Connector, Other Leaded”
• Area Array
BGA/CSP”
A01 List of Identification Data
A02 List of Control Data
A03 List of Carrier Data
Note
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