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Case S tud ies P r o v en I n s pecti on a n d Met r ol ogy S ol u t io n s t h a t Im p r o v e Pr oc es s a n d Yie ld Powered b y MRS™ T echnolo gy C ASE STUDIES Sock et Metrology Our customer was using a Coordinat e …

Industry 4.0

Intelligent Self-Learning, Self-Adjusting Zero Defect Line

Smart Factory Solution

CyberOptics oers a range of unique value-add software

solutions that enable automation, reduce rework costs,

minimize scrap and optimize print process.

CyberOptics Software Solutions provides our customers and

partners the best added-value possible for inspection and

measurement in electronics manufacturing.

Save Time, Save Expense and Improve Yields with

CyberOptics’ Powerful Value-Add Solutions

SPI Pre Reow AOI Post Reow AOI

Enables smarter and faster inspection

• Reduce training eorts and minimize operator interaction saving time and cost with the

powerful yet simple software with intuitive multi-touch interface and 3D visualization tools.

• Optimize printing process, establish stencil cleaning cycles and ne-tune printer set-up.

• Gain the power to do more with SPI results with closed loop feedback.

• Improve the solderability of smaller components by using the printing oset data for

compensating parts placement with forward capability.

Automatically optimizes the print process by proactively analyzing

current trend data.

• Improve yields and reduce downtime with its predictive process improvement capability.

• Get started quickly with pre-dened templates

• Customize with customizable rules for specic product needs.

Enables smarter and faster inspection

• Ultra-fast programming capabilities, auto tuning and enhancements that signicantly

speed setup, simplify the process, reduce training eorts and minimize operator

interaction.

• Speed programming and performance with AI (Autonomous Image Interpretation)

technology for set-up in <13 minutes with a data-rich, pre-loaded library and

automated scripts that collect and update models all on their own.

A complete Statistical Process Control (SPC), oers full-edged

machine-level to factory-level SPC capability to improves yields

• Attain eective process verication and control with traceability.

• Identify trends and enhance line yields with real-time monitoring tools for historical analysis

and reporting.

• Reduce training with easy-to-set-up intuitive interface that facilitates quick learning.

• Achieve fast parsing and charting speed with the robust and scalable software, while enabling

an extremely compact database size.

Enables smarter and faster coordinate measurement (Add-on)

• Extensive suite of CMM tools for precise measurement of critical features

• Signicantly speed measurements compared to traditional CMM systems, with high accuracy

and repeatability

• Multi-process capable – 3D AOI, 3D AOM, 3D CMM

As members and participants in the IPC-Connected

Factory Initiative and The Hermes Standard, CyberOptics

is committed to advancing machine-to-machine

communication in SMT assembly and maximize line

throughput and traceability in an open protocol.

INDUSTRY 4.0

Packaging SMT

Through Hole

Mobile Phone SMT

Memory SMT

Medical SMT

Automotive SMT - Pins

Application Examples

Expanding Capabilities for Multiple Industries

MRS™ Technology

APPLICATIONS

Mini/ MicroLED Inspection

BGA/ Solder Ball and Bump

Industrial/ Machined Parts

Inspection and Metrology

Capabilities

Component Types Inspected

• Standard SMT (chips, J-lead, gull-wing, BGA, etc.),

through-hole, odd-form, clips, connectors, header pins,

and more

Component Defects

• Missing, polarity, tombstone, billboard, ipped, wrong

part, gross body and lead damage, and more

Solder Joint and Other Defects

• Gold nger contamination, excess solder, insucient

solder, bridging, through-hole pins

3D Measurement Inspection

• Lifted Lead, package coplanarity, polarity dimple and

chamfer identication

Solder Paste Inspection

• Height, area, volume, registration and bridge detection

Coordinate Measurement Capability

• Line / Distance / X,Y / Mid Line, Inter Point / Regression

Shifted, Datum X,Y / LSF X,Y Oset, X,Y Oset / Value

/ Location / List of X,Y Values, Height / Local Height /

Regression / Radius, Coplanarity/ Distance to plane / 2nd

Order tting, Dierence / Absolute / 2sqrt / VC, Max /

Min / Ave / Sigma / Plus / Minus / Multiple

Automated Optical Inspection

Solder Paste Inspection

Coordinate Measurement - Socket Metrology

Semiconductor Applications

Copper Pillar Micro Bumps Flip Chip (c4)

Case Studies

Proven Inspection and Metrology Solutions that

Improve Process and Yield

MRS™ Technology

CASE STUDIES

Socket Metrology

Our customer was using a Coordinate Measurement Machine (CMM) to handle

the intricate measurements required for their socket metrology, semiconductor

jigs and mobile phone sensors. A high-volume manufacturer, they needed a

stable, robust and accurate metrology solution to inspect a variety of parts.

Though highly accurate, the slow speed of their outdated CMM system made

it dicult for this company to keep up with customer demand while meeting

stringent requirements, taking more than 10 hours to inspect 3,000 contact

points. The company’s workaround for the slow measurement speed was

a <5% sampling test requiring a great deal of resources to measure and

verify the correlation.

The CMM system also required intensive training, routine maintenance and

multiple adjustments throughout the inspection period to account for variables. Though there are machines in the market specically

for high-volume manufacturing that have greatly improved the speed of inspection, these machines have a limited eld of view (FOV),

preventing proper inspection of new, larger socket designs. To meet increasing customer demand and standards, the company needed a way

to accelerate inspection without wavering on quality or accuracy.

We worked with our customer to implement the SQ3000 CMM in their backend inspections, accelerating and optimizing production.

This system meets and exceeds expectations for full-coordinate measurements. What once took eight hours with the original CMM, now

takes less than 13 seconds, including all points and CTFs. The precision gantry provides a larger FOV for a more complete view of the

component, allowing our customer to scan a wider range of socket and part sizes.

Coordinate Measurement - Socket Metrology

Rohinni Adopts CyberOptics MRS-Enabled SQ3000 Multi-Function

system for Inspection and Metrology of Rohinni’s Micro LED

Technology

Rohinni needed an inspection and metrology solution for six critical in-line

production process locations including incoming quality inspection of the

exible circuits, solder paste inspection, pre and post reow AOI, coordinate

measurements post placement of the LED die and nal test.

CyberOptics SQ3000 Multi-Function system for Automated Optical Inspection

(AOI), Solder Paste Inspection (SPI) and Coordinate Measurements (CMM) was

extensively evaluated and adopted to address all six production process

locations.

“We are happy to use the SQ3000 in our line solution to inspect various process

steps because of its higher speed, higher resolution and higher accuracy with

the in-line CMM capability,” said Matthew Gerber, CEO, Rohinni. “The unmatched

performance and versatility of the system make it the perfect solution for our

challenging application needs and stringent quality requirements.”

View these Case Studies and others in their entirety at

www.CyberOptics.com

Example of micro/mini LED solutions. Source: Rohinni

Daktronics Considers CyberOptics SQ3000 CMM the Best in the

Industry for Inspection and Metrology

Daktronics needed a high resolution, high accuracy solution for

measuring and inspecting anything from a board size of 150mm

x 150mm with a tolerance of +/- 20m, to a Mini LED pixel with features

(LEDs, solder deposit, PCB features) that are less than 50m. The boards

and LEDs are ultimately integrated into various video displays.

Daktronics sought a solution to replace a manual microscope method in

their metrology lab. Although the microscope system works well for

small parts, it is limited in the size of substrate it can handle and it is not

very automated.

After a full, extensive evaluation to ensure it would meet Daktronics

stringent requirements, the company installed a CyberOptics

SQ3000 CMM (Coordinate Measurement Machine) in their lab testing environment for inspection and metrology. Daktronics considers

the SQ3000 CMM the best in the industry for their application needs based on the high resolution, high accuracy, comprehensive

coordinate measurement software suite, versatility, automation and ease-of-use. It provides the highest quality inspection and

metrology data to meet their commitment to the highest quality standard.

Example of Daktronics video board. Source: Daktronics

Packaging

Our customer experienced increased demand for their PCB boards with 0201

components and needed a way to ramp up and signicantly improve their

inspection process. Due to the intricacies and variations between elements from

a variety of suppliers, manual inspection was not an option. Manual inspection

also prohibited eective tracking of defects and anomalies of the intricate 0201

components. Speed and accuracy in high-volume inspection were very important

to our customer. Defects, when caught, were discovered at the very end of

inspection, forcing signicant manufacturing delays. The customer also struggled

with a high escape rate. To get to mass market quickly, this customer needed an

automated solution that allowed them to catch defects sooner, while reducing

operator costs and overhead. Shine was another factor that posed concerns.

As parts grew shinier, it became more and more dicult to nd a solution that

provided reliable, consistent inspection at their goal rate of 20,000 parts in under 20 seconds.

Implementing the SQ3000 allowed for a versatile solution that is easy to use and provides consistent, accurate results at high speeds. The

sensor, software and system all work together to completely automate the full-line inspection process, with higher mean time between

failures of inspected components — more than 35,000 hours. This solution meets the customer’s production requirement for line cycle time

with repeatability of six micrometers in three sigma for X, Y, Z measurement. The 2D scanning provides inspection coverage for text, rotation,

position, cracked or damaged components, debris and gap measurements, while the advanced 3D scanning technology provides detailed

coplanarity inspection up to eight times faster than competing solutions.

Packaging SMT